Patents by Inventor Tomio Nakagawa

Tomio Nakagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ingot slicing method, an ingot manufacturing method and a sliced ingot grinding apparatus
    Patent number: 6113489
    Abstract: A method of slicing an ingot wherein a pre-cut work 3 in which a holding member 2 extending over the entire length of a side surface of a cylindrical ingot 1 is bonded to the side surface of the ingot 1 is set on a slicing apparatus 4, and the pre-cut work 3 is split into a multiplicity of pieces over its longitudinal direction so as to obtain disk-shaped works 5 to be ground, characterized in that a retaining member 2 is used in which a retaining layer 7 which is directly bonded to the side surface of the ingot 1 by a first adhesive agent having an adhesive strength sufficient to receive a rotating force due to a grinding apparatus 6 in a subsequent grinding process, an intermediate layer 8 which is bonded to said retaining layer 7 in a superposed manner by a second adhesive agent whose adhesive strength deteriorates more than that of the first adhesive agent under a fixed condition, and a supporting layer 11 which is connected to said intermediate layer 8 and is connected to a supporting portion 10 of said
    Type: Grant
    Filed: March 31, 1999
    Date of Patent: September 5, 2000
    Assignee: Nippei Toyama Corporation
    Inventors: Kenichiro Nishi, Tetsuo Okuyama, Mitsuru Nukui, Kazuo Nakajima, Shirou Murai, Toyotaka Wada, Tomio Nakagawa