Patents by Inventor Tomio Iino

Tomio Iino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5238387
    Abstract: An apparatus for molding a product of synthetic resin which includes a mold assembly having a die plate and first and second mold dies which define a mold cavity therebetween. The first mold die includes a fixed member fixed to the die plate. At least two movable members are respectively displaceable in perpendicular directions away from each other. Each of the movable members are mounted on the die plate and are further displaced from the fixed member to open the first mold die. A resilient member is provided for perpendicular contacting the movable members and urging the movable members toward the fixed member to assembly the first mold die together.
    Type: Grant
    Filed: January 24, 1992
    Date of Patent: August 24, 1993
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Nozumu Hama, Takaaki Sato, Akihiko Koshiro, Masao Tegawa, Tomio Iino, Seiji Yanagisawa, Nobuo Kikuchi, Kazuo Migishima, Kazumi Ishida
  • Patent number: 5044919
    Abstract: An apparatus for molding a product such as an automotive instrument panel of synthetic resin has a first station including a mechanism for opening and closing a mold assembly, a second station including a mechanism for pouring a resin solution into the mold assembly which is closed, and a third station for hardening the poured resin solution in the mold assembly. A feed mechanism interconnects the first, second, and third stations in a looped configuration for circulating at least three mold assemblies through the first, second, and third stations. The mold assembly includes a first mold die for placing therein a covering sheet of a predetermined shape, a second mold die combinable with the first mold die to define a mold cavity therebetween, and a mechanism for pouring a resin foam solution into the mold cavity to form a molding integral with the covering sheet.
    Type: Grant
    Filed: December 5, 1989
    Date of Patent: September 3, 1991
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Nozomu Hama, Takaaki Sato, Akihiko Koshiro, Masao Tegawa, Tomio Iino, Seiji Yanagisawa, Nobuo Kikuchi, Kazuo Migishima, Kazumi Ishida