Abstract: Semiconductor structures and methods for forming a semiconductor structure are provided. The method includes forming a first active semiconductor region disposed in a first vertical level of the semiconductor structure, forming a second active semiconductor region disposed in the first vertical level, where the second active semiconductor region is separated from the first active semiconductor region by a distance in a first direction, forming a first conductive structure disposed in a second vertical level that is adjacent to the first vertical level. The first conductive structure extends along the first direction and electrically couples the first active semiconductor region to the second active semiconductor region.

Abstract: Semiconductor structures and methods for forming a semiconductor structure are provided. The method includes forming a first active semiconductor region disposed in a first vertical level of the semiconductor structure, forming a second active semiconductor region disposed in the first vertical level, where the second active semiconductor region is separated from the first active semiconductor region by a distance in a first direction, forming a first conductive structure disposed in a second vertical level that is adjacent to the first vertical level. The first conductive structure extends along the first direction and electrically couples the first active semiconductor region to the second active semiconductor region.

Abstract: Semiconductor structures and methods for forming a semiconductor structure are provided. The method includes forming a first active semiconductor region disposed in a first vertical level of the semiconductor structure, forming a second active semiconductor region disposed in the first vertical level, where the second active semiconductor region is separated from the first active semiconductor region by a distance in a first direction, forming a first conductive structure disposed in a second vertical level that is adjacent to the first vertical level. The first conductive structure extends along the first direction and electrically couples the first active semiconductor region to the second active semiconductor region.

Abstract: Semiconductor structures and methods for forming a semiconductor structure are provided. The method includes forming a first active semiconductor region disposed in a first vertical level of the semiconductor structure, forming a second active semiconductor region disposed in the first vertical level, where the second active semiconductor region is separated from the first active semiconductor region by a distance in a first direction, forming a first conductive structure disposed in a second vertical level that is adjacent to the first vertical level. The first conductive structure extends along the first direction and electrically couples the first active semiconductor region to the second active semiconductor region.

Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a thin client. The thin client establishes a remote session with a remote machine. The thin client detects a connection of a device at a first connection port. The thin client determines a category of the device. The thin client establishes a redirection channel in the remote session with the remote machine based on the category. The thin client redirects access of the device to the remote machine.

Abstract: Semiconductor structures and methods for forming a semiconductor structure are provided. The method includes forming a first active semiconductor region disposed in a first vertical level of the semiconductor structure, forming a second active semiconductor region disposed in the first vertical level, where the second active semiconductor region is separated from the first active semiconductor region by a distance in a first direction, forming a first conductive structure disposed in a second vertical level that is adjacent to the first vertical level. The first conductive structure extends along the first direction and electrically couples the first active semiconductor region to the second active semiconductor region.

Abstract: Semiconductor structures and methods for forming a semiconductor structure are provided. A first active semiconductor region is disposed in a first vertical level of the semiconductor structure. A second active semiconductor region is disposed in the first vertical level, where the second active semiconductor region is separated from the first active semiconductor region by a distance in a first direction. A first conductive structure is disposed in a second vertical level that is adjacent to the first vertical level. The first conductive structure extends along the first direction and electrically couples the first active semiconductor region to the second active semiconductor region.

Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a service processor. The service processor allocates a plurality of frame buffers. The service processor also writes image data of a predetermined image to a first frame buffer of the plurality of frame buffers. The service processor further loads a first application. The service processor displays the predetermined image in accordance with the image data stored in the first frame buffer while the first application is being loaded. The service processor then writes image data of the first application to a second frame buffer of the plurality of frame buffers.

Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a service processor. The service processor allocates a plurality of frame buffers. The service processor also writes image data of a predetermined image to a first frame buffer of the plurality of frame buffers. The service processor further loads a first application. The service processor displays the predetermined image in accordance with the image data stored in the first frame buffer while the first application is being loaded. The service processor then writes image data of the first application to a second frame buffer of the plurality of frame buffers.

Abstract: Present disclosure relates to a desktop cloud manager configured to manage thin client computers. The desktop cloud manager includes: XMS server processor, XMS communication interface for communicating between desktop cloud manager and thin client computers, thin client computer database for storing thin client computers and peripherals information; and non-volatile memory storing an XMS server operating system, and firmware having thin client management software.

Abstract: Semiconductor structures and methods for forming a semiconductor structure are provided. A first active semiconductor region is disposed in a first vertical level of the semiconductor structure. A second active semiconductor region is disposed in the first vertical level, where the second active semiconductor region is separated from the first active semiconductor region by a distance in a first direction. A first conductive structure is disposed in a second vertical level that is adjacent to the first vertical level. The first conductive structure extends along the first direction and electrically couples the first active semiconductor region to the second active semiconductor region.

Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a thin client. The thin client establishes a remote session with a remote machine. The thin client detects a connection of a device at a first connection port. The thin client determines a category of the device. The thin client establishes a redirection channel in the remote session with the remote machine based on the category. The thin client redirects access of the device to the remote machine.

Abstract: Present disclosure relates to a desktop cloud manager configured to manage thin client computers. The desktop cloud manager includes: XMS server processor, XMS communication interface for communicating between desktop cloud manager and thin client computers, thin client computer database for storing thin client computers and peripherals information; and non-volatile memory storing an XMS server operating system, and firmware having thin client management software.