Abstract: A camera module includes: a lens unit including a casing portion and a lens; and a substrate portion on which an image pick-up element is mounted. The camera module is assembled in combination of the lens unit and the substrate portion in an arrangement in which the lens and the image pick-up element are opposed to each other. The substrate portion includes: a first substrate including one of surfaces on which the image pick-up element is mounted; an infrared filter supported on a light receiving face of the image pick-up element; and a second substrate supported on a surface of the infrared filter which is opposed to the lens. The second substrate includes an opening portion disposed in alignment with the infrared filter so as not to intercept an incident light. A circuit component is mounted on the second substrate.

Abstract: A camera module includes: a lens unit including a casing portion and a lens; and a substrate portion on which an image pick-up element is mounted. The camera module is assembled in combination of the lens unit and the substrate portion in an arrangement in which the lens and the image pick-up element are opposed to each other. The substrate portion includes: a first substrate including one of surfaces on which the image pick-up element is mounted; an infrared filter supported on a light receiving face of the image pick-up element; and a second substrate supported on a surface of the infrared filter which is opposed to the lens. The second substrate includes an opening portion disposed in alignment with the infrared filter so as not to intercept an incident light. A circuit component is mounted on the second substrate.

Abstract: A camera module is provided wherein an image pickup device, a camera optical system and a driver, for aligning and focusing the camera optical system, are mounted on a board; wherein a connection terminal, to be electrically connected to the driver, is formed on a mounting face of the board; and wherein the connection terminal formed on the board is connected to the driver via a flexible wiring board.

Abstract: A camera module is provided wherein an image pickup device, a camera optical system and a driver, for aligning and focusing the camera optical system, are mounted on a board; wherein a connection terminal, to be electrically connected to the driver, is formed on a mounting face of the board; and wherein the connection terminal formed on the board is connected to the driver via a flexible wiring board.

Abstract: In an image pickup module, a substrate, on which an image pickup element is mounted, is mounted-in a-casing portion of a holder, which includes a barrel portion supporting a light receiving lens and also includes the casing portion, by aligning a light receiving surface of the image pickup element with the light receiving lens. The holder is provided with a partitioning wall adapted to partition off a region, on which the image pickup element is mounted, on the substrate from outer regions.