Abstract: A process for applying a light- or radiation-curable resin composition onto a polyolefin molding comprising surface treating a molding of polyolefin composition composed of 99.99 to 0 wt % of a polyolefin and 0.01 to 100 wt % of an olefinic polymeric compound having polar groups represented by the formula, --OCOR, ##STR1## wherein R and R' are each a hydrogen atom or a hydrocarbon group having 1 to 8 carbon atoms, by at least one pretreatment method selected from the group consisting of a treatment with a halogenated hydrocarbon solvent, a low temperature plasma treatment, a corona discharge treatment, a flame treatment and an alkali degreasing treatment, and applying onto the thus treated molding surface a light- or radiation-curable resin composition, is disclosed.