Abstract: An improved semiconductor burn-in socket assembly board test device includes a plurality of sockets having apertures formed in the cavity bottoms, spring clip type female connectors rigidly mounted in the socket cavities for engaging male connector pins of semiconductor devices (dual-in-line packages, for example), and male connector pins depending from the cavity bottoms. Cermet resistors are rigidly fixed within the cavity bottom apertures, and soldered to the female and male connectors whereby a semiconductor burn-in test board is provided having isolation resistors vertically disposed with respect to the socket's female and male connectors and within the thickness of the socket bottoms.