Abstract: A polishing cloth used in the chemical mechanical polishing treatment comprises a molded body of (meth)acrylic copolymer having an acid value of 10 to 100 mg KOH/g and a hydroxyl group value of 50 to 150 mg KOH/g.

Abstract: A prepreg having low dielectric constant, low dielectric loss, and high heat cycle resistance. The prepreg includes a sheet-like preform and a resin-impregnated, sheet-like, fiber-reinforced material thermal pressure adhered to the sheet-like preform. The sheet-like preform includes a graft copolymer (a) in which 15 to 40 parts by mass of an aromatic vinyl monomer are grafted to 60 to 85 parts by mass of a random or block copolymer comprising monomer units selected from nonpolar ?-olefin monomers and nonpolar conjugated diene monomers. The resin-impregnated, sheet-like, fiber-reinforced material includes a sheet-like, fiber-reinforced material (b1) and a thermoplastic resin (b2) into which the sheet-like, fiber-reinforced material (b1) is impregnated. The thermoplastic resin (b2) is a random or block copolymer composed of 60 to 90 mass % of a monomer unit, which is selected from nonpolar ?-olefin monomers and nonpolar conjugated diene monomers, and 10 to 40 mass % of an aromatic vinyl monomer unit.

Abstract: A polishing cloth used in the chemical mechanical polishing treatment comprises a molded body of (meth)acrylic copolymer having an acid value of 10 to 100 mg KOH/g and a hydroxyl group value of 50 to 150 mg KOH/g.

Abstract: A prepreg having low dielectric constant, low dielectric loss, and high heat cycle resistance. The prepreg includes a sheet-like preform and a resin-impregnated, sheet-like, fiber-reinforced material thermal pressure adhered to the sheet-like preform. The sheet-like preform includes a graft copolymer (a) in which 15 to 40 parts by mass of an aromatic vinyl monomer are grafted to 60 to 85 parts by mass of a random or block copolymer comprising monomer units selected from nonpolar ?-olefin monomers and nonpolar conjugated diene monomers. The resin-impregnated, sheet-like, fiber-reinforced material includes a sheet-like, fiber-reinforced material (b1) and a thermoplastic resin (b2) into which the sheet-like, fiber-reinforced material (b1) is impregnated. The thermoplastic resin (b2) is a random or block copolymer composed of 60 to 90 mass % of a monomer unit, which is selected from nonpolar ?-olefin monomers and nonpolar conjugated diene monomers, and 10 to 40 mass % of an aromatic vinyl monomer unit.

Abstract: A resin composition suitable for manufacturing an electrical insulative resin film for a printed wiring board is composed of 80 to 99.5 mass % of a first graft copolymer (a) and 0.5 to 20 mass % of a second graft copolymer (b). In the first graft copolymer (a), 15 to 40 parts by mass of an aromatic vinyl monomer are grafted to 60 to 85 parts by mass of a random or block copolymer composed of monomer units selected from nonpolar ?-olefin monomers and nonpolar conjugated diene monomers. In the second graft copolymer (b), 5 to 30 parts by mass of an aromatic vinyl monomer are grafted to 70 to 95 parts by mass of a random or block copolymer composed of 60 to 90 mass % of a monomer unit, which is selected from nonpolar ?-olefin monomers and nonpolar conjugated diene monomers, and 10 to 40 mass % of an aromatic vinyl monomer unit.

Abstract: A polishing cloth used in the chemical mechanical polishing treatment comprises a molded body of (meth)acrylic copolymer having an acid value of 10 to 100 mg KOH/g and a hydroxyl group value of 50 to 150 mg KOH/g.

Abstract: A polishing cloth used in the chemical mechanical polishing treatment comprises a molded body of (meth)acrylic copolymer having an acid value of 10 to 100 mg KOH/g and a hydroxyl group value of 50 to 150 mg KOH/g.

Abstract: The invention has for its object to provide a composite dielectric material having any desired dielectric constant selectable from a relatively wide range in a high-frequency band and a low dielectric loss tangent, and a film, substrate, electronic part or molded or otherwise formed article using the same. To accomplish this object, there is provided a composite dielectric material composition comprising a heat-resistant, low-dielectric polymeric material that is a resin composition comprising one or two or more resins having a weight-average absolute molecular weight of at least 1,000, wherein the sum of carbon atoms and hydrogen atoms in said composition is at least 99%, and some or all resin molecules have a chemical bond therebetween, and a filler. A film, substrate, electronic part or molded or otherwise formed article is obtained using this composition.