Patents by Inventor Tomoaki Kuroishi

Tomoaki Kuroishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for analyzing component mounting board
    Patent number: 7873932
    Abstract: A method for analyzing a component mounting board comprising a step (A) for forming a multilayer substrate shell model of a multilayer wiring board, a step (B) for forming a multilayer component shell model divided by element division lines based on the bonding position of a component to the surface of the multilayer wiring board, step (C) for redividing the mounting position of the component in the multilayer substrate shell model, and step (D) for forming an analysis model by bonding the neutral plane of the substrate and the neutral plane of the component through one of a beam element and a solid element, i.e. a bonding element equivalent to mounting conditions of the component, wherein precision of analysis is enhanced while reducing computation cost by performing calculation while imparting boundary conditions to the analysis model.
    Type: Grant
    Filed: January 20, 2006
    Date of Patent: January 18, 2011
    Assignee: Panasonic Corporation
    Inventors: Manabu Kakino, Toru Okazaki, Teppei Iwase, Kazunori Takada, Hiroaki Fujiwara, Tomoaki Kuroishi
  • Method for Analyzing Component Mounting Board
    Publication number: 20080168413
    Abstract: A method for analyzing a component mounting board comprising a step (A) for forming a multilayer substrate shell model of a multilayer wiring board, a step (B) for forming a multilayer component shell model divided by element division lines based on the bonding position of a component to the surface of the multilayer wiring board, step (C) for redividing the mounting position of the component in the multilayer substrate shell model, and step (D) for forming an analysis model by bonding the neutral plane of the substrate and the neutral plane of the component through one of a beam element and a solid element, i.e. a bonding element equivalent to mounting conditions of the component, wherein precision of analysis is enhanced while reducing computation cost by performing calculation while imparting boundary conditions to the analysis model.
    Type: Application
    Filed: January 20, 2006
    Publication date: July 10, 2008
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Manabu Kakino, Toru Okazaki, Teppei Iwase, Kazunori Takada, Hiroaki Fujiwara, Tomoaki Kuroishi