Abstract: Provided is a method and reagent for measuring cystatin C in a human body fluid, by contacting a human body fluid with (a) first insoluble carrier particles coated with a first anti-human cystatin C monoclonal antibody and (b) second insoluble carrier particles coated with a second anti-human cystatin C monoclonal antibody, where the first anti-human cystatin C monoclonal antibody has an affinity for cystatin C that is higher than the second anti-human cystatin C monoclonal antibody, the second anti-human cystatin C monoclonal antibody recognizes an epitope of cystatin C that is different from the epitope recognized by the first anti-human cystatin C monoclonal antibody, and the first and second insoluble carrier particles are coated with from 1% to less than 4% by weight of the anti-human cystatin C monoclonal antibodies.

Abstract: Provided is a method for the simple and highly accurate assay of PSA by a one-step reaction that does not use carriers having different average grain sizes. Also provided is a reagent therefor. The PSA assay method comprises sensitizing insoluble carriers having the same average grain size within a range of greater than 0.20 ?m but 0.40 ?m or less using two types of anti-PSA monoclonal antibodies having different epitopes that are anti-PSA monoclonal antibodies that will react with both free PSA and PSA-ACT, which is a complex of free PSA and ?1-antichymotrypsin, and bringing the carriers into contact with a sample in the presence of an aggregation promoter.

Abstract: A problem of the present invention is to provide an antibody specific to human insulin and an assay and an assay reagent using the antibody capable of accurately assaying human insulin without being affected by porcine insulin. The present invention provides an assay and an assay reagent capable of specifically assaying human insulin by combining a monoclonal antibody specifically reactive with human insulin and nonreactive with porcine insulin and a different anti-human insulin antibody.

Abstract: There is provided a particle-enhanced immunoassay method for cystatin C in a human body fluid, which has higher specificity and is easily automatable at low cost as compared with conventional assay methods that use large amounts of polyclonal antibodies having low specificity or monoclonal antibodies having high specificity but having poor agglutinability.

Abstract: The present invention provides an insulin-specific assay and an assay reagent capable of sensitively and specifically assaying insulin using an antibody having a property of reacting with insulin bound to an anti-insulin antibody while not reacting with insulin not bound to an anti-insulin antibody, without being affected by proinsulin and insulin analogs.

Abstract: An objective of the present invention is to provide an anti-human IgM monoclonal antibody that is capable of reacting specifically with human IgM and inducing immunoagglutination based on an antigen-antibody reaction with human IgM in solution, and an immunoassay using the said monoclonal antibody. Another objective of the present invention is to provide an agent for suppressing non-specific reactions caused by human IgM that could not be prevented by conventional methods, and an immunoassay in which non-specific reactions caused by human IgM are suppressed. By selecting a monoclonal antibody that reacts with human IgM on the basis of evaluation of reactivity with human IgM in solution, a novel monoclonal antibody capable of agglutinating human IgM by itself and performing a practical immunoagglutination assay has been obtained, and the objectives above have been thus achieved.

Abstract: In connection with a semiconductor device which adopts the face down mounting method, it is intended to provide a technique which can check the state of continuity between electrode pads formed on a semiconductor chip and electrode pads formed on a wiring substrate.

Abstract: A central portion of a main face of a package substrate 2 is mounted with a memory chip 1 using face down bonding by a flip chip bonding system. Further, a plurality of chip condensers 7 are mounted at vicinities of the memory chip 1. A clearance between a main face (lower face) of the memory chip 1 and a main face of the package substrate 2 is filled with underfill resin (seal resin) 10 constituting a seal member for achieving protection of connecting portions and for relaxation of thermal stress. An outer edge of the underfill resin 10 is extended to an outer side of the memory chip 1 and covers entire faces of the chip condensers 7 mounted at vicinities of the memory chip 1.

Abstract: A central portion of a main face of a package substrate 2 is mounted with a memory chip 1 in face down bonding by a flip chip bonding system. Further, a plurality of chip condensers 7 are mounted at vicinities of the memory chip 1. A clearance between a main face (lower face) of the memory chip 1 and a main face of the package substrate 2 is filled with underfill resin (seal resin) 10 constituting a seal member for achieving protection of connecting portions for connecting both and relaxation of thermal stress. An outer edge of the underfill resin 10 is extended to an outer side of the memory chip 1 and covers entire faces of the chip condensers 7 mounted at vicinities of the memory chip 1.