Patents by Inventor Tomoaki Hishiki
Tomoaki Hishiki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11950051Abstract: A piezoelectric speaker (10) includes: a piezoelectric film (35); a fixing face (17) for fixing the piezoelectric film (35) to a support; and an interposed layer (40) disposed between the piezoelectric film (35) and the fixing face (17). The interposed layer (40) has a holding degree of 5×108 N/m3 or less.Type: GrantFiled: November 20, 2018Date of Patent: April 2, 2024Assignee: NITTO DENKO CORPORATIONInventors: Yusuke Komoto, Tomoaki Hishiki, Kohei Oto, Saori Yamamoto, Yuka Sekiguchi
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Patent number: 11771122Abstract: The present invention provides a foam body suitable for producing a cultured meat having a good texture. The foam body of the present invention includes alginic acid and/or an alginate. The foam body has an elastic modulus M, as determined by a test, of 8×104 Pa or less. In the test, the foam body is immersed in 22±3° C. water for 4 hours to prepare a specimen having a post-immersion thickness of 5±1 mm. Stress and strain caused in the specimen are measured by applying a load to the specimen for 5 seconds to compress the specimen in a thickness direction at 0.5 mm/sec. A stress caused in the specimen when the specimen is compressed by 10% of an initial thickness is determined, and a value obtained by dividing the stress by a corresponding strain is determined as the elastic modulus M.Type: GrantFiled: September 10, 2021Date of Patent: October 3, 2023Assignee: NITTO DENKO CORPORATIONInventors: Yuka Sekiguchi, Takahisa Konishi, Tomoaki Hishiki, Tomoko Sudo, Shinya Hashiguchi, Yusuke Kamano
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Publication number: 20230060316Abstract: The present invention provides a method for manufacturing an optical resin composition that is less colored and that has a sufficiently low water absorbability. The optical resin composition manufacturing method according to the present invention includes performing a heat treatment of a fluorine-containing polymer under an atmosphere having a water vapor concentration of 100 volppm or less, the fluorine-containing polymer being obtained by polymerization of a monomer group including a fluorine-containing compound having a carbon-carbon double bond using an organic peroxide. In the optical resin composition manufacturing method, for example, the heat treatment causes thermal decomposition of a terminal group of the fluorine-containing polymer and volatilization of a low-molecular compound generated by the thermal decomposition.Type: ApplicationFiled: December 4, 2020Publication date: March 2, 2023Applicant: NITTO DENKO CORPORATIONInventor: Tomoaki Hishiki
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Publication number: 20220408774Abstract: The present invention provides a foam body suitable for producing a cultured meat having a good texture. The foam body of the present invention includes alginic acid and/or an alginate. The foam body has an elastic modulus M, as determined by a test, of 8×104 Pa or less. In the test, the foam body is immersed in 22±3° C. water for 4 hours to prepare a specimen having a post-immersion thickness of 5±1 mm. Stress and strain caused in the specimen are measured by applying a load to the specimen for 5 seconds to compress the specimen in a thickness direction at 0.5 mm/sec. A stress caused in the specimen when the specimen is compressed by 10% of an initial thickness is determined, and a value obtained by dividing the stress by a corresponding strain is determined as the elastic modulus M.Type: ApplicationFiled: September 10, 2021Publication date: December 29, 2022Inventors: Yuka SEKIGUCHI, Takahisa KONISHI, Tomoaki HISHIKI, Tomoko SUDO, Shinya HASHIGUCHI, Yusuke KAMANO
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Patent number: 11252510Abstract: A piezoelectric speaker-forming laminate (10) includes: a piezoelectric film (35); a pressure-sensitive adhesive face (17); an interposed layer (40) being a porous body layer and/or a resin layer disposed between the piezoelectric film (35) and the pressure-sensitive adhesive face (17); and a release layer (20) joined to the pressure-sensitive adhesive face (17). The pressure-sensitive adhesive face (17) is disposed in such a manner that at least a portion of the piezoelectric film (35) overlaps the pressure-sensitive adhesive face (17) when the piezoelectric film (35) is viewed in plan. The piezoelectric film (35) and the interposed layer (40) are allowed to be fixed to a support (80) as a piezoelectric speaker or a portion of a piezoelectric speaker by sticking the pressure-sensitive adhesive face (17) from which the release layer (20) has been removed to the support (80).Type: GrantFiled: November 20, 2018Date of Patent: February 15, 2022Assignee: NITTO DENKO CORPORATIONInventors: Yusuke Komoto, Tomoaki Hishiki, Kohei Oto, Saori Yamamoto, Yuka Sekiguchi
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Publication number: 20210029468Abstract: A piezoelectric speaker-forming laminate (10) includes: a piezoelectric film (35); a pressure-sensitive adhesive face (17); an interposed layer (40) being a porous body layer and/or a resin layer disposed between the piezoelectric film (35) and the pressure-sensitive adhesive face (17); and a release layer (20) joined to the pressure-sensitive adhesive face (17). The pressure-sensitive adhesive face (17) is disposed in such a manner that at least a portion of the piezoelectric film (35) overlaps the pressure-sensitive adhesive face (17) when the piezoelectric film (35) is viewed in plan. The piezoelectric film (35) and the interposed layer (40) are allowed to be fixed to a support (80) as a piezoelectric speaker or a portion of a piezoelectric speaker by sticking the pressure-sensitive adhesive face (17) from which the release layer (20) has been removed to the support (80).Type: ApplicationFiled: November 20, 2018Publication date: January 28, 2021Inventors: Yusuke KOMOTO, Tomoaki HISHIKI, Kohei OTO, Saori YAMAMOTO, Yuka SEKIGUCHI
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Publication number: 20200351594Abstract: A piezoelectric speaker (10) includes: a piezoelectric film (35); a fixing face (17) for fixing the piezoelectric film (35) to a support; and an interposed layer (40) disposed between the piezoelectric film (35) and the fixing face (17). The interposed layer (40) has a holding degree of 5×108 N/m3 or less.Type: ApplicationFiled: November 20, 2018Publication date: November 5, 2020Inventors: Yusuke KOMOTO, Tomoaki HISHIKI, Kohei OTO, Saori YAMAMOTO, Yuka SEKIGUCHI
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Publication number: 20200332518Abstract: A sound reducing system (500) includes at least one sound reducing speaker for radiating a sound wave for sound reduction. The at least one sound reducing speaker includes a piezoelectric speaker (10). The piezoelectric speaker (10) includes a piezoelectric film (35), a fixing face (17) in contact with a support supporting the piezoelectric speaker (35), and a film holding portion (55) disposed between the piezoelectric film (35) and the fixing face (17). (i) The film holding portion (55) includes a pressure-sensitive adhesive layer and the fixing face (17) is formed of a surface of the pressure-sensitive adhesive layer and/or (ii) the film holding portion (55) includes a porous body layer.Type: ApplicationFiled: November 20, 2018Publication date: October 22, 2020Inventors: Yusuke KOMOTO, Tomoaki HISHIKI, Kohei OTO, Saori YAMAMOTO, Yuka SEKIGUCHI
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Publication number: 20200287125Abstract: A piezoelectric speaker (10) includes a piezoelectric film (35), a first joining layer (51), and an interposed layer (40). The piezoelectric film (35) includes a first electrode (61), a second electrode (62), and a piezoelectric body (30) sandwiched by the first electrode (61) and the second electrode (62). The first joining layer (51) is a layer having pressure-sensitive adhesiveness or adhesiveness. The interposed layer (40) is disposed between the piezoelectric film (35) and the first joining layer (51). Both principal surfaces of the piezoelectric film (35) vibrate up and down as a whole.Type: ApplicationFiled: November 20, 2018Publication date: September 10, 2020Inventors: Yusuke KOMOTO, Kohei OTO, Saori YAMAMOTO, Ryohei OBAN, Tomoaki HISHIKI
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Publication number: 20200032026Abstract: Provided is a porous low-dielectric polymer film which has a low dielectric constant at high millimeter-wave frequencies to fulfill utility as a sheet for a millimeter-wave antenna, and provides excellent circuit board processability. The porous low-dielectric polymer film is made of a polymer material and formed with fine pores dispersed therein, wherein the film has a porosity of 60% or more, and the pores have an average pore diameter of 50 ?m or less, and wherein a porous structure of the film is a closed-cell structure.Type: ApplicationFiled: April 6, 2018Publication date: January 30, 2020Inventors: Masayoshi NAKAMURA, Masayuki HODONO, Takahiko ITO, Naoki NAGAOKA, Tomoaki HISHIKI
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Publication number: 20190263995Abstract: Provided is a low-dielectric porous polymer film having a low dielectric constant at high millimeter-wave frequencies and thereby useful as a sheet for a millimeter-wave antenna. The low-dielectric porous polymer film comprises: a base material layer made of a polymer material and formed with fine pores dispersed therein; and a substantially smooth skin layer made of the same polymer material as that of the base material layer and formed on at least one of the surfaces of the base material layer.Type: ApplicationFiled: April 6, 2017Publication date: August 29, 2019Inventors: Masayoshi NAKAMURA, Masayuki HODONO, Takahiko ITO, Naoki NAGAOKA, Tomoaki HISHIKI
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Publication number: 20190263996Abstract: Provided is a low-dielectric porous polymer film having a low dielectric constant at high millimeter-wave frequencies and thereby useful as a sheet for a millimeter-wave antenna. The low-dielectric porous polymer film is made of a polymer material and formed with fine pores dispersed therein, wherein the film has a porosity of 60% or more, and the pores have an average pore diameter of 10 ?m or less.Type: ApplicationFiled: April 6, 2017Publication date: August 29, 2019Inventors: Masayoshi NAKAMURA, Masayuki HODONO, Takahiko ITO, Naoki NAGAOKA, Tomoaki HISHIKI
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Publication number: 20150138739Abstract: A suspension board with circuit includes an electronic element, and a mounting portion having a terminal portion electrically connected to the electronic element. The electronic element and the mounting portion are bonded to each other via an adhesive containing a metal ion scavenger.Type: ApplicationFiled: October 22, 2014Publication date: May 21, 2015Applicant: NITTO DENKO CORPORATIONInventor: Tomoaki HISHIKI
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Publication number: 20130118788Abstract: A polyimide precursor composition comprises (A), and at least one of (B) and (C), (B) and (C) being present in a proportion of 30-100 parts by weight based on 100 parts by weight of (A): (A) a polyimide precursor comprising: (a1) a unit of formula (1): R1 is a C1-C3 alkyl group connected to an aromatic ring, m is 0 or not greater than 4, and n is 1 to 4; and (a2) a unit of formula (2): (a1) and (a2) are present in a molar ratio of 20/80 to 70/30; (B) a compound of formula (3): R2 is a hydrogen atom or a methyl group, and R3 is a divalent hydrocarbon group having two or more carbon atoms; and (C) a compound of formula (4): R4 is a hydroxyl group or a methoxy group, R5 is a hydrogen atom or a methyl group, and k is 4-23.Type: ApplicationFiled: September 11, 2012Publication date: May 16, 2013Applicant: NITTO DENKO CORPORATIONInventors: Tomoaki Hishiki, Takami Hikita, Takatoshi Sakakura