Abstract: A semiconductor light-emitting device includes a first LED chip whose emitted light is wavelength-converted by a fluorescent substance layer formed by applying and curing a fluorescent substance material, and a second LED chip whose emitted light is not wavelength-converted by the fluorescent substance layer, wherein the first LED chip and the second LED chip are arranged on a substrate in such a way that a level of an emission layer of the second LED chip is higher than that of a top face of the first LED chip above the substrate.

Abstract: A semiconductor light-emitting element assembly includes: a semiconductor light-emitting element having first and second leads, a semiconductor light-emitting element chip die-bonded to the first lead and wire-bonded to the second lead, a metal body for heat dissipation fixed to the first and second leads via an insulating adhesive layer, and a reflector fixed to the first and second leads and reflecting light from the chip; a wiring board having an opening for receiving the reflector; a heat dissipator disposed on the metal body for heat dissipation; and a fastening part for fastening the heat dissipator and the wiring board, wherein the first and second leads are fixed to the wiring board so that the reflector is received in the opening, and an interval holding part for holding an interval between the heat dissipator and the wiring board.

Abstract: A semiconductor light-emitting device of the present invention includes a first LED chip whose emitted light is wavelength-converted by a fluorescent substance layer formed by applying and curing a fluorescent substance material, and a second LED chip whose emitted light is not wavelength-converted by the fluorescent substance layer, wherein the first LED chip and the second LED chip are arranged on a substrate in such a way that a level of an emission layer of the second LED chip is higher than that of a top face of the first LED chip above the substrate.

Abstract: A semiconductor light-emitting element assembly includes: a semiconductor light-emitting element having first and second leads, a semiconductor light-emitting element chip die-bonded to the first lead and wire-bonded to the second lead, a metal body for heat dissipation fixed to the first and second leads via an insulating adhesive layer, and a reflector fixed to the first and second leads and reflecting light from the chip; a wiring board having an opening for receiving the reflector; a heat dissipator disposed on the metal body for heat dissipation; and a fastening part for fastening the heat dissipator and the wiring board, wherein the first and second leads are fixed to the wiring board so that the reflector is received in the opening, and an interval holding part for holding an interval between the heat dissipator and the wiring board.