Patents by Inventor Tomio Nakashima

Tomio Nakashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Foamed resin molding machine and method of operating the same
    Patent number: 8097192
    Abstract: A die opening and closing device for a movable die plate and a fixed die plate includes a toggle link disposed between the movable die plate and a die tightening housing, a cross head for flexing the toggle link, and a motor-driven ball screw penetrating through the die tightening housing and inserted into the cross head, and this die opening and closing device is provided with die thickness adjusting means for adjusting the die thickness S when the die is tightened by extension of the toggle link, and ball screw rotation control means for controlling constant the cracking gap, and a foamed resin molding machine is presented, together with its operating method.
    Type: Grant
    Filed: February 28, 2007
    Date of Patent: January 17, 2012
    Assignee: Daisen Industry Co., Ltd.
    Inventors: Akihiko Tsuda, Tomio Nakashima, Tomohiro Oshima, Taizo Mio
  • Foamed Resin Molding Machine and Method of Operating the Same
    Publication number: 20090026645
    Abstract: A die opening and closing device for a movable die plate and a fixed die plate includes a toggle link disposed between the movable die plate and a die tightening housing, a cross head for flexing the toggle link, and a motor-driven ball screw penetrating through the die tightening housing and inserted into the cross head, and this die opening and closing device is provided with die thickness adjusting means for adjusting the die thickness S when the die is tightened by extension of the toggle link, and ball screw rotation control means for controlling constant the cracking gap, and a foamed resin molding machine is presented, together with its operating method.
    Type: Application
    Filed: February 28, 2007
    Publication date: January 29, 2009
    Applicant: Daisen Industry Co., Ltd.
    Inventors: Akihiko Tsuda, Tomio Nakashima, Tomohiro Oshima, Taizo Mio