Abstract: A dump truck includes a body and a plurality of cameras. The body includes an upper deck and a main frame disposed in a longitudinal direction. The cameras are configured and arranged to obtain images to be combined to generate a bird's-eye image to monitor a periphery of the dump truck. The cameras include a front camera, a rear camera and side cameras. The front camera is disposed at the front of the upper deck to obtain an image of an area in front of the body. The rear camera is disposed at a rear end of the main frame to obtain an image of an area in rear of the body. The side cameras are respectively provided on left and right sides of the upper deck to obtain images of an area between diagonally to the front and diagonally to the rear of the body.

Abstract: A work vehicle surrounding area monitoring device includes an imaging unit, a bird's-eye view image creating unit, a display unit and a traveling state determining unit. When the work vehicle is in the stopped state, the bird's-eye view image creating unit is configured to use a first virtual projection plane to create the bird's-eye view image, and at least an outer edge portion of the first virtual projection plane has a shape that increases in height from the ground surface as a distance from the work vehicle increases. When the work vehicle is in the traveling state, the bird's-eye view image creating unit is configured to use a second virtual projection plane to create the bird's-eye view image, and at least an outer edge portion of the second virtual projection plane has a shape having a uniformly flat height from the ground surface.

Abstract: A periphery monitoring apparatus for a work vehicle is adapted to display an image of surroundings of the work vehicle on a display apparatus. The periphery monitoring apparatus includes a camera and a display control section. The camera is disposed below a vehicle body of the work vehicle, the camera being configured to acquire a camera image of the surroundings of the work vehicle. The display control section is configured to display the camera image acquired using the camera and a vehicle body outer edge line on the display apparatus. The vehicle body outer edge line indicates an outer edges of the vehicle body which is vertically projected on a ground surface in the camera image.

Abstract: A surrounding area monitoring device for a work vehicle includes a first imaging unit, a bird's-eye view image creating unit, and a display unit. The first imaging unit is mounted on the work vehicle and configured and arranged to capture an image of a first region in a surrounding area of the work vehicle to obtain a first image data. The birds-eye view image creating unit is configured to create a bird's-eye view image of the surrounding area of the work vehicle by projecting the first image data on a predetermined virtual projection plane. The display unit is configured and arranged to display the bird's-eye view image. The virtual projection plane includes a shape that increases in height from a ground surface as a distance from the work vehicle decreases.

Abstract: A perimeter monitoring device for a work vehicle is configured to monitor a surrounding of the work vehicle and display a monitored result on a display device. The perimeter monitoring device includes cameras, a bird's-eye image display unit, obstacle detecting sensors, a camera image specifying unit, and a camera image displaying unit. The camera image specifying unit is configured to specify one or more camera images in which one or more of obstacles are captured when the one or more of obstacles are detected by the obstacle detecting sensors. The camera image displaying unit is configured to display a relevant camera image in alignment with the bird's-eye image on the display device when a plurality of camera images are specified by the camera image specifying unit, the relevant camera image being ranked in a high priority ranking based on a priority order set in accordance with travelling states.

Abstract: A periphery monitoring apparatus for a work vehicle includes a plurality of obstacle detection sensors, a warning region setting section and a warning section. The obstacle detection sensors are mounted on the work vehicle, and each of the obstacle detection sensors is configured to determine a relative position of an obstacle with regard to the work vehicle by detecting the obstacle in the surroundings of the work vehicle. The warning region setting section is configured to set a warning region, where it is necessary to warn a driver of a presence of the obstacle, according to a movement state of the work vehicle. The warning section is configured to warn a driver that the relative position of the obstacle is positioned in the warning region.

Abstract: A periphery monitoring device (10) comprises a monitor (50) that displays a bird's-eye image (200) that includes an image of a dump truck (1), a payload meter ECU (21) that detects the load of the dump truck (1), and a controller (20) that switches the size of a cargo image (C1) displayed over the vessel (4) of the dump truck (1) and displays this image on the monitor (50) on the basis of the detection result of the payload meter ECU (21). In a load display device for a dump truck, a plurality of cameras are installed and the load display device monitors the periphery by using a bird's-eye image that combines images obtained by the plurality of cameras. The load display device includes a display component, a detector and a display controller. The display component is configured to display the bird's-eye image including an image of the dump truck. The detector is configured to detect a load of the dump truck.

Abstract: It is possible to inspect scratches and staining on a wafer surface on the basis of an LPD map obtained from a particle counter 11, by providing a means 21 for detecting aggregation of clustered point defects (LPD) from two-dimensional distribution information 30 for such fine LPD on the surface of a silicon wafer, and an improvement in the inspection efficiency and the precision of judgements of “defective” status can be achieved. Furthermore, the system is devised so that the trend of generation of scratches and staining in a specified process can easily be detected by accumulating wafer surface information such as scratch information, staining information and the like for the wafer surface detected by a wafer surface inspection device 11 (especially as image information or numerical information), and superposing sets of information thus accumulated. Plans for improving processes can be made by both the wafer supplier and wafer consumer by sharing such information with both parties.

Abstract: It is possible to inspect scratches and staining on a wafer surface on the basis of an LPD map obtained from a particle counter 11, by providing a means 21 for detecting aggregation of clustered point defects (LPD) from two-dimensional distribution information 30 for such fine LPD on the surface of a silicon wafer, and an improvement in the inspection efficiency and the precision of judgements of “defective” status can be achieved. Furthermore, the system is devised so that the trend of generation of scratches and staining in a specified process can easily be detected by accumulating wafer surface information such as scratch information, staining information and the like for the wafer surface detected by a wafer surface inspection device 11 (especially as image information or numerical information), and superposing sets of information thus accumulated. Plans for improving processes can be made by both the wafer supplier and wafer consumer by sharing such information with both parties.

Abstract: A semiconductor package inspection apparatus which varies the emission spectrum of an oblique imaging illumination and a plan view imaging illumination from each other, and which comprises a first filter which is provided on the optical path from a semiconductor package to an oblique imaging device, and which passes light from the oblique imaging illumination and blocks light from the plan view imaging illumination; a second filter which is provided on the optical path from a semiconductor package to the plan view imaging device, and which passes light from the plan view imaging illumination and blocks light from the oblique imaging illumination; and a control unit which simultaneously turns on the oblique imaging and plan view imaging illumination, and inspects terminals of the semiconductor package based on image data of the oblique imaging device and plan view imaging device.