Patents by Inventor Tomoaki Nakanishi
Tomoaki Nakanishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240137744Abstract: It is intended to provide a communication terminal capable of preventing an operator of the communication terminal from recognizing processing running in the communication terminal. A communication terminal (10) according to the present disclosure includes a communication unit (11) that transmits an emergency message and a control unit (12) that disables a user's operation of the communication terminal or a function executed by a user's operation of the communication terminal after the emergency message is transmitted, and the communication unit (11) starts data communication with a monitoring terminal and transmits data to the monitoring terminal while the function is disabled.Type: ApplicationFiled: March 30, 2021Publication date: April 25, 2024Applicant: NEC CorporationInventors: Motoharu Ohtake, Kosel Kobayashi, Hiroaki Aminaka, Shinji Miyazaki, Tomoaki Nakanishi
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Publication number: 20230265275Abstract: This disclosure relates to a curable composition that includes at least first, second, and third polymers. The first polymer includes a first monomer unit and a second monomer unit different from the first monomer unit, in which the first monomer unit has the structure of formula (I) defined in the Specification and the second monomer unit has the structure of formula (II) defined in the Specification. The second polymer includes at least about 60 wt % of a styrene monomer unit; and the third polymer includes at most about 60 wt % of a styrene monomer unit. This disclosure also relates to using the composition to form a free-standing film, a laminate, a prepreg, and/or a printed circuit board.Type: ApplicationFiled: February 21, 2023Publication date: August 24, 2023Inventors: Tomoaki Nakanishi, Wei Qiang, Naichun Liu, Gregory Roy Almen, Kevin Bivona, Yoji Nakajima, William Douglas Leys
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Patent number: 10633529Abstract: To provide a resin composition having excellent mechanical strength and elongation, its melt-kneaded product and a molding product thereof. A resin composition comprising a fluororesin having a hydroxy group or a carbonyl group, an ester bond-containing resin having no fluorine atom and a transesterification catalyst, a melt-kneaded product obtained by melt-kneading the resin composition, a molding product, film or sheet obtained from the resin composition or the melt-kneaded product, a laminated product, a backsheet for a solar cell, and a method for producing a molding product using the resin composition or the melt-kneaded product.Type: GrantFiled: May 31, 2016Date of Patent: April 28, 2020Assignee: AGC Inc.Inventors: Tomoaki Nakanishi, Toshiaki Sawada, Seigo Kotera, Shinji Wada
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Publication number: 20160272805Abstract: To provide a resin composition having excellent mechanical strength and elongation, its melt-kneaded product and a molding product thereof. A resin composition comprising a fluororesin having a hydroxy group or a carbonyl group, an ester bond-containing resin having no fluorine atom and a transesterification catalyst, a melt-kneaded product obtained by melt-kneading the resin composition, a molding product, film or sheet obtained from the resin composition or the melt-kneaded product, a laminated product, a backsheet for a solar cell, and a method for producing a molding product using the resin composition or the melt-kneaded product.Type: ApplicationFiled: May 31, 2016Publication date: September 22, 2016Applicant: ASAHI GLASS COMPANY, LIMITEDInventors: Tomoaki NAKANISHI, Toshiaki SAWADA, Seigo KOTERA, Shinji WADA
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Publication number: 20150240066Abstract: To provide a polymer composition containing an ethylene/tetrafluoroethylene copolymer, which is excellent in elongation, a molded product thereof, a film and a backsheet for a solar cell. A polymer composition comprising an ethylene/tetrafluoroethylene copolymer, a poly(meth)acrylate and a fluoroelastomer; a molded product made of such a composition; a method for producing such a molded product; and a backsheet for a solar cell, which contains a film made of the polymer composition.Type: ApplicationFiled: May 8, 2015Publication date: August 27, 2015Applicant: ASAHI GLASS COMPANY, LIMITEDInventors: Tomoaki NAKANISHI, Seigo Kotera, Toshiaki Sawada
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Publication number: 20150228829Abstract: To provide a blended polymer containing an ethylene/tetrafluoroethylene copolymer, which is excellent in weather resistance and has a high thermal deformation temperature, a molded product such as a film thereof, a back sheet for a solar cell provided with such a film, etc., and a method for producing such a molded product. A blended polymer which comprises an ethylene/tetrafluoroethylene copolymer and a polymethyl methacrylate, wherein the mass ratio of the ethylene/tetrafluoroethylene copolymer to the total mass of the ethylene/tetrafluoroethylene copolymer and the polymethyl methacrylate, is from 50 to 75%, and which has a microphase-separated structure wherein the continuous phase is the ethylene/tetrafluoroethylene copolymer, and the dispersed phase is the polymethyl methacrylate.Type: ApplicationFiled: April 21, 2015Publication date: August 13, 2015Applicant: Asahi Glass Company, LimitedInventors: Toshiaki SAWADA, Seigo Kotera, Tomoaki Nakanishi
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Patent number: 8041397Abstract: A mobile communication terminal apparatus having a panel used for a predetermined operation and image display and storage unit for recording various pieces of information includes a macro information setting unit, line model setting unit, macro information read unit, and macro processing unit. The macro information setting unit sets macro information which performs a series of operations. The line model setting unit sets linear line model information input from the panel for the macro information set by the macro information setting unit, and records the set line model information and macro information in the storage unit in correspondence with each other. The macro information read unit reads out, from the storage unit, macro information corresponding to line model information input from the panel. The macro processing unit executes a series of operations of the macro information read out by the macro information read unit. A recording medium which records a data operation process program is also disclosed.Type: GrantFiled: May 13, 2004Date of Patent: October 18, 2011Assignee: NEC CorporationInventor: Tomoaki Nakanishi
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Patent number: 8032607Abstract: Each of mobile terminals and base stations in a mobile communication system detects the file size of multimedia data from normal command file and calculates the communication costs based on the file size and unit price of the call type, and selects either a packet switched call or a circuit switched call for transmitting the multimedia data file based on the communication costs involved.Type: GrantFiled: July 1, 2003Date of Patent: October 4, 2011Assignee: NEC CorporationInventor: Tomoaki Nakanishi
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Patent number: 7950140Abstract: A connection device for an electric component 4 is constituted by two units 2 and 3, height position change means that changes the height position of one end 4a of the electric component 4 relative to the other end 4b is provided for a second unit 3, and the size and weight of a first unit 2 that connects the electric component 4 to a wiring board can be reduced. Therefore, the electric component 4 can be connected, under a low load, to a limited connection region of a wiring board.Type: GrantFiled: February 5, 2008Date of Patent: May 31, 2011Assignee: Panasonic CorporationInventor: Tomoaki Nakanishi
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Patent number: 7743903Abstract: A panel feeding device, panel feeding method, and panel assembling device are provided that are capable of stably conveying a large panel. On panel assembling where a display panel is assembled by joining substrate (7) to glass panel (5), in a panel feeding device that feeds glass panel (5) to a working position, a panel conveying means that conveys glass panel (5) is supported by a pair of placing tables (4), each moving along carrier rails, at both ends of the bottom surface, and substrate 7 bonded to glass panel (5) extending from glass panel (5) is supported by supporting members (24c) and (25c) provided extending from placing table (4). This makeup enables stably conveying a large panel.Type: GrantFiled: December 27, 2005Date of Patent: June 29, 2010Assignee: Panasonic CorporationInventor: Tomoaki Nakanishi
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Patent number: 7655108Abstract: Display panel assembly apparatus for assembling a display panel by bonding a driver substrate onto a glass panel via a connector and bonding material. A panel positioning table retains the glass panel in which the connector is bonded to its edge, and positions the glass panel with respect to a bonder from one side. The substrate to which a bonding tape is applied by a bonding tape applicator is transferred to the bonder from the other side by circulating a substrate holder on which the substrate is placed using a circulatory transport mechanism. The connector prebonded on the glass panel and the substrate are then bonded via the bonding tape. Adoption of this configuration for the display panel assembly apparatus and assembly method reduces the apparatus installation area while achieving high productivity.Type: GrantFiled: September 1, 2005Date of Patent: February 2, 2010Assignee: Panasonic CorporationInventor: Tomoaki Nakanishi
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Publication number: 20080295321Abstract: A connection device for an electric component 4 is constituted by two units 2 and 3, height position change means that changes the height position of one end 4a of the electric component 4 relative to the other end 4b is provided for a second unit 3, and the size and weight of a first unit 2 that connects the electric component 4 to a wiring board can be reduced. Therefore, the electric component 4 can be connected, under a low load, to a limited connection region of a wiring board.Type: ApplicationFiled: February 5, 2008Publication date: December 4, 2008Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventor: Tomoaki Nakanishi
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Patent number: 7290331Abstract: In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting stage, and the upper chips picked up from a second component tray by a component transporting head are vertically flipped around a rotation axis and transferred to a mounting head at a component transferring position, then the upper chips held by the mounting head are descended and mounted by solder bonding on the lower chips held by the mounting stage at a component mounting position. Integrated components formed by mounting are carried out of the mounting stage by the component transporting head and stored in a first component tray in a component storing unit.Type: GrantFiled: June 27, 2006Date of Patent: November 6, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shunji Onobori, Shozo Minamitani, Shuichi Hirata, Tomoaki Nakanishi
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Patent number: 7281322Abstract: In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting stage, and the upper chips picked up from a second component tray by a component transporting head are vertically flipped around a rotation axis and transferred to a mounting head at a component transferring position, then the upper chips held by the mounting head are descended and mounted by solder bonding on the lower chips held by the mounting stage at a component mounting position. Integrated components formed by mounting are carried out of the mounting stage by the component transporting head and stored in a first component tray in a component storing unit.Type: GrantFiled: June 27, 2006Date of Patent: October 16, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shunji Onobori, Shozo Minamitani, Shuichi Hirata, Tomoaki Nakanishi
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Publication number: 20070006453Abstract: In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting stage, and the upper chips picked up from a second component tray by a component transporting head are vertically flipped around a rotation axis and transferred to a mounting head at a component transferring position, then the upper chips held by the mounting head are descended and mounted by solder bonding on the lower chips held by the mounting stage at a component mounting position. Integrated components formed by mounting are carried out of the mounting stage by the component transporting head and stored in a first component tray in a component storing unit.Type: ApplicationFiled: June 27, 2006Publication date: January 11, 2007Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Shunji Onobori, Shozo Minamitani, Shuichi Hirata, Tomoaki Nakanishi
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Publication number: 20070006454Abstract: In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting stage, and the upper chips picked up from a second component tray by a component transporting head are vertically flipped around a rotation axis and transferred to a mounting head at a component transferring position, then the upper chips held by the mounting head are descended and mounted by solder bonding on the lower chips held by the mounting stage at a component mounting position. Integrated components formed by mounting are carried out of the mounting stage by the component transporting head and stored in a first component tray in a component storing unit.Type: ApplicationFiled: June 27, 2006Publication date: January 11, 2007Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Shunji Onobori, Shozo Minamitani, Shuichi Hirata, Tomoaki Nakanishi
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Publication number: 20060154551Abstract: A panel feeding device, panel feeding method, and panel assembling device are provided that are capable of stably conveying a large panel. On panel assembling where a display panel is assembled by joining substrate (7) to glass panel (5), in a panel feeding device that feeds glass panel (5) to a working position, a panel conveying means that conveys glass panel (5) is supported by a pair of placing tables (4), each moving along carrier rails, at both ends of the bottom surface, and substrate 7 bonded to glass panel (5) extending from glass panel (5) is supported by supporting members (24c) and (25c) provided extending from placing table (4). This makeup enables stably conveying a large panel.Type: ApplicationFiled: December 27, 2005Publication date: July 13, 2006Inventor: Tomoaki Nakanishi
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Publication number: 20060108045Abstract: In a case that a panel substrate to which a flexible substrate is bonded in a protruding manner is to be bonded by pressure to an auxiliary substrate, the panel substrate and the auxiliary substrate are placed on a panel mounting table and a substrate mounting table, respectively. Then, both mounting tables are moved such that the protruding portion of the flexible substrate should be located at the bonding position of the auxiliary substrate. Then, the flexible substrate and the auxiliary substrate are bonded by pressure by a pressure bonding head. When the auxiliary substrate bonded by pressure is removed from the substrate mounting table, a support member provided in the panel substrate mounting table supports directly the auxiliary substrate from the downside so that the auxiliary substrate should not droop relative to the panel substrate.Type: ApplicationFiled: November 7, 2005Publication date: May 25, 2006Inventor: Tomoaki Nakanishi
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Publication number: 20060068677Abstract: Display panel assembly apparatus for assembling a display panel by bonding a driver substrate onto a glass panel via a connector and bonding material. A panel positioning table retains the glass panel in which the connector is bonded to its edge, and positions the glass panel with respect to a bonder from one side. The substrate to which a bonding tape is applied by a bonding tape applicator is transferred to the bonder from the other side by circulating a substrate holder on which the substrate is placed using a circulatory transport mechanism. The connector prebonded on the glass panel and the substrate are then bonded via the bonding tape. Adoption of this configuration for the display panel assembly apparatus and assembly method reduces the apparatus installation area while achieving high productivity.Type: ApplicationFiled: September 1, 2005Publication date: March 30, 2006Inventor: Tomoaki Nakanishi
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Publication number: 20040229657Abstract: A mobile communication terminal apparatus having a panel used for a predetermined operation and image display and storage unit for recording various pieces of information includes a macro information setting unit, line model setting unit, macro information read unit, and macro processing unit. The macro information setting unit sets macro information which performs a series of operations. The line model setting unit sets linear line model information input from the panel for the macro information set by the macro information setting unit, and records the set line model information and macro information in the storage unit in correspondence with each other. The macro information read unit reads out, from the storage unit, macro information corresponding to line model information input from the panel. The macro processing unit executes a series of operations of the macro information read out by the macro information read unit. A recording medium which records a data operation process program is also disclosed.Type: ApplicationFiled: May 13, 2004Publication date: November 18, 2004Applicant: NEC CORPORATIONInventor: Tomoaki Nakanishi