Patents by Inventor Tomio Kondoh

Tomio Kondoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7553598
    Abstract: A carrier contains a core; and a cover layer located overlying the core, wherein the cover layer comprises a binder resin, a first particulate material and a second particulate material, wherein the following relationships are satisfied: 1<(D1/h)<10, and 0.001<(D2/h)<1, wherein D1(?m) represents a volume average particle diameter of the first particulate material, D2(?m) represents a volume average particle diameter of the second particulate material, and h (?m) represents a thickness of the cover layer, and wherein the second particulate material has a volume resistivity of not greater than 1.0×1012 ?·cm.
    Type: Grant
    Filed: March 20, 2006
    Date of Patent: June 30, 2009
    Assignee: Ricoh Company, Limited
    Inventors: Kousuke Suzuki, Tomio Kondoh, Shinichiro Yagi, Hitoshi Iwatsuki
  • Patent number: 7381513
    Abstract: A carrier containing a core material and a resin coating layer located overlying the surface of the core material. The resin coating layer contains resin and electroconductive particles having an oil absorption amount of from 10 to 300 ml/100 g. The electroconductive particle contains a base material particle and an electroconductive coating layer located overlying the surface of the base material particle. The electroconductive coating layer contains an underlayer containing tin dioxide and an upper layer containing indium oxide and tin dioxide, located overlying the underlayer.
    Type: Grant
    Filed: July 27, 2005
    Date of Patent: June 3, 2008
    Assignee: Ricoh Company, Ltd.
    Inventors: Kohsuke Suzuki, Tomio Kondoh, Shinichiro Yagi, Hitoshi Iwatsuki
  • Publication number: 20060210906
    Abstract: A carrier contains a core; and a cover layer located overlying the core, wherein the cover layer comprises a binder resin, a first particulate material and a second particulate material,wherein the following relationships are satisfied: 1<(D1/h)<10, and 0.001<(D2/h)<1, wherein D1 (?m) represents a volume average particle diameter of the first particulate material, D2 (?m) represents a volume average particle diameter of the second particulate material, and h (?m) represents a thickness of the cover layer, and wherein the second particulate material has a volume resistivity of not greater than 1.0×1012 ?·cm.
    Type: Application
    Filed: March 20, 2006
    Publication date: September 21, 2006
    Inventors: Kousuke Suzuki, Tomio Kondoh, Shinichiro Yagi, Hitoshi Iwatsuki
  • Publication number: 20060024606
    Abstract: A carrier containing a core material and a resin coating layer located overlying the surface of the core material. The resin coating layer contains resin and electroconductive particles having an oil absorption amount of from 10 to 300 ml/100 g. The electroconductive particle contains a base material particle and an electroconductive coating layer located overlying the surface of the base material particle. The electroconductive coating layer contains an underlayer containing tin dioxide and an upper layer containing indium oxide and tin dioxide, located overlying the underlayer.
    Type: Application
    Filed: July 27, 2005
    Publication date: February 2, 2006
    Inventors: Kohsuke Suzuki, Tomio Kondoh, Shinichiro Yagi, Hitoshi Iwatsuki