Abstract: A novel wiring method for multilayered semiconductor integrated circuits is disclosed. For example, a semiconductor integrated circuit of a 6-layered wiring structure can be formed with a first layer covered with gates, a second layer, a third layer, a fourth layer and a fifth layer making up logic wiring layers, and a sixth layer making up a power layer. Lattice-shaped wires are formed in a longitudinal direction on the second layer and the fourth layer, and in a lateral direction on the third layer and the fifth layer. The second layer forming the bottom layer and the fifth layer forming the uppermost layer, or a combination of the second layer and the fifth layer of a general wiring structure are used as main layers of wires requiring consideration of signal transmission delay time.

Abstract: A striker cooperates and engages with a door lock mechanism of vehicles so as to lock the door. A body of the vehicles has at least two bolt insert apertures at the striker mounting position. A plate member has at least two apertures at the positions corresponding to the positions of the bolt insert apertures. The plate member is provided with nuts welded thereto at the positions of the apertures and at least one weld position which is distanced from the bolt insert apertures and at which position the plate member is welded to the striker mounting position of the vehicle body. The plate member is also provided with at least one deformable portion which connects the weld position to the nut positions of the plate member, so that the striker mount position can be adjusted by the deformation of the deformable portion when the striker is mounted on a vehicle body by means of bolts which are engaged with the nuts.