Patents by Inventor Tommy Schonberg

Tommy Schonberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical connections in substrates
    Patent number: 7560802
    Abstract: A method of making an electrical connection between a first (top) and a second (bottom) surface of a conducting or semi-conducting substrate includes creating a trench in the first surface, and establishing an insulating enclosure entirely separating a portion of the substrate, defined by the trench. Also described is a product usable as a starting substrate for the manufacture of micro-electronic and/or micro-mechanic devices, including a flat substrate of a semi-conducting or conducting material, and having a first and a second surface and at least one electrically conducting member extending through the substrate. The electrically conducting member is insulated from surrounding material of the flat substrate by a finite layer of an insulating material, and includes the same material as the substrate, i.e. it is made from the wafer material.
    Type: Grant
    Filed: March 22, 2004
    Date of Patent: July 14, 2009
    Assignee: Silex Microsystems AG
    Inventors: Edvard Kälvesten, Thorbjörn Ebefors, Niklas Svedin, Pelle Rangsten, Tommy Schönberg
  • Electrical connections in substrates
    Publication number: 20070020926
    Abstract: A method of making an electrical connection between a first (top) and a second (bottom) surface of a conducting or semi-conducting substrate includes creating a trench in the first surface, and establishing an insulating enclosure entirely separating a portion of the substrate, defined by the trench. Also described is a product usable as a starting substrate for the manufacture of micro-electronic and/or micro-mechanic devices, including a flat substrate of a semi-conducting or conducting material, and having a first and a second surface and at least one electrically conducting member extending through the substrate. The electrically conducting member is insulated from surrounding material of the flat substrate by a finite layer of an insulating material, and includes the same material as the substrate, i.e. it is made from the wafer material.
    Type: Application
    Filed: March 22, 2004
    Publication date: January 25, 2007
    Inventors: Edvard Kalvesten, Thorbjorn Ebefors, Nikias Svedin, Pelle Rangsten, Tommy Schonberg