Patents by Inventor Tomoaki Haruta

Tomoaki Haruta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of cutting multilayer body, method of forming multilayer container, and multilayer formed product
    Patent number: 7942996
    Abstract: An end face of an intermediate layer of a multilayer structure is stably covered by surface resin layers at a time of cutting the multilayer structure. A cutting method of the multilayer structure includes the steps of: compressing and deforming the multilayer structure, while extending respective layers of the multilayer structure to provide a thin thickness portion, so that an upper layer bites into a lower layer by pushing a push cutter, by a predetermined amount, into the multilayer structure supported by a cutter receiving portion, in a fused state of at least one of the resin layers forming the multilayer structure; and push-cutting the compressed thin thickness portion S till the push cutter abuts against the cutter receiving portion so as to converge an intermediate layer and surface resin layers of the multilayer structure to the abutting portion A of the push cutter and the cutter receiving portion.
    Type: Grant
    Filed: August 14, 2009
    Date of Patent: May 17, 2011
    Assignees: Toyo Seikan Kaisha, Ltd., Asano Laboratories Co., Ltd.
    Inventors: Kikuo Matsuoka, Shinji Tanaka, Yasuyo Sano, Toshihiro Takai, Kenichi Mizoguchi, Hideki Usami, Tomoaki Haruta
  • Method of cutting multilayer body, method of forming multilayer container, and multilayer formed product
    Patent number: 7833379
    Abstract: An end face of an intermediate layer of a multilayer structure is stably covered by surface resin layers at a time of cutting the multilayer structure. A cutting method of the multilayer structure 10 includes the steps of: compressing and deforming the multilayer structure, while extending respective layers 11, 12, 13 of the multilayer structure to provide a thin thickness portion, so that an upper layer bites into a lower layer by pushing a push cutter 15, by a predetermined amount, into the multilayer structure supported by a cutter receiving portion 14, in a fused state of at least one of the resin layers forming the multilayer structure; and push-cutting the compressed thin thickness portion S till the push cutter abuts against the cutter receiving portion so as to converge an intermediate layer 11 and surface resin layers 12, 13 of the multilayer structure to the abutting portion A of the push cutter 15 and the cutter receiving portion 14.
    Type: Grant
    Filed: July 25, 2003
    Date of Patent: November 16, 2010
    Assignees: Toyo Seikan Kaisha, Ltd., Asano Laboratories Co., Ltd.
    Inventors: Kikuo Matsuoka, Shinji Tanaka, Yasuyo Sano, Toshihiro Takai, Kenichi Mizoguchi, Hideki Usami, Tomoaki Haruta
  • METHOD OF CUTTING MULTILAYER BODY, METHOD OF FORMING MULTILAYER CONTAINER, AND MULTILAYER FORMED PRODUCT
    Publication number: 20090304960
    Abstract: An end face of an intermediate layer of a multilayer structure is stably covered by surface resin layers at a time of cutting the multilayer structure. A cutting method of the multilayer structure includes the steps of: compressing and deforming the multilayer structure, while extending respective layers of the multilayer structure to provide a thin thickness portion, so that an upper layer bites into a lower layer by pushing a push cutter, by a predetermined amount, into the multilayer structure supported by a cutter receiving portion, in a fused state of at least one of the resin layers forming the multilayer structure; and push-cutting the compressed thin thickness portion S till the push cutter abuts against the cutter receiving portion so as to converge an intermediate layer and surface resin layers of the multilayer structure to the abutting portion A of the push cutter and the cutter receiving portion.
    Type: Application
    Filed: August 14, 2009
    Publication date: December 10, 2009
    Applicants: Toyo Seikan Kaisha, Ltd., Asano Laboratories Co., Ltd.
    Inventors: Kikuo Matsuoka, Shinji Tanaka, Yasuyo Sano, Toshihiro Takai, Kenichi Mizoguchi, Hideki Usami, Tomoaki Haruta