Patents by Inventor Tomio Matsuzaki

Tomio Matsuzaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface-modified metal member and method of modifying metal surface
    Publication number: 20080206520
    Abstract: A surface-modified member including a metal base, a surface modification layer formed on at least a part of a surface of the metal base, the surface modification layer containing a metal hydroxide, and at least one of a curable resin layer, an ink layer and a coating material layer which is provided on at least a portion of the surface modification layer. A method of modifying a surface of a metal member, including applying an energy to at least a part of the surface of the metal member to produce a metal hydroxide on the surface of the metal member.
    Type: Application
    Filed: February 5, 2008
    Publication date: August 28, 2008
    Inventors: Shinichiro Il, Tatsumi Onishi, Kenji Suzuki, Tomio Matsuzaki
  • Wiring structure on semiconductor substrate and method of fabricating the same
    Patent number: 7285867
    Abstract: A semiconductor device includes a semiconductor substrate having a plurality of connecting pads on one surface, an insulating film formed on one surface of the semiconductor substrate. The insulating film has holes each corresponding to one of the connecting pads, and a recess having a bottom surface depressed from the upper surface in the direction of thickness. Interconnections are formed on an upper surface of the insulating film or on the bottom surface of the recess, and connected to the connecting pads through the holes in the insulating film.
    Type: Grant
    Filed: November 3, 2003
    Date of Patent: October 23, 2007
    Assignee: Casio Computer Co., Ltd.
    Inventors: Tomio Matsuzaki, Kazuyoshi Arai
  • Wiring structure on semiconductor substrate and method of fabricating the same
    Publication number: 20040094841
    Abstract: A semiconductor device includes a semiconductor substrate having a plurality of connecting pads on one surface, an insulating film formed on one surface of the semiconductor substrate. The insulating film has holes each corresponding to one of the connecting pads, and a recess having a bottom surface depressed from the upper surface in the direction of thickness. Interconnections are formed on an upper surface of the insulating film or on the bottom surface of the recess, and connected to the connecting pads through the holes in the insulating film.
    Type: Application
    Filed: November 3, 2003
    Publication date: May 20, 2004
    Applicant: Casio Computer Co., Ltd.
    Inventors: Tomio Matsuzaki, Kazuyoshi Arai