Patents by Inventor Tomislav J. Stimac

Tomislav J. Stimac has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10340424
    Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: July 2, 2019
    Assignee: GE Lighting Solutions, LLC
    Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
  • Patent number: 10309587
    Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
    Type: Grant
    Filed: May 3, 2013
    Date of Patent: June 4, 2019
    Assignee: GE Lighting Solutions, LLC
    Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac, Stanton Earl Weaver, Jr., Thomas F. Soules
  • Patent number: 10223944
    Abstract: A backlighting system for a cabinet sign may include a plurality of panels. Each panel includes a plurality of light emitting diodes (“LEDs”) attached to the panel. The diode has a box sign depth factor of less than about 1.4. An integrated circuit may also be located on the panel. A wire physically connects adjacent panels.
    Type: Grant
    Filed: February 14, 2014
    Date of Patent: March 5, 2019
    Assignee: GE Lighting Solutions, LLC
    Inventors: Jeffrey Marc Nall, Kevin Carpenter, Koushik Saha, Chenyang Li, Ronald K. Brengartner, Jr., Xin Wang, Tomislav J. Stimac
  • Publication number: 20180080614
    Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
    Type: Application
    Filed: May 3, 2013
    Publication date: March 22, 2018
    Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac, Stanton Earl Weaver, JR., Thomas F. Soules
  • Patent number: 9836999
    Abstract: A backlighting system for a cabinet sign may include a plurality of panels. Each panel includes a plurality of light emitting diodes (“LEDs”) attached to the panel. The diode has a box sign depth factor of less than about 1.4. An integrated circuit may also be located on the panel. A wire physically connects adjacent panels.
    Type: Grant
    Filed: July 14, 2014
    Date of Patent: December 5, 2017
    Assignee: GE Lighting Solutions, LLC
    Inventors: Jeffrey Marc Nall, Kevin Carpenter, Koushik Saha, Chenyang Li, Ronald K. Brengartner, Jr., Xin Wang, Tomislav J. Stimac
  • Patent number: 9564070
    Abstract: A backlighting system for a cabinet sign may include a plurality of panels. Each panel includes a plurality of light emitting diodes (“LEDs”) attached to the panel. The diode has a box sign depth factor of less than about 1.4. An integrated circuit may also be located on the panel. A wire physically connects adjacent panels.
    Type: Grant
    Filed: April 9, 2007
    Date of Patent: February 7, 2017
    Assignee: GE LIGHTING SOLUTIONS, LLC
    Inventors: Jeffrey Marc Nall, Kevin Carpenter, Koushik Saha, Chenyang (Kevin) Li, Ronald K. Brengartner, Jr., Xin (Bill) Wang, Tomislav J. Stimac
  • Publication number: 20150009674
    Abstract: Thermal management techniques and methods for various types of structures that require a thermal property, such as thermal conductivity and/or flame retardance, and have a surface in proximity to a source of thermal energy. Such a structure includes a substrate formed of a metallic material or a thermally conductive plastic material, and a white fluoropolymer layer directly on a surface of the substrate without a discrete adhesive layer therebetween. The white fluoropolymer layer defines an outermost surface of the structure, has a reflectivity of greater than 95%, and has a thickness sufficient to inhibit degradation of the thermal property of the structure resulting from impingement of the surface by the thermal energy.
    Type: Application
    Filed: July 3, 2013
    Publication date: January 8, 2015
    Inventors: Dengke CAI, Thomas CLYNNE, Péter JEZSOVICZKI, Mark Edward KAMINSKI, Elizabeth Anne SKIERSKI, Tomislav J. STIMAC, Christopher Henry WILSON
  • Publication number: 20140328046
    Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
    Type: Application
    Filed: May 3, 2013
    Publication date: November 6, 2014
    Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
  • Publication number: 20140049965
    Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
    Type: Application
    Filed: October 24, 2013
    Publication date: February 20, 2014
    Applicant: GE LIGHTING SOLUTIONS, LLC
    Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
  • Patent number: 8436380
    Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially tills an interior volume defined by the light-transmissive cover and the printed circuit board.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: May 7, 2013
    Assignee: GE Lighting Solutions, LLC
    Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
  • Patent number: 8362695
    Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: January 29, 2013
    Assignee: GE Lighting Solutions, LLC
    Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
  • Publication number: 20110018014
    Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially tills an interior volume defined by the light-transmissive cover and the printed circuit board.
    Type: Application
    Filed: September 17, 2010
    Publication date: January 27, 2011
    Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
  • Publication number: 20110001422
    Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
    Type: Application
    Filed: September 17, 2010
    Publication date: January 6, 2011
    Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
  • Patent number: 7800121
    Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
    Type: Grant
    Filed: December 20, 2005
    Date of Patent: September 21, 2010
    Assignee: Lumination LLC
    Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
  • Publication number: 20080244944
    Abstract: A backlighting system for a cabinet sign may include a plurality of panels. Each panel includes a plurality of light emitting diodes (“LEDs”) attached to the panel. The diode has a box sign depth factor of less than about 1.4. An integrated circuit may also be located on the panel. A wire physically connects adjacent panels.
    Type: Application
    Filed: April 9, 2007
    Publication date: October 9, 2008
    Inventors: Jeffrey Marc Nall, Kevin Carpenter, Koushik Saha, Chenyang (Kevin) Li, Ronald K. Brengartner, Xin (Bill) Wang, Tomislav J. Stimac
  • Patent number: 6945672
    Abstract: A light source (10) includes a light emitting semiconductor device (12). A support substrate (14) has a generally planar reflective surface (28) that supports the semiconductor device (12). The light emitting semiconductor device heat sinks via the support substrate. A curved reflector (16) has a concave parabolic reflective surface. The light emitting semiconductor device (12) is arranged between the support substrate (14) and the curved reflector (16). The support substrate (14) and the curved reflector (16) together define a light aperture (18) through which light produced by the light emitting semiconductor device (12) passes.
    Type: Grant
    Filed: August 30, 2002
    Date of Patent: September 20, 2005
    Assignee: GELcore LLC
    Inventors: Shawn X. Du, Michael C. Hsing Chen, Thomas F. Soules, Frank P. Dornauer, Tomislav J. Stimac, Robert Schindler
  • Patent number: 6805458
    Abstract: A showerhead (802, 804) or faucet (12, 602, 702) includes a water outlet (16, 606, 706, 802) for emitting a water flow (22, 610, 710) and a handle (18, 20, 604, 704, 830) for controlling the water flow (22, 610, 770). At least one LED (42, 242, 342, 442, 542, 544, 546, 624, 658, 730, 810) is arranged on or in the showerhead (802, 804) or faucet (12, 602, 702) and viewable by an associated user thereof. A light-transmissive encapsulant (630, 660, 732) seals the at least one LED (42, 242, 342, 442, 542, 544, 546, 624, 658, 730, 810) and transmits light produced by the at least one LED (42, 242, 342, 442, 542, 544, 546, 624, 658, 730, 810) to the associated user. A controller (550) produces a controller output for controlling the LED light emission responsive to at least one of a water flow rate, a water flow temperature, an ambient light level, and a position of the handle (18, 20, 604, 704, 830).
    Type: Grant
    Filed: August 15, 2002
    Date of Patent: October 19, 2004
    Assignee: GELcore LLC
    Inventors: Robert J. Schindler, Srianath K. Aanegola, Greg E. Burkholder, Frank P. Dornauer, Mitchell J. Hart, Kerry D. Moore, James T. Petroski, Tomislav J. Stimac
  • Patent number: 6787999
    Abstract: A lamp (10) includes an optics module (12) and an electronics module (14, 60, 70). The optics module (10) includes a plurality of LEDs (76) arranged on a printed circuit board (18) and having a plurality of input leads, and a heat sink (22) having a conduit (40) for the input leads. The plurality of LEDs (16) thermally communicate with the heat sink (22). The electronics module (14, 60, 70) is adapted to power the plurality of LEDs (16) through the input leads. The electronics module (14, 60, 70) has a first end (52) adapted to rigidly connect with the heat sink (22), and a selected electrical connector (50, 62, 72) arranged on a second end for receiving electrical power. The electronics module (14, 60, 70) further houses circuitry (80) arranged therewithin for adapting the received electrical power (82) to drive the LEDs (16).
    Type: Grant
    Filed: October 3, 2002
    Date of Patent: September 7, 2004
    Assignee: GELcore, LLC
    Inventors: Tomislav J. Stimac, James T. Petroski, Robert J. Schindler, Greg E. Burkholder
  • Publication number: 20040066142
    Abstract: A lamp (10) includes an optics module (12) and an electronics module (14, 60, 70). The optics module (10) includes a plurality of LEDs (76) arranged on a printed circuit board (18) and having a plurality of input leads, and a heat sink (22) having a conduit (40) for the input leads. The plurality of LEDs (16) thermally communicate with the heat sink (22). The electronics module (14, 60, 70) is adapted to power the plurality of LEDs (16) through the input leads. The electronics module (14, 60, 70) has a first end (52) adapted to rigidly connect with the heat sink (22), and a selected electrical connector (50, 62, 72) arranged on a second end for receiving electrical power. The electronics module (14, 60, 70) further houses circuitry (80) arranged therewithin for adapting the received electrical power (82) to drive the LEDs (16).
    Type: Application
    Filed: October 3, 2002
    Publication date: April 8, 2004
    Applicant: GELcore, LLC
    Inventors: Tomislav J. Stimac, James T. Petroski, Robert J. Schindler, Greg E. Burkholder
  • Publication number: 20040042212
    Abstract: A light source (10) includes a light emitting semiconductor device (12). A support substrate (14) has a generally planar reflective surface (28) that supports the semiconductor device (12). The light emitting semiconductor device heat sinks via the support substrate. A curved reflector (16) has a concave parabolic reflective surface. The light emitting semiconductor device (12) is arranged between the support substrate (14) and the curved reflector (16). The support substrate (14) and the curved reflector (16) together define a light aperture (18) through which light produced by the light emitting semiconductor device (12) passes.
    Type: Application
    Filed: August 30, 2002
    Publication date: March 4, 2004
    Applicant: GELcore, LLC
    Inventors: Shawn X. Du, Michael C. Hsing Chen, Thomas F. Soules, Frank P. Dornauer, Tomislav J. Stimac, Robert Schindler