Patents by Inventor Tomoaki Nakanishi

Tomoaki Nakanishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240137744
    Abstract: It is intended to provide a communication terminal capable of preventing an operator of the communication terminal from recognizing processing running in the communication terminal. A communication terminal (10) according to the present disclosure includes a communication unit (11) that transmits an emergency message and a control unit (12) that disables a user's operation of the communication terminal or a function executed by a user's operation of the communication terminal after the emergency message is transmitted, and the communication unit (11) starts data communication with a monitoring terminal and transmits data to the monitoring terminal while the function is disabled.
    Type: Application
    Filed: March 30, 2021
    Publication date: April 25, 2024
    Applicant: NEC Corporation
    Inventors: Motoharu Ohtake, Kosel Kobayashi, Hiroaki Aminaka, Shinji Miyazaki, Tomoaki Nakanishi
  • Publication number: 20230265275
    Abstract: This disclosure relates to a curable composition that includes at least first, second, and third polymers. The first polymer includes a first monomer unit and a second monomer unit different from the first monomer unit, in which the first monomer unit has the structure of formula (I) defined in the Specification and the second monomer unit has the structure of formula (II) defined in the Specification. The second polymer includes at least about 60 wt % of a styrene monomer unit; and the third polymer includes at most about 60 wt % of a styrene monomer unit. This disclosure also relates to using the composition to form a free-standing film, a laminate, a prepreg, and/or a printed circuit board.
    Type: Application
    Filed: February 21, 2023
    Publication date: August 24, 2023
    Inventors: Tomoaki Nakanishi, Wei Qiang, Naichun Liu, Gregory Roy Almen, Kevin Bivona, Yoji Nakajima, William Douglas Leys
  • Patent number: 10633529
    Abstract: To provide a resin composition having excellent mechanical strength and elongation, its melt-kneaded product and a molding product thereof. A resin composition comprising a fluororesin having a hydroxy group or a carbonyl group, an ester bond-containing resin having no fluorine atom and a transesterification catalyst, a melt-kneaded product obtained by melt-kneading the resin composition, a molding product, film or sheet obtained from the resin composition or the melt-kneaded product, a laminated product, a backsheet for a solar cell, and a method for producing a molding product using the resin composition or the melt-kneaded product.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: April 28, 2020
    Assignee: AGC Inc.
    Inventors: Tomoaki Nakanishi, Toshiaki Sawada, Seigo Kotera, Shinji Wada
  • Publication number: 20160272805
    Abstract: To provide a resin composition having excellent mechanical strength and elongation, its melt-kneaded product and a molding product thereof. A resin composition comprising a fluororesin having a hydroxy group or a carbonyl group, an ester bond-containing resin having no fluorine atom and a transesterification catalyst, a melt-kneaded product obtained by melt-kneading the resin composition, a molding product, film or sheet obtained from the resin composition or the melt-kneaded product, a laminated product, a backsheet for a solar cell, and a method for producing a molding product using the resin composition or the melt-kneaded product.
    Type: Application
    Filed: May 31, 2016
    Publication date: September 22, 2016
    Applicant: ASAHI GLASS COMPANY, LIMITED
    Inventors: Tomoaki NAKANISHI, Toshiaki SAWADA, Seigo KOTERA, Shinji WADA
  • Publication number: 20150240066
    Abstract: To provide a polymer composition containing an ethylene/tetrafluoroethylene copolymer, which is excellent in elongation, a molded product thereof, a film and a backsheet for a solar cell. A polymer composition comprising an ethylene/tetrafluoroethylene copolymer, a poly(meth)acrylate and a fluoroelastomer; a molded product made of such a composition; a method for producing such a molded product; and a backsheet for a solar cell, which contains a film made of the polymer composition.
    Type: Application
    Filed: May 8, 2015
    Publication date: August 27, 2015
    Applicant: ASAHI GLASS COMPANY, LIMITED
    Inventors: Tomoaki NAKANISHI, Seigo Kotera, Toshiaki Sawada
  • Publication number: 20150228829
    Abstract: To provide a blended polymer containing an ethylene/tetrafluoroethylene copolymer, which is excellent in weather resistance and has a high thermal deformation temperature, a molded product such as a film thereof, a back sheet for a solar cell provided with such a film, etc., and a method for producing such a molded product. A blended polymer which comprises an ethylene/tetrafluoroethylene copolymer and a polymethyl methacrylate, wherein the mass ratio of the ethylene/tetrafluoroethylene copolymer to the total mass of the ethylene/tetrafluoroethylene copolymer and the polymethyl methacrylate, is from 50 to 75%, and which has a microphase-separated structure wherein the continuous phase is the ethylene/tetrafluoroethylene copolymer, and the dispersed phase is the polymethyl methacrylate.
    Type: Application
    Filed: April 21, 2015
    Publication date: August 13, 2015
    Applicant: Asahi Glass Company, Limited
    Inventors: Toshiaki SAWADA, Seigo Kotera, Tomoaki Nakanishi
  • Patent number: 8041397
    Abstract: A mobile communication terminal apparatus having a panel used for a predetermined operation and image display and storage unit for recording various pieces of information includes a macro information setting unit, line model setting unit, macro information read unit, and macro processing unit. The macro information setting unit sets macro information which performs a series of operations. The line model setting unit sets linear line model information input from the panel for the macro information set by the macro information setting unit, and records the set line model information and macro information in the storage unit in correspondence with each other. The macro information read unit reads out, from the storage unit, macro information corresponding to line model information input from the panel. The macro processing unit executes a series of operations of the macro information read out by the macro information read unit. A recording medium which records a data operation process program is also disclosed.
    Type: Grant
    Filed: May 13, 2004
    Date of Patent: October 18, 2011
    Assignee: NEC Corporation
    Inventor: Tomoaki Nakanishi
  • Patent number: 8032607
    Abstract: Each of mobile terminals and base stations in a mobile communication system detects the file size of multimedia data from normal command file and calculates the communication costs based on the file size and unit price of the call type, and selects either a packet switched call or a circuit switched call for transmitting the multimedia data file based on the communication costs involved.
    Type: Grant
    Filed: July 1, 2003
    Date of Patent: October 4, 2011
    Assignee: NEC Corporation
    Inventor: Tomoaki Nakanishi
  • Patent number: 7950140
    Abstract: A connection device for an electric component 4 is constituted by two units 2 and 3, height position change means that changes the height position of one end 4a of the electric component 4 relative to the other end 4b is provided for a second unit 3, and the size and weight of a first unit 2 that connects the electric component 4 to a wiring board can be reduced. Therefore, the electric component 4 can be connected, under a low load, to a limited connection region of a wiring board.
    Type: Grant
    Filed: February 5, 2008
    Date of Patent: May 31, 2011
    Assignee: Panasonic Corporation
    Inventor: Tomoaki Nakanishi
  • Patent number: 7743903
    Abstract: A panel feeding device, panel feeding method, and panel assembling device are provided that are capable of stably conveying a large panel. On panel assembling where a display panel is assembled by joining substrate (7) to glass panel (5), in a panel feeding device that feeds glass panel (5) to a working position, a panel conveying means that conveys glass panel (5) is supported by a pair of placing tables (4), each moving along carrier rails, at both ends of the bottom surface, and substrate 7 bonded to glass panel (5) extending from glass panel (5) is supported by supporting members (24c) and (25c) provided extending from placing table (4). This makeup enables stably conveying a large panel.
    Type: Grant
    Filed: December 27, 2005
    Date of Patent: June 29, 2010
    Assignee: Panasonic Corporation
    Inventor: Tomoaki Nakanishi
  • Patent number: 7655108
    Abstract: Display panel assembly apparatus for assembling a display panel by bonding a driver substrate onto a glass panel via a connector and bonding material. A panel positioning table retains the glass panel in which the connector is bonded to its edge, and positions the glass panel with respect to a bonder from one side. The substrate to which a bonding tape is applied by a bonding tape applicator is transferred to the bonder from the other side by circulating a substrate holder on which the substrate is placed using a circulatory transport mechanism. The connector prebonded on the glass panel and the substrate are then bonded via the bonding tape. Adoption of this configuration for the display panel assembly apparatus and assembly method reduces the apparatus installation area while achieving high productivity.
    Type: Grant
    Filed: September 1, 2005
    Date of Patent: February 2, 2010
    Assignee: Panasonic Corporation
    Inventor: Tomoaki Nakanishi
  • Publication number: 20080295321
    Abstract: A connection device for an electric component 4 is constituted by two units 2 and 3, height position change means that changes the height position of one end 4a of the electric component 4 relative to the other end 4b is provided for a second unit 3, and the size and weight of a first unit 2 that connects the electric component 4 to a wiring board can be reduced. Therefore, the electric component 4 can be connected, under a low load, to a limited connection region of a wiring board.
    Type: Application
    Filed: February 5, 2008
    Publication date: December 4, 2008
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventor: Tomoaki Nakanishi
  • Patent number: 7290331
    Abstract: In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting stage, and the upper chips picked up from a second component tray by a component transporting head are vertically flipped around a rotation axis and transferred to a mounting head at a component transferring position, then the upper chips held by the mounting head are descended and mounted by solder bonding on the lower chips held by the mounting stage at a component mounting position. Integrated components formed by mounting are carried out of the mounting stage by the component transporting head and stored in a first component tray in a component storing unit.
    Type: Grant
    Filed: June 27, 2006
    Date of Patent: November 6, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shunji Onobori, Shozo Minamitani, Shuichi Hirata, Tomoaki Nakanishi
  • Patent number: 7281322
    Abstract: In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting stage, and the upper chips picked up from a second component tray by a component transporting head are vertically flipped around a rotation axis and transferred to a mounting head at a component transferring position, then the upper chips held by the mounting head are descended and mounted by solder bonding on the lower chips held by the mounting stage at a component mounting position. Integrated components formed by mounting are carried out of the mounting stage by the component transporting head and stored in a first component tray in a component storing unit.
    Type: Grant
    Filed: June 27, 2006
    Date of Patent: October 16, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shunji Onobori, Shozo Minamitani, Shuichi Hirata, Tomoaki Nakanishi
  • Publication number: 20070006453
    Abstract: In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting stage, and the upper chips picked up from a second component tray by a component transporting head are vertically flipped around a rotation axis and transferred to a mounting head at a component transferring position, then the upper chips held by the mounting head are descended and mounted by solder bonding on the lower chips held by the mounting stage at a component mounting position. Integrated components formed by mounting are carried out of the mounting stage by the component transporting head and stored in a first component tray in a component storing unit.
    Type: Application
    Filed: June 27, 2006
    Publication date: January 11, 2007
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Shunji Onobori, Shozo Minamitani, Shuichi Hirata, Tomoaki Nakanishi
  • Publication number: 20070006454
    Abstract: In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting stage, and the upper chips picked up from a second component tray by a component transporting head are vertically flipped around a rotation axis and transferred to a mounting head at a component transferring position, then the upper chips held by the mounting head are descended and mounted by solder bonding on the lower chips held by the mounting stage at a component mounting position. Integrated components formed by mounting are carried out of the mounting stage by the component transporting head and stored in a first component tray in a component storing unit.
    Type: Application
    Filed: June 27, 2006
    Publication date: January 11, 2007
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Shunji Onobori, Shozo Minamitani, Shuichi Hirata, Tomoaki Nakanishi
  • Publication number: 20060154551
    Abstract: A panel feeding device, panel feeding method, and panel assembling device are provided that are capable of stably conveying a large panel. On panel assembling where a display panel is assembled by joining substrate (7) to glass panel (5), in a panel feeding device that feeds glass panel (5) to a working position, a panel conveying means that conveys glass panel (5) is supported by a pair of placing tables (4), each moving along carrier rails, at both ends of the bottom surface, and substrate 7 bonded to glass panel (5) extending from glass panel (5) is supported by supporting members (24c) and (25c) provided extending from placing table (4). This makeup enables stably conveying a large panel.
    Type: Application
    Filed: December 27, 2005
    Publication date: July 13, 2006
    Inventor: Tomoaki Nakanishi
  • Publication number: 20060108045
    Abstract: In a case that a panel substrate to which a flexible substrate is bonded in a protruding manner is to be bonded by pressure to an auxiliary substrate, the panel substrate and the auxiliary substrate are placed on a panel mounting table and a substrate mounting table, respectively. Then, both mounting tables are moved such that the protruding portion of the flexible substrate should be located at the bonding position of the auxiliary substrate. Then, the flexible substrate and the auxiliary substrate are bonded by pressure by a pressure bonding head. When the auxiliary substrate bonded by pressure is removed from the substrate mounting table, a support member provided in the panel substrate mounting table supports directly the auxiliary substrate from the downside so that the auxiliary substrate should not droop relative to the panel substrate.
    Type: Application
    Filed: November 7, 2005
    Publication date: May 25, 2006
    Inventor: Tomoaki Nakanishi
  • Publication number: 20060068677
    Abstract: Display panel assembly apparatus for assembling a display panel by bonding a driver substrate onto a glass panel via a connector and bonding material. A panel positioning table retains the glass panel in which the connector is bonded to its edge, and positions the glass panel with respect to a bonder from one side. The substrate to which a bonding tape is applied by a bonding tape applicator is transferred to the bonder from the other side by circulating a substrate holder on which the substrate is placed using a circulatory transport mechanism. The connector prebonded on the glass panel and the substrate are then bonded via the bonding tape. Adoption of this configuration for the display panel assembly apparatus and assembly method reduces the apparatus installation area while achieving high productivity.
    Type: Application
    Filed: September 1, 2005
    Publication date: March 30, 2006
    Inventor: Tomoaki Nakanishi
  • Publication number: 20040229657
    Abstract: A mobile communication terminal apparatus having a panel used for a predetermined operation and image display and storage unit for recording various pieces of information includes a macro information setting unit, line model setting unit, macro information read unit, and macro processing unit. The macro information setting unit sets macro information which performs a series of operations. The line model setting unit sets linear line model information input from the panel for the macro information set by the macro information setting unit, and records the set line model information and macro information in the storage unit in correspondence with each other. The macro information read unit reads out, from the storage unit, macro information corresponding to line model information input from the panel. The macro processing unit executes a series of operations of the macro information read out by the macro information read unit. A recording medium which records a data operation process program is also disclosed.
    Type: Application
    Filed: May 13, 2004
    Publication date: November 18, 2004
    Applicant: NEC CORPORATION
    Inventor: Tomoaki Nakanishi