Abstract: An apparatus is provided for improving the cooling of a heat source. The apparatus includes a deflector mounted in a space between a first heat source and a second heat source. The deflector has a first face at a first angle that is greater than perpendicular from a first plane and a second face at a second angle that is less than perpendicular from a second plane. The apparatus further includes a plurality of vanes that extend from the first face of the deflector and are rotated inwardly with respect to the first face. When the first and second heat sources are immersed in a fluid and oriented with the second heat source above the first heat source, as fluid heated by the first heat source rises, the heated fluid is directed by the deflector away from the second plane and is directed by the plurality of vanes toward a center of the deflector.

Abstract: A boiler plate is provided. The boiler plate includes a heat spreader layer operable to transfer heat from a computing component across the heat spreader layer. The heat spreader layer extends along a plane. At least one heat pipe extends from the heat spreader layer in a direction substantially perpendicular to the plane away from the computing component. The at least one heat pipe is operable to transfer the heat away from the heat spreader layer to reduce a temperature of the computing component.