Abstract: A substrate processing apparatus that supplies a processing liquid to a front surface of a substrate which is rotating, includes: a substrate holder configured to hold the substrate, wherein the substrate holder includes: a gripper configured to come into contact with a periphery of the substrate to grip the substrate; and a base to which the gripper is attached.

Abstract: An extracorporeal blood circulation system monitors blood level in a reservoir which temporarily stores the blood. A memory storage unit stores blood pressure measurements from a pressure sensor monitoring a blood pressure within a tube unit conveying blood from the reservoir relative to atmosphere. A processing unit that detects a height of a top surface of the blood stored in the reservoir based on changes in the blood pressure measurements and a conservation of mechanical energy of a blood flow inside the tube unit. A notification is generated if an abnormality is detected in the height of the blood in the reservoir.

Abstract: An extracorporeal circulation apparatus has a blood reservoir temporarily storing blood and a presence information acquisition unit to detect presence or absence of blood at respective wall locations in a two-dimensional array. A control unit determines the position of a blood surface on the basis of consecutive elements in the array having detected blood along at least one of a first direction parallel to the blood surface and a second direction perpendicular to the blood surface.

Abstract: An extracorporeal circulation management device pumps blood in synchronization with heartbeats of a patient based on measurements of blood flow. Maximum and minimum blood flow measurement samples are compared with upper and lower threshold values to identify candidate timing for a systolic phase and diastolic phase of the heartbeat. During pulsatile pumping of the blood using the candidate timing, differences in the pulsatile flow measurements are determined. Based on the size of the difference, a final correction may be made to identification of the systolic and diastolic phases, and the corrected phase information is used to start and stop the motor unit.

Abstract: Provided is a renal function maintenance and protection agent comprising as an active ingredient of a triglyceride of docosahexaenoic acid (DHA) or eicosapentaenoic acid (EPA) or a mixture of a triglyceride of docosahexaenoic acid (DHA) and a triglyceride of eicosapentaenoic acid (EPA), which can be used as a pharmaceutical or food composition. A triglyceride of docosahexaenoic acid (DHA) or eicosapentaenoic acid (EPA) or a mixture of a triglyceride of docosahexaenoic acid (DHA) and a triglyceride of eicosapentaenoic acid (EPA) is used as an active ingredient for renal function maintenance and protection agents.

Abstract: An extracorporeal circulation management device 10 displays an expected flow rate of blood flowing inside a circulation circuit 1R and an actual flow rate on a display unit 16, together with a standard pressure calculated based on the expected flow rate by referring to standard information representing a relation between the blood flow rate and a pressure loss occurring in each of devices 2, 5, and 6 provided in the circulation circuit 1R and stored in a storage unit, and an actual pressure related to each of the devices 2, 5, and 6, which is calculated based on an actual pressure measured by each of pressure measurement units 21, 22, and 23 as an actually measured value of a pressure of the blood flowing inside the circulation circuit 1R and the actual flow rate.

Abstract: An extracorporeal circulation apparatus has a blood reservoir temporarily storing blood and a presence information acquisition unit to detect presence or absence of blood at respective wall locations in a two-dimensional array. A control unit determines the position of a blood surface on the basis of consecutive elements in the array having detected blood along at least one of a first direction parallel to the blood surface and a second direction perpendicular to the blood surface.

Abstract: An extracorporeal blood circulation management device having an oxygenator accurately determines oxygen consumption by the target person and oxygen delivery by the oxygenator. Oxygenation-related parameter values in the blood are determined at regular intervals. An in-body passing time (a cycle time for a particular volume of blood to pass from input sensors to output sensors) is determined. Parameter values separated by the in-body passing time are selected as comparison targets to evaluate oxygenation consumption of the target person. An oxygenator unit passing time is determined. Parameter values separated by the oxygenator unit passing time are selected as comparison targets to evaluate oxygenation delivery of the oxygenation unit.

Abstract: An extracorporeal blood circulation system monitors blood level in a reservoir which temporarily stores the blood. A memory storage unit stores blood pressure measurements from a pressure sensor monitoring a blood pressure within a tube unit conveying blood from the reservoir relative to atmosphere. A processing unit that detects a height of a top surface of the blood stored in the reservoir based on changes in the blood pressure measurements and a conservation of mechanical energy of a blood flow inside the tube unit. A notification is generated if an abnormality is detected in the height of the blood in the reservoir.

Abstract: An extracorporeal circulation management device pumps blood in synchronization with heartbeats of a patient based on measurements of blood flow. Maximum and minimum blood flow measurement samples are compared with upper and lower threshold values to identify candidate timing for a systolic phase and diastolic phase of the heartbeat. During pulsatile pumping of the blood using the candidate timing, differences in the pulsatile flow measurements are determined. Based on the size of the difference, a final correction may be made to identification of the systolic and diastolic phases, and the corrected phase information is used to start and stop the motor unit.

Abstract: An extracorporeal blood circulation management device having an oxygenator accurately determines oxygen consumption by the target person and oxygen delivery by the oxygenator. Oxygenation-related parameter values in the blood are determined at regular intervals. An in-body passing time (a cycle time for a particular volume of blood to pass from input sensors to output sensors) is determined. Parameter values separated by the in-body passing time are selected as comparison targets to evaluate oxygenation consumption of the target person. An oxygenator unit passing time is determined. Parameter values separated by the oxygenator unit passing time are selected as comparison targets to evaluate oxygenation delivery of the oxygenation unit.

Abstract: An extracorporeal blood circulator includes a control unit and a speed manipulation section. A rotation display section displays a lower limit rotation setting value of a pump motor in accordance with a command of the control unit. The lower limit rotation speed setting value is a minimum rotation speed for preventing backflow of blood inside a circulation circuit A manually adjusted speed setting request from the manipulation section controls the pump speed, except that the controller enforces the lower limit speed setting unless receiving confirmation from a manipulator.

Abstract: An extracorporeal blood circulator includes a control unit and a speed manipulation section. A rotation display section displays a lower limit rotation setting value of a pump motor in accordance with a command of the control unit. The lower limit rotation speed setting value is a minimum rotation speed for preventing backflow of blood inside a circulation circuit A manually adjusted speed setting request from the manipulation section controls the pump speed, except that the controller enforces the lower limit speed setting unless receiving confirmation from a manipulator.

Abstract: Bump electrodes (conductive members) bonded onto lands disposed at a peripheral portion side than terminals (bonding leads) electrically coupled to pads (electrode pads) of a microcomputer chip (semiconductor chip) are sealed with sealing resin (a sealing body). Thereafter, the sealing resin is ground (removed) partially such that a part of each of the bump electrodes is exposed. The step of protruding the part of each of the bump electrodes from a front surface of the sealing resin is performed, after the grinding step.

Abstract: Bump electrodes (conductive members) bonded onto lands disposed at a peripheral portion side than terminals (bonding leads) electrically coupled to pads (electrode pads) of a microcomputer chip (semiconductor chip) are sealed with sealing resin (a sealing body). Thereafter, the sealing resin is ground (removed) partially such that a part of each of the bump electrodes is exposed. The step of protruding the part of each of the bump electrodes from a front surface of the sealing resin is performed, after the grinding step.

Abstract: The reliability of a semiconductor device is improved. A sealing resin (sealed body) is formed between a sub-substrate (first base member) and a base substrate (second base member) that are provided individually and distinctly to be integrated therewith, and then, the sub-substrate is electrically coupled to the second base member. As a means for electrically coupling the sub-substrate to the base substrate, lands (first lands) formed on the sub-substrate and lands (second lands) formed on the base substrate are disposed such that the respective positions thereof are aligned. After through holes are formed from the lands of the sub-substrate toward the lands of the base substrate, a solder member (conductive member) is formed in each of the through holes.

Abstract: Bump electrodes (conductive members) bonded onto lands disposed at a peripheral portion side than terminals (bonding leads) electrically coupled to pads (electrode pads) of a microcomputer chip (semiconductor chip) are sealed with sealing resin (a sealing body). Thereafter, the sealing resin is ground (removed) partially such that a part of each of the bump electrodes is exposed. The step of protruding the part of each of the bump electrodes from a front surface of the sealing resin is performed, after the grinding step.

Abstract: The reliability of a semiconductor device is improved. A sealing resin (sealed body) is formed between a sub-substrate (first base member) and a base substrate (second base member) that are provided individually and distinctly to be integrated therewith, and then, the sub-substrate is electrically coupled to the second base member. As a means for electrically coupling the sub-substrate to the base substrate, lands (first lands) formed on the sub-substrate and lands (second lands) formed on the base substrate are disposed such that the respective positions thereof are aligned. After through holes are formed from the lands of the sub-substrate toward the lands of the base substrate, a solder member (conductive member) is formed in each of the through holes.

Abstract: Flux is supplied to the surface of each land by a flux supplying apparatus. A solder ball having a predetermined size is supplied onto a land by using a ball supplying apparatus. A memory IC is disposed on a logic IC and each of a plurality of external leads comes into contact with a predetermined position in each of a plurality of corresponding lands. By performing predetermined heat treatment, the solder ball is melted to bond each external lead and each land with each other. After that, the melted solder is cooled down, the bonded portion is formed, and a stacked semiconductor device in which the memory IC is stacked on the logic IC is completed. In such a manner, a stacked semiconductor device in which external leads of a semiconductor device body are bonded to electrodes on a substrate securely is obtained.

Abstract: Flux is supplied to the surface of each land by a flux supplying apparatus. A solder ball having a predetermined size is supplied onto a land by using a ball supplying apparatus. A memory IC is disposed on a logic IC and each of a plurality of external leads comes into contact with a predetermined position in each of a plurality of corresponding lands. By performing predetermined heat treatment, the solder ball is melted to bond each external lead and each land with each other. After that, the melted solder is cooled down, the bonded portion is formed, and a stacked semiconductor device in which the memory IC is stacked on the logic IC is completed. In such a manner, a stacked semiconductor device in which external leads of a semiconductor device body are bonded to electrodes on a substrate securely is obtained.