Abstract: To provide a lamination method and a lamination system capable of excellently laminating a film-type laminate without damage even though the semiconductor is a brittle lamination target such as a foil-type semiconductor or a semiconductor made of highly brittle material. In a lamination method for laminating a film-type laminate to a brittle lamination target by overlapping the brittle lamination target and the film-type laminate and heating and pressing the brittle lamination target and the film-type laminate, with respect to the brittle lamination target mounted on a mount member and carried into a lamination device, an elastic film member is expanded into a vacuum chamber of the lamination device from the above to press and laminate the brittle lamination target and the film-type laminate.

Abstract: A surface of a laminate base body including a projection is caused to penetrate at least a film-shaped laminating body and surely laminated by a simple configuration, and a laminate thereof is formed at a uniform thickness without an occurrence of voids. A laminating device is provided with a heating unit configured to heat at least an insulating resin film; an upper plate and a lower plate configured to be capable of opening and closing, and configured to form a chamber that becomes sealed upon closing; a receiving member having an elasticity and disposed on the upper plate; an elastic membrane body disposed on the lower plate; a vacuuming unit configured to vacuum inside of the chamber; and a compressing unit configured to bloat the elastic membrane body.

Abstract: A vacuum lamination system and a vacuum lamination method are provided in which, when a laminate film and laminate base items are laminated and an excessive portion of the laminate film is cut from the laminated item having the laminate film laminated thereon, a high precision lamination is enabled and the cutting process including a conveying device for cutting the excessive portion of the laminate film can be simplified. In the vacuum lamination system, a laminate film and laminate base items that are conveyed on the carrier film are laminated by the batch type vacuum laminating device, and the laminate film is cut from the laminated item having the laminate film laminated thereon.

Abstract: To provide a lamination method and a lamination system capable of excellently laminating a film-type laminate without damage even though the semiconductor is a brittle lamination target such as a foil-type semiconductor or a semiconductor made of highly brittle material. In a lamination method for laminating a film-type laminate to a brittle lamination target by overlapping the brittle lamination target and the film-type laminate and heating and pressing the brittle lamination target and the film-type laminate, with respect to the brittle lamination target mounted on a mount member and carried into a lamination device, an eleastic film member is expanded into a vacuum chamber of the lamination device from the above to press and laminate the brittle lamination target and the film-type laminate.