Abstract: The disclosure provides an installation structure and a vehicle having the installation structure. The installation structure is disposed in a vehicle and configured to install a controller, including: a floor panel, constituting a lower portion of a vehicle body of the vehicle; a floor channel, disposed in the floor panel, located at a center in a width direction of the vehicle, extending along a front-to-back direction of the vehicle, and protruding on an upside of the vehicle; a pair of brackets, connected to a corner formed by a side surface and an upper surface of the floor channel; an insulator, configured to cover the floor panel and the brackets; a carpet, disposed on the insulator; and a bracket protrusion, separated from the upper surface of the floor channel and fixing the controller on the bracket protrusion.

Abstract: There is provided an audio processing device including an estimation unit configured to estimate a user's representative perceived position of a stereoscopic image from a difference between a left-eye image and a right-eye image of the stereoscopic image displayed on a display device, and an audio controller configured to control audio output of an audio output device in accordance with the representative perceived position estimated by the estimation unit.

Abstract: There is provided an audio processing device including an estimation unit configured to estimate a user's representative perceived position of a stereoscopic image from a difference between a left-eye image and a right-eye image of the stereoscopic image displayed on a display device, and an audio controller configured to control audio output of an audio output device in accordance with the representative perceived position estimated by the estimation unit.

Abstract: A method of forming a liquid coating on a substrate that reduces the amount of consumption of the coating liquid and achieves a more even distribution of the thickness of the liquid coating film. The method may include supplying a solvent to a surface of a substrate, starting a supply of a coating liquid to the surface of the substrate while rotating the substrate at a first rotation speed, stopping a rotation of the substrate by decelerating the rotation of the substrate at a deceleration larger than 30000 rpm/sec at a point of time when the supply of the coating liquid is stopped, and then rotating the substrate at a second rotation speed. Accordingly, the dispense amount of the coating liquid is reduced and the film thickness of the coating liquid is flatten.

Abstract: A method of forming a liquid coating on a substrate that reduces the amount of consumption of the coating liquid and achieves a more even distribution of the thickness of the liquid coating film. The method may include supplying a solvent to a surface of a substrate, starting a supply of a coating liquid to the surface of the substrate while rotating the substrate at a first rotation speed, stopping a rotation of the substrate by decelerating the rotation of the substrate at a deceleration larger than 30000 rpm/sec at a point of time when the supply of the coating liquid is stopped, and then rotating the substrate at a second rotation speed. Accordingly, the dispense amount of the coating liquid is reduced and the film thickness of the coating liquid is flatten.

Abstract: The invention relates to an apparatus for spin coating for forming a resist film, an SOG film, a polyimide film, and the like in manufacturing semiconductor devices and has the object of forming a coated film with a specified and uniform thickness even in case that an amount of discharged coating solution is a little. An apparatus for spin coating of the invention comprises a rotatable table for placing a wafer, a coating solution discharging means which is set above the rotatable table and discharges a coating solution on the surface of the wafer, and a solvent discharging means which is above the rotatable table and discharges a solvent capable of dissolving the coating solution.

Abstract: A polishing apparatus comprises a pressure container having a first opening at its bottom and being rotatable about an axis perpendicular to a plane of the first opening; a wafer support coupled elastically to the first opening, sealing the first opening hermetically and having a wafer supporting surface; and a lower surface plate disposed underneath the wafer supporting surface and having a polishing surface approximately parallel to the wafer supporting surface. The wafer support may be provided with flatness adjusting means for selectively applying a larger pressure on a region of the wafer held on the wafer supporting surface than a pressure on other region. The flatness adjusting means may comprise a plurality of pressing pins, or may comprise a hollow within the wafer support, a surface plate having elasticity and sealing the hollow, and means for applying pressure to the hollow. Wafer can be polished under uniform pressure applied on the back surface. Flatness of the wafer can be improved.