Patents by Inventor Tomoaki Mahiko

Tomoaki Mahiko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230331559
    Abstract: Provided is an explosive composition for diamond synthesis by which diamond particles having a relatively large diameter can be produced. The explosive composition for diamond synthesis contains an explosive component, a carbon raw material that may be included as the explosive component, and diamond particles. Furthermore, the total proportion of the explosive component, the carbon raw material, and the diamond particles relative to the total amount of the explosive composition for diamond synthesis is 99 mass% or greater. The crystallite diameter of primary particles of the diamond particles as determined by the XRD method is preferably 100 nm or less.
    Type: Application
    Filed: March 11, 2021
    Publication date: October 19, 2023
    Applicant: DAICEL CORPORATION
    Inventors: Akihiko TSURUI, Masahiro NISHIKAWA, Tomoaki MAHIKO, Ming LIU
  • Publication number: 20220331766
    Abstract: The present invention is to provide a method for producing nanodiamonds doped with a Group 14 element, the method comprising: detonating by exploding an explosive composition containing at least one explosive and at least one Group 14 element compound in a sealed container to obtain nanodiamonds doped with at least one Group 14 element selected from the group consisting of Si, Ge, Sn, and Pb, and removing the Group 14 element and/or oxide thereof by subjecting the nanodiamonds doped with a Group 14 element to an alkali treatment.
    Type: Application
    Filed: March 16, 2020
    Publication date: October 20, 2022
    Applicant: DAICEL CORPORATION
    Inventors: Tomoaki MAHIKO, Yuto MAKINO, Akihiko TSURUI, Ming LIU, Masahiro NISHIKAWA
  • Publication number: 20220185676
    Abstract: The present invention is to provide a heteroatom-doped nanodiamond, the heteroatom-doped nanodiamond being doped with at least one heteroatom, the heteroatom-doped nanodiamond satisfying criteria (i) and/or (ii) below: (i) a BET specific surface area being from 20 to 900 m2/g, and (ii) an average size of primary particles being from 2 to 70 nm.
    Type: Application
    Filed: March 16, 2020
    Publication date: June 16, 2022
    Applicant: DAICEL CORPORATION
    Inventors: Tomoaki MAHIKO, Yuto MAKINO, Akihiko TSURUI, Ming LIU, Masahiro NISHIKAWA
  • Publication number: 20220177388
    Abstract: The present invention is to provide an explosive composition comprising at least one explosive and at least one heteroatom compound, the heteroatom compound comprising at least one heteroatom selected from the group consisting of B, P, Si, S, Cr, Sn, Al, Ge, Li, Na, K, Cs, Mg, Ca, Sr, Ba, Ti, Zr, V, Nb, Ta, Mo, W, Mn, Ni, Cu, Ag, Cd, Hg, Ga, In, Tl, As, Sb, Bi, Se, Te, Co, Xe, F, Y, and lanthanoids.
    Type: Application
    Filed: March 16, 2020
    Publication date: June 9, 2022
    Applicant: DAICEL CORPORATION
    Inventors: Tomoaki MAHIKO, Yuto MAKINO, Akihiko TSURUI, Ming LIU, Masahiro NISHIKAWA
  • Publication number: 20200129943
    Abstract: Provided is an explosive body X, i.e., an explosive body for nanodiamond synthesis, includes at least an explosive main body (10) that includes a frustum part (11) and a columnar part (12). The frustum part (11) includes an upper bottom surface (11a) including an open end of a hole (H), in which a triggering unit is received, and an angled side surface (11b) forming an imaginary apex angle ? on the upper bottom surface (11a) side. The columnar part (12) is formed contiguous with the frustum part (11) on an opposite side of the frustum part (11) to the upper bottom surface (11a) of the frustum part (11) and extends in a direction away from the upper bottom surface (11a). The explosive body for nanodiamond synthesis is suitable for improving the yield in nanodiamond synthesis by a detonation method.
    Type: Application
    Filed: May 7, 2018
    Publication date: April 30, 2020
    Applicants: DAICEL CORPORATION, NATIONAL UNIVERSITY CORPORATION KUMAMOTO UNIVERSITY
    Inventors: Tomoaki MAHIKO, Tomohide INA, Daisuke ISHIMOTO, Kazuyuki HOKAMOTO, Shigeru TANAKA
  • Patent number: 8981040
    Abstract: Provided is a cationically polymerizable resin which is rapidly cured upon irradiation with light and forms a cured product excellent in flexibility and thermal stability. The cationically polymerizable resin is obtained through radical polymerization of an oxetane-ring-containing (meth)acryloyl compound represented by following Formula (1) alone or in combination with another radically polymerizable compound. In the formula, R1 represents hydrogen atom or methyl group; R2 represents hydrogen atom or an alkyl group; and “A” represents a linear or branched chain alkylene group having 2 to 20 carbon atoms.
    Type: Grant
    Filed: January 24, 2011
    Date of Patent: March 17, 2015
    Assignee: Daicel Corporation
    Inventors: Naoko Araki, Yoshinori Funaki, Kiyoharu Tsutsumi, Tomoaki Mahiko
  • Patent number: 8975349
    Abstract: Disclosed is a cationically polymerizable resin composition which includes an oxetane-ring-containing vinyl ether compound (A) and/or an alicyclic-epoxy-containing vinyl ether compound (B); and an oligomer or polymer (C) having a molecular weight of 500 or more, being liquid at 0° C., and containing at least one of structures represented by following Formulae (1a) to (1f), wherein Rx represents hydrogen atom or methyl group; R1 to R3 each independently represent a hydrocarbon group having 1 to 5 carbon atoms; “a” is an integer of from 0 to 5; and “b” is 1 or 2. This cationically polymerizable resin composition has a low viscosity, is easy to work, cures extremely rapidly upon irradiation with light, and can give a cured object excellent in flexibility, thermal stability, and bendability after heat treatment.
    Type: Grant
    Filed: May 20, 2010
    Date of Patent: March 10, 2015
    Assignee: Daicel Corporation
    Inventors: Yoshinori Funaki, Kiyoharu Tsutsumi, Tomoaki Mahiko, Naoko Araki
  • Patent number: 8735462
    Abstract: Provided is a radical-polymerizable resin capable of giving a cured material which is satisfactorily flexible, can relax stress upon usage as an adhesive, and does not cause disadvantages such as separation at the adhesive interface or breakage of an adherend, which stress occurs between the adhesive and the adherend upon heating or cooling and is caused by difference in coefficient of thermal expansion between them. The radical-polymerizable resin is obtained through cationic polymerization of a compound represented by any of following Formulae (1a) and (1b) and a compound represented by any of following Formulae (2a), (2b), (2c), (2d), (2e), and (2f). The radical-polymerizable resin is liquid at 0 ° C. and has a weight-average molecular weight of 500 or more. Symbols in the formulae are as defined in the description.
    Type: Grant
    Filed: March 28, 2011
    Date of Patent: May 27, 2014
    Assignee: Daicel Corporation
    Inventors: Tomoaki Mahiko, Yoshinori Funaki, Kiyoharu Tsutsumi, Naoko Araki
  • Publication number: 20130315553
    Abstract: An apparatus produces an optical fiber by applying light to a photocurable composition and thereby curing the composition. The apparatus includes a nozzle for discharging the photocurable composition; a light irradiator for applying light to the fibrous photocurable composition discharged from the nozzle; and a controller that controls a light irradiation intensity at the nozzle orifice to 0.2 mW/cm2 or less. The nozzle is preferably a double-tube nozzle having an outer tube; and an inner tube arranged inside the outer tube.
    Type: Application
    Filed: January 27, 2012
    Publication date: November 28, 2013
    Applicant: DAICEL CORPORATION
    Inventors: Masaki Takebe, Tomoaki Mahiko, Yoshinori Funaki, Shinji Syuto, Hitomi Omae
  • Publication number: 20130035465
    Abstract: Provided is a radically polymerizable resin which has a low viscosity, has excellent workability, and is rapidly cured upon application of heat and/or light to form a cured product having excellent flexibility and thermal stability. The radically polymerizable resin composition is obtained by cationic polymerization of an oxetane-ring-containing (meth)acrylic ester compound represented by following Formula (1) alone or in combination with another cationically polymerizable compound. In Formula (1), R1 represents hydrogen atom or methyl group; R2 represents hydrogen atom or an alkyl group; and “A” represents a linear or branched chain alkylene group having 4 to 20 carbon atoms.
    Type: Application
    Filed: April 8, 2011
    Publication date: February 7, 2013
    Applicant: DAICEL CORPORATION
    Inventors: Naoko Araki, Yoshinori Funaki, Kiyoharu Tsutsumi, Tomoaki Mahiko
  • Publication number: 20130030078
    Abstract: Provided is a radical-polymerizable resin capable of giving a cured material which is satisfactorily flexible, can relax stress upon usage as an adhesive, and does not cause disadvantages such as separation at the adhesive interface or breakage of an adherend, which stress occurs between the adhesive and the adherend upon heating or cooling and is caused by difference in coefficient of thermal expansion between them. The radical-polymerizable resin is obtained through cationic polymerization of a compound represented by any of following Formulae (1a) and (1b) and a compound represented by any of following Formulae (2a), (2b), (2c), (2d), (2e), and (2f). The radical-polymerizable resin is liquid at 0° C. and has a weight-average molecular weight of 500 or more. Symbols in the formulae are as defined in the description.
    Type: Application
    Filed: March 28, 2011
    Publication date: January 31, 2013
    Applicant: DAICEL CORPORATION
    Inventors: Tomoaki Mahiko, Yoshinori Funaki, Kiyoharu Tsutsumi, Naoko Araki
  • Publication number: 20120309930
    Abstract: Provided is a cationically polymerizable resin which is rapidly cured upon irradiation with light and forms a cured product excellent in flexibility and thermal stability. The cationically polymerizable resin is obtained through radical polymerization of an oxetane-ring-containing (meth)acryloyl compound represented by following Formula (1) alone or in combination with another radically polymerizable compound. In the formula, R1 represents hydrogen atom or methyl group; R2 represents hydrogen atom or an alkyl group; and “A” represents a linear or branched chain alkylene group having 2 to 20 carbon atoms.
    Type: Application
    Filed: January 24, 2011
    Publication date: December 6, 2012
    Inventors: Naoko Araki, Yoshinori Funaki, Kiyoharu Tsutsumi, Tomoaki Mahiko
  • Publication number: 20120077946
    Abstract: Disclosed is a cationically polymerizable resin composition which includes an oxetane-ring-containing vinyl ether compound (A) and/or an alicyclic-epoxy-containing vinyl ether compound (B); and an oligomer or polymer (C) having a molecular weight of 500 or more, being liquid at 0° C., and containing at least one of structures represented by following Formulae (1a) to (1f), wherein Rx represents hydrogen atom or methyl group; R1 to R3 each independently represent a hydrocarbon group having 1 to 5 carbon atoms; “a” is an integer of from 0 to 5; and “b” is 1 or 2. This cationically polymerizable resin composition has a low viscosity, is easy to work, cures extremely rapidly upon irradiation with light, and can give a cured object excellent in flexibility, thermal stability, and bendability after heat treatment.
    Type: Application
    Filed: May 20, 2010
    Publication date: March 29, 2012
    Inventors: Yoshinori Funaki, Kiyoharu Tsutsumi, Tomoaki Mahiko, Naoko Araki