Abstract: In the invention, there is provided an apparatus for mounting electronic components in which a plurality of mounting heads pick up electronic components concurrently from a plurality of component feeding units for mounting the electronic components on a print circuit board, with assured pick-up and holding of the electronic components. The component feeding units 3 do not always have an identical pick-up position 10 among all the units 3 used in a mounting operation because of the variation in the manufacturing and the mounting of the units. The shift due to the variation along the direction of feeding, the Y direction, is corrected by moving the position of the nozzle 21 along the Y direction with a controlled rotation of the mounting head 7 around an horizontal axis using the nozzle selection motor 22 for selecting the nozzle 21.

Abstract: In the invention, there is provided an apparatus for mounting electronic components in which a plurality of mounting heads pick up electronic components concurrently from a plurality of component feeding units for mounting the electronic components on a print circuit board, with assured pick-up and holding of the electronic components.