Patents by Inventor Tommi Kanerva

Tommi Kanerva has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8913527
    Abstract: Suitably arranged circuits located on a die surface of respective multiple dies are operatively connected via a physical link, which is configured for full-duplex operation. Data information content is transferred between the operatively connected suitably arranged circuits via the full-duplex physical link which is configured as a fragmented data interconnected (FDI) physical link allowing peer-to-peer operation and pipelining. The data information content is carried in data fragments by a self-contained data packet structure. In one embodiment a device comprises a first suitably arranged and configured circuit located on a die surface, a second suitably arranged and configured circuit located on a die surface and a full-duplex physical link arranged and configured for operatively connecting the first circuit located on the die surface to the second circuit located on the die surface for transferring data information content between the first circuit and the second circuit.
    Type: Grant
    Filed: June 12, 2008
    Date of Patent: December 16, 2014
    Assignee: Nokia Corporation
    Inventors: Tommi Kanerva, Pasi Kolinummi, Mika Koikkalainen
  • Publication number: 20090327539
    Abstract: Suitably arranged circuits located on a die surface are operatively connected via a shared link which is configured for carrying data information content between the suitably arranged circuits. A suitably arranged and configured system status signal is transferred between a first of the suitably arranged circuits and a second of the suitably arranged circuits via the shared link for mirroring a system status of the first of the suitably arranged circuits in the second of the suitably arranged circuits. In one embodiment, the system status signal is arranged and configured as part of the data information content data packet structure carried between the suitably configured circuits. The system status signal comprises a collection of bit signals arranged and configured for indicating a status of a corresponding on-chip-interconnect access in the first of the suitably arranged circuits.
    Type: Application
    Filed: June 30, 2008
    Publication date: December 31, 2009
    Inventors: Tommi Kanerva, Pasi Kolinummi, Mika Koikkalainen
  • Publication number: 20090310521
    Abstract: Suitably arranged circuits located on a die surface of respective multiple dies are operatively connected via a physical link, which is configured for full-duplex operation. Data information content is transferred between the operatively connected suitably arranged circuits via the full-duplex physical link which is configured as a fragmented data interconnected (FDI) physical link allowing peer-to-peer operation and pipelining. The data information content is carried in data fragments by a self-contained data packet structure.
    Type: Application
    Filed: June 12, 2008
    Publication date: December 17, 2009
    Inventors: Tommi Kanerva, Pasi Kolinummi, Mika Koikkalainen