Patents by Inventor Tomo Chiba
Tomo Chiba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11390058Abstract: The present invention provides an easily tearable aluminum-vapor-deposited biaxially oriented film in which at least an aluminum vapor deposition layer (A), a barrier layer (B), an adhesive layer (C), and a polypropylene layer (D) are layered in this order, wherein the barrier layer (B) includes a mixture of a polyamide (a) and an amorphous polyamide (b), the polyamide (a) includes diamine units including at least 70 mol % of constituent units derived from xylylene diamine and dicarboxylic acid units including at least 70 mol % of constituent units derived from a C4-20 ?,?-straight-chain aliphatic dicarboxylic acid, the content of the polyamide (a) in the barrier layer (B) is 30-70% by mass, and the content of the amorphous polyamide (b) in the barrier layer (B) is 30-70% by mass.Type: GrantFiled: October 13, 2017Date of Patent: July 19, 2022Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Tomo Chiba, Takafumi Oda
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Patent number: 10869390Abstract: A resin composition comprising a thermosetting resin, a functional group-modified copolymer, and an inorganic filler, wherein the functional group-modified copolymer has two or more alkyl (meth)acrylate units, or one or two or more alkyl (meth)acrylate units and an acrylonitrile unit, and at least a part of alkyl ester groups of the alkyl (meth)acrylate units and/or a cyano group of the acrylonitrile unit are/is modified with at least one selected from the group consisting of an epoxy group, a carboxyl group, and an amide group.Type: GrantFiled: July 4, 2016Date of Patent: December 15, 2020Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Nobuyoshi Ohnishi, Yoichi Takano, Tomo Chiba, Meguru Ito, Eisuke Shiga
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Patent number: 10717837Abstract: The present invention provides a resin composition containing an alkenyl-substituted nadimide and a perinone-based colorant, wherein the content of the perinone-based colorant is 0.8 parts by mass or less based on 100 parts by mass in total of resin-constituting components in the resin composition.Type: GrantFiled: July 4, 2016Date of Patent: July 21, 2020Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Katsuya Tomizawa, Eisuke Shiga, Meguru Ito, Tomo Chiba
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Patent number: 10563029Abstract: A resin composition containing a compound represented by the following general formula (a) or the following general formula (b), an alkenyl-substituted nadimide compound, and a maleimide compound: wherein Ra represents a group represented by the following general formula (c),Type: GrantFiled: July 4, 2016Date of Patent: February 18, 2020Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Yoichi Takano, Katsuya Tomizawa, Takashi Kubo, Tomo Chiba, Eisuke Shiga
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Publication number: 20190248116Abstract: The present invention provides an easily tearable aluminum-vapor-deposited biaxially oriented film in which at least an aluminum vapor deposition layer (A), a barrier layer (B), an adhesive layer (C), and a polypropylene layer (D) are layered in this order, wherein the barrier layer (B) includes a mixture of a polyamide (a) and an amorphous polyamide (b), the polyamide (a) includes diamine units including at least 70 mol % of constituent units derived from xylylene diamine and dicarboxylic acid units including at least 70 mol % of constituent units derived from a C4-20 ?,?-straight-chain aliphatic dicarboxylic acid, the content of the polyamide (a) in the barrier layer (B) is 30-70% by mass, and the content of the amorphous polyamide (b) in the barrier layer (B) is 30-70% by mass.Type: ApplicationFiled: October 13, 2017Publication date: August 15, 2019Inventors: Tomo CHIBA, Takafumi ODA
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Patent number: 10292260Abstract: The present invention provides an insulating layer for printed circuit boards having a difference of within 20% between the flexural modulus at 25° C. and the flexural modulus under heat at 250° C.Type: GrantFiled: January 6, 2015Date of Patent: May 14, 2019Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Katsuya Tomizawa, Tomo Chiba, Meguru Ito, Eisuke Shiga
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Patent number: 10178767Abstract: An object of the present invention is to provide a resin composition that has a variety of properties required for a material for printed circuit boards such as high flame retardancy, and can attain a cured product having high moldability, high resistance against chemicals in a desmearing step, and a small coefficient of thermal expansion, a prepreg comprising the resin composition, a laminate including the prepreg, a metallic foil clad laminate including the prepreg, and a printed circuit board including the prepreg. A resin composition comprising an acrylic-silicone copolymer (A), a halogen-free epoxy resin (B), a cyanic acid ester compound (C) and/or a phenol resin (D), and an inorganic filler (E).Type: GrantFiled: November 27, 2013Date of Patent: January 8, 2019Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Tomo Chiba, Hiroshi Takahashi, Eisuke Shiga, Yoshihiro Kato
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Patent number: 10138393Abstract: The present invention provides a resin composition including: nanoparticles (A) of alumina and/or boehmite having an average particle size of 1.0 nm to 100 nm; fine particles (B) having an average particle size of 0.20 ?m to 100 ?m; and a thermosetting resin (C), wherein the nanoparticles (A) have their surfaces treated with a polysiloxane-based modifier.Type: GrantFiled: January 14, 2014Date of Patent: November 27, 2018Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Katsuya Tomizawa, Tomo Chiba, Hiroshi Takahashi, Eisuke Shiga, Daisuke Ueyama, Kentaro Nomizu
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Patent number: 10030141Abstract: An object of the present invention is to provide a resin composition that can attain cured products having high flame retardancy, high heat resistance, a small coefficient of thermal expansion, and high drilling processability, a prepreg having the resin composition, a laminate and a metal foil clad laminate having the prepreg, and a printed circuit board having the resin composition. A resin composition, having at least an epoxy silicone resin (A) prepared by reacting a linear polysiloxane (a) having a carboxyl group with a cyclic epoxy compound (b) having an epoxy group such that the epoxy group of the cyclic epoxy compound (b) is 2 to 10 equivalents based on the carboxyl group of the linear polysiloxane (a), a cyanic acid ester compound (B) and/or a phenol resin (C), and an inorganic filler (D).Type: GrantFiled: October 18, 2013Date of Patent: July 24, 2018Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Tomo Chiba, Hiroshi Takahashi, Eisuke Shiga, Takaaki Ogashiwa
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Publication number: 20180199435Abstract: A resin composition comprising a thermosetting resin, a functional group-modified copolymer, and an inorganic filler, wherein the functional group-modified copolymer has two or more alkyl (meth)acrylate units, or one or two or more alkyl (meth)acrylate units and an acrylonitrile unit, and at least a part of alkyl ester groups of the alkyl (meth)acrylate units and/or a cyano group of the acrylonitrile unit are/is modified with at least one selected from the group consisting of an epoxy group, a carboxyl group, and an amide group.Type: ApplicationFiled: July 4, 2016Publication date: July 12, 2018Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Nobuyoshi OHNISHI, Yoichi TAKANO, Tomo CHIBA, Meguru ITO, Eisuke SHIGA
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Publication number: 20180186952Abstract: A resin composition containing a compound represented by the following general formula (a) or the following general formula (b), an alkenyl-substituted nadimide compound, and a maleimide compound: wherein Ra represents a group represented by the following general formula (c),Type: ApplicationFiled: July 4, 2016Publication date: July 5, 2018Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Yoichi TAKANO, Katsuya TOMIZAWA, Takashi KUBO, Tomo CHIBA, Eisuke SHIGA
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Publication number: 20180179354Abstract: The present invention provides a resin composition containing an alkenyl-substituted nadimide and a perinone-based colorant, wherein the content of the perinone-based colorant is 0.8 parts by mass or less based on 100 parts by mass in total of resin-constituting components in the resin composition.Type: ApplicationFiled: July 4, 2016Publication date: June 28, 2018Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Katsuya TOMIZAWA, Eisuke SHIGA, Meguru ITO, Tomo CHIBA
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Publication number: 20180171075Abstract: Provided is a polyamide resin with high transparency and high heat aging resistance. The polyamide resin contains a diamine-derived structural unit and a dicarboxylic acid-derived structural unit, the diamine-derived structural unit being such that 70 mol % or more thereof is derived from 1,3-bis(aminomethyl)cyclohexane, and the dicarboxylic acid-derived structural unit being such that 10 to 90 mol % thereof is derived from isophthalic acid, 90 to 10 mol % of thereof is derived from a straight chain aliphatic dicarboxylic acid having 8 to 12 carbon atoms, and the dicarboxylic acid-derived structural unit containing substantially no terephthalic acid-derived structural unit.Type: ApplicationFiled: April 27, 2016Publication date: June 21, 2018Inventors: Nobuhide TSUNAKA, Tomonori KATO, Hatsuki OGURO, Tomo CHIBA, Masayuki KOBAYASHI
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Patent number: 9902851Abstract: A resin composition containing a cyclic epoxy-modified silicone compound (A) represented by formula (1), a cyanic acid ester compound (B) and/or a phenol resin (C) and an inorganic filler (D): wherein Ra each independently represent an organic group having an epoxy group; Rb each independently represent a substituted or unsubstituted monovalent hydrocarbon group; x represents an integer of 0 to 2; and y represents an integer of 1 to 6; and the siloxane unit marked with x and the siloxane unit marked with y are arranged mutually at random.Type: GrantFiled: October 18, 2013Date of Patent: February 27, 2018Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Hiroshi Takahashi, Tomo Chiba, Nobuyoshi Ohnishi, Katsuya Tomizawa, Keisuke Takada, Eisuke Shiga, Takaaki Ogashiwa
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Publication number: 20160309582Abstract: The present invention provides an insulating layer for printed circuit boards having a difference of within 20% between the flexural modulus at 25° C. and the flexural modulus under heat at 250° C.Type: ApplicationFiled: January 6, 2015Publication date: October 20, 2016Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Katsuya TOMIZAWA, Tomo CHIBA, Meguru ITO, Eisuke SHIGA
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Publication number: 20150344733Abstract: The present invention provides a resin composition including: nanoparticles (A) of alumina and/or boehmite having an average particle size of 1.0 nm to 100 nm; fine particles (B) having an average particle size of 0.20 ?m to 100 ?m; and a thermosetting resin (C), wherein the nanoparticles (A) have their surfaces treated with a polysiloxane-based modifier.Type: ApplicationFiled: January 14, 2014Publication date: December 3, 2015Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Katsuya TOMIZAWA, Tomo CHIBA, Hiroshi TAKAHASHI, Eisuke SHIGA, Daisuke UEYAMA, Kentaro NOMIZU
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Publication number: 20150319853Abstract: An object of the present invention is to provide a resin composition that has a variety of properties required for a material for printed circuit boards such as high flame retardancy, and can attain a cured product having high moldability, high resistance against chemicals in a desmearing step, and a small coefficient of thermal expansion, a prepreg comprising the resin composition, a laminate including the prepreg, a metallic foil clad laminate including the prepreg, and a printed circuit board including the prepreg. A resin composition comprising an acrylic-silicone copolymer (A), a halogen-free epoxy resin (B), a cyanic acid ester compound (C) and/or a phenol resin (D), and an inorganic filler (E).Type: ApplicationFiled: November 27, 2013Publication date: November 5, 2015Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Tomo CHIBA, Hiroshi TAKAHASHI, Eisuke SHIGA, Yoshihiro KATO
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Publication number: 20150307708Abstract: An object of the present invention is to provide a resin composition that can attain cured products having high flame retardancy, high heat resistance, a small coefficient of thermal expansion, and high drilling processability, a prepreg having the resin composition, laminate and a metal foil clad laminate having the prepreg, and a printed circuit board having the resin composition. A resin composition, having at least an epoxy silicone resin (A) prepared by reacting a linear polysiloxane (a) having a carboxyl group with a cyclic epoxy compound (b) having an epoxy group such that the epoxy group of the cyclic epoxy compound (b) is 2 to 10 equivalents based on the carboxyl group of the linear polysiloxane (a), a cyanic acid ester compound (B) and/or a phenol resin (C), and an inorganic filler (D).Type: ApplicationFiled: October 18, 2013Publication date: October 29, 2015Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Tomo CHIBA, Hiroshi TAKAHASHI, Eisuke SHIGA, Takaaki OGASHIWA
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Publication number: 20150267047Abstract: A resin composition containing a cyclic epoxy-modified silicone compound (A) represented by formula (1), a cyanic acid ester compound (B) and/or a phenol resin (C) and an inorganic filler (D): wherein Ra each independently represent an organic group having an epoxy group; Rb each independently represent a substituted or unsubstituted monovalent hydrocarbon group; x represents an integer of 0 to 2; and y represents an integer of 1 to 6; and the siloxane unit marked with x and the siloxane unit marked with y are arranged mutually at random.Type: ApplicationFiled: October 18, 2013Publication date: September 24, 2015Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Hiroshi Takahashi, Tomo Chiba, Nobuyoshi Ohnishi, Katsuya Tomizawa, Keisuke Takada, Eisuke Shiga, Takaaki Ogashiwa