Patents by Inventor Tommy J. Bennett

Tommy J. Bennett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4832779
    Abstract: A rapid thermal processing apparatus and method wherein a transparent (e.g. quartz) vacuum wall is sealed to the process chamber by a radially elastically expandable metallic seal, e.g. a hollow metallic ring with a spring in its core, which has a soft surface portion which deforms inelastically to make a seal.
    Type: Grant
    Filed: April 26, 1988
    Date of Patent: May 23, 1989
    Assignee: Texas Instruments Incorporated
    Inventors: Wayne G. Fisher, Tommy J. Bennett, Cecil J. Davis, Robert T. Matthews
  • Patent number: 4605469
    Abstract: A molecular beam epitaxy system wherein the molybdenum substrate holder and the molybdenum ring which assembles to the substrate holder to hold the wafer are kept in vacuum essentially all the time. Wafers are not pre-mounted to substrate holders, but the wafer mounting step is performed in ultrahigh vacuum after a cassette of wafers has already been loaded and outgassed, under ultrahigh vacuum. Thus, the substrate holder can be outgassed separately at high temperatures, and can remain under high vacuum.
    Type: Grant
    Filed: November 10, 1983
    Date of Patent: August 12, 1986
    Assignee: Texas Instruments Incorporated
    Inventors: Hung-Dah Shih, Tommy J. Bennett
  • Patent number: 4592308
    Abstract: A molecular beam epitaxy system wherein the wafer on which epitaxial deposition is to occur is not soldered to a substrate holder. Instead, a substrate holder with a lip approximately as high as the thickness of the wafer is used, and a retaining ring attaches to the substrate holder to hold the wafer in place during the growth cycle. The retaining ring, like the substrate holder, is made of high-purity refractory material, such as arccast molybdenum. The substrate holder and retaining ring are dimensioned to hold the wafer somewhat loosely, to allow for thermal expansion during the cycling up to growth temperature, which is typically about 600.degree. C.
    Type: Grant
    Filed: August 23, 1984
    Date of Patent: June 3, 1986
    Assignee: Texas Instruments Incorporated
    Inventors: Hung-Dah Shih, Tommy J. Bennett