Patents by Inventor Tomoaki OKUNO
Tomoaki OKUNO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10187991Abstract: A suspension board with circuit includes a metal supporting layer, a base insulating layer, a conductive pattern including a wire, and a cover insulating layer. The conductive pattern includes a terminal for being connected to a piezoelectric element, connected to the wire, and disposed next to the base insulating layer in a direction perpendicular to the thickness direction. The terminal is exposed from the metal supporting layer and the base insulating layer when viewed from the other side in the thickness direction, and extends along the direction perpendicular to the thickness direction so as to go away from the base insulating layer next thereto. At least a portion of a peripheral end surface of the terminal is covered with the cover insulating layer.Type: GrantFiled: July 31, 2017Date of Patent: January 22, 2019Assignee: NITTO DENKO CORPORATIONInventors: Takatoshi Sakakura, Tomoaki Okuno
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Patent number: 10080279Abstract: A wired circuit board, including a metal supporting layer; an insulating layer formed on one side of the metal supporting layer in a thickness direction thereof; and a conductive layer having a plurality of terminal portions placed to be spaced apart from each other and formed on one side of the insulating layer in the thickness direction. The insulating layer has a first opening which is formed to include the plurality of terminal portions, and the metal supporting layer includes a second opening formed to include the plurality of terminal portions, when projected in the thickness direction. The wired circuit board further includes at least one reinforcing insulating portion which is placed between the plurality of terminal portions in the first opening, and/or at least one reinforcing metal supporting portion which is placed between the plurality of terminal portions in the second opening, when projected in the thickness direction.Type: GrantFiled: September 3, 2015Date of Patent: September 18, 2018Assignee: NITTO DENKO CORPORATIONInventors: Tomoaki Okuno, Saori Kanezaki, Tsuyoshi Oguro, Takeshi Kawakami
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Patent number: 10034388Abstract: A suspension board with circuit includes a metal supporting layer, a base insulating layer disposed at one side in a thickness direction of the metal supporting layer, a conductive pattern including a wire disposed at one side in the thickness direction of the base insulating layer and a terminal exposed from the metal supporting layer and the base insulating layer when viewed from the other side in the thickness direction, a piezoelectric element disposed at the other side in the thickness direction with respect to the terminal and including an element terminal electrically connected to the terminal, and a solder layer disposed between the terminal and the element terminal. The solder layer has a solder composition containing Sn, Ag, and Cu, and the solder layer has a thickness in the thickness direction of 50 ?m or less.Type: GrantFiled: July 31, 2017Date of Patent: July 24, 2018Assignee: NITTO DENKO CORPORATIONInventors: Takatoshi Sakakura, Tomoaki Okuno, Takahiro Takano
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Patent number: 9980390Abstract: A suspension board with circuit assembly sheet includes an assembly provided region provided with a plurality of suspension boards with circuits at spaced intervals to each other along one direction and a margin region provided at least at one side in a crossing direction with respect to the one direction of the assembly provided region. In the assembly provided region, a first opening portion is provided between the suspension boards with circuits that are adjacent to each other and in the margin region, a fragile portion is provided.Type: GrantFiled: January 26, 2015Date of Patent: May 22, 2018Assignee: NITTO DENKO CORPORATIONInventors: Naohiro Terada, Yoshito Fujimura, Tomoaki Okuno
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Publication number: 20180070457Abstract: A suspension board with circuit includes a metal supporting layer, a base insulating layer disposed at one side in a thickness direction of the metal supporting layer, a conductive pattern including a wire disposed at one side in the thickness direction of the base insulating layer and a terminal exposed from the metal supporting layer and the base insulating layer when viewed from the other side in the thickness direction, a piezoelectric element disposed at the other side in the thickness direction with respect to the terminal and including an element terminal electrically connected to the terminal, and a solder layer disposed between the terminal and the element terminal. The solder layer has a solder composition containing Sn, Ag, and Cu, and the solder layer has a thickness in the thickness direction of 50 ?m or less.Type: ApplicationFiled: July 31, 2017Publication date: March 8, 2018Applicant: NITTO DENKO CORPORATIONInventors: Takatoshi SAKAKURA, Tomoaki OKUNO, Takahiro TAKANO
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Publication number: 20180070448Abstract: A suspension board with circuit includes a metal supporting layer, a base insulating layer, a conductive pattern including a wire, and a cover insulating layer. The conductive pattern includes a terminal for being connected to a piezoelectric element, connected to the wire, and disposed next to the base insulating layer in a direction perpendicular to the thickness direction. The terminal is exposed from the metal supporting layer and the base insulating layer when viewed from the other side in the thickness direction, and extends along the direction perpendicular to the thickness direction so as to go away from the base insulating layer next thereto. At least a portion of a peripheral end surface of the terminal is covered with the cover insulating layer.Type: ApplicationFiled: July 31, 2017Publication date: March 8, 2018Applicant: NITTO DENKO CORPORATIONInventors: Takatoshi SAKAKURA, Tomoaki OKUNO
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Publication number: 20170330590Abstract: A suspension board with circuit includes a first terminal and a second terminal disposed at spaced intervals to each other, a piezoelectric element disposed between the first terminal and the second terminal so as to be electrically connected to the first terminal and the second terminal, a facing portion facing the piezoelectric element at the second terminal-side relative to the center between the first terminal and the second terminal, and a compensation portion compensating a degree of inclination of the piezoelectric element produced at the time of contact of the facing portion with the piezoelectric element at the first terminal-side relative to the center between the first terminal and the second terminal.Type: ApplicationFiled: May 2, 2017Publication date: November 16, 2017Applicant: NITTO DENKO CORPORATIONInventors: Tomoaki OKUNO, Takatoshi SAKAKURA, Takahiro TAKANO
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Publication number: 20170229635Abstract: The wired circuit board includes a conductive layer having a terminal; a gold plated layer provided on the surface of the terminal; and a solder layer provided on the surface of the gold plated layer and provided so that the terminal and the electronic component can be electrically connected. The solder layer is made of a solder composition containing Sn, Bi, Cu and/or Ni, and the thickness Tsolder of the solder layer relative to the thickness TAu of the gold plated layer is 16 or more.Type: ApplicationFiled: February 6, 2017Publication date: August 10, 2017Applicant: NITTO DENKO CORPORATIONInventors: Takahiro TAKANO, Takatoshi SAKAKURA, Tomoaki OKUNO
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Patent number: 9576603Abstract: A suspension board with circuit includes a first layer having electrically conductive properties, a second layer having insulation properties and formed at one side in a thickness direction of the first layer, a third layer having electrically conductive properties and formed at one side in the thickness direction of the second layer, and a fourth layer having insulation properties and formed at one side in the thickness direction of the third layer. The first layer includes an electronic component connecting terminal for being electrically connected to an electronic component. The second layer includes a first opening portion passing through in the thickness direction. The third layer includes a first conductive circuit having a magnetic head, and a second conductive circuit. The fourth layer and the second layer are formed with a second opening portion.Type: GrantFiled: November 24, 2015Date of Patent: February 21, 2017Assignee: NITTO DENKO CORPORATIONInventors: Tomoaki Okuno, Yoshito Fujimura, Naohiro Terada
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Publication number: 20160234936Abstract: A suspension board with circuit includes a first layer having electrically conductive properties, a second layer having insulation properties and formed at one side in a thickness direction of the first layer, a third layer having electrically conductive properties and formed at one side in the thickness direction of the second layer, and a fourth layer having insulation properties and formed at one side in the thickness direction of the third layer. The first layer includes an electronic component connecting terminal for being electrically connected to an electronic component. The second layer includes a first opening portion passing through in the thickness direction. The third layer includes a first conductive circuit having a magnetic head, and a second conductive circuit. The fourth layer and the second layer are formed with a second opening portion.Type: ApplicationFiled: November 24, 2015Publication date: August 11, 2016Applicant: NITTO DENKO CORPORATIONInventors: Tomoaki OKUNO, Yoshito FUJIMURA, Naohiro TERADA
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Publication number: 20150382453Abstract: A wired circuit board, including a metal supporting layer; an insulating layer formed on one side of the metal supporting layer in a thickness direction thereof; and a conductive layer having a plurality of terminal portions placed to be spaced apart from each other and formed on one side of the insulating layer in the thickness direction. The insulating layer has a first opening which is formed to include the plurality of terminal portions, and the metal supporting layer includes a second opening formed to include the plurality of terminal portions, when projected in the thickness direction. The wired circuit board further includes at least one reinforcing insulating portion which is placed between the plurality of terminal portions in the first opening, and/or at least one reinforcing metal supporting portion which is placed between the plurality of terminal portions in the second opening, when projected in the thickness direction.Type: ApplicationFiled: September 3, 2015Publication date: December 31, 2015Applicant: NITTO DENKO CORPORATIONInventors: Tomoaki OKUNO, Saori KANEZAKI, Tsuyoshi OGURO, Takeshi KAWAKAMI
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Patent number: 9167693Abstract: A method of producing a wired circuit board includes a first step of preparing a metal supporting layer, a second step of forming, on one side of the metal supporting layer in a thickness direction thereof, an insulating layer having a first opening, and a plurality of terminal formation portions, a third step of forming, on one side of the insulating layer in the thickness direction, a conductive layer having a plurality of terminal portions each corresponding to the plurality of terminal formation portions, a fourth step of partially removing the metal supporting layer to form a second opening and at least one reinforcing metal supporting portion placed between the plurality of terminal formation portions, and a fifth step of removing the plurality of terminal formation portions exposed from the second opening to expose both side surfaces of the plurality of terminal portions in the thickness direction.Type: GrantFiled: November 21, 2013Date of Patent: October 20, 2015Assignee: NITTO DENKO CORPORATIONInventors: Tomoaki Okuno, Saori Kanezaki, Tsuyoshi Oguro, Takeshi Kawakami
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Patent number: 9147412Abstract: A head gimbal assembly includes a suspension board with circuit, a pair of piezoelectric elements mounted on the suspension board with circuit to be expandable/contractible, and a slider on which a magnetic head is mounted and which is mounted on the suspension board with circuit and configured to be able to swing with expansion/contraction of the pair of piezoelectric elements. The pair of piezoelectric elements are placed on the suspension board with circuit such that a first imaginary line extending along an expanding/contracting direction of one of the piezoelectric elements crosses a second imaginary line extending along an expanding/contracting direction of the other piezoelectric element.Type: GrantFiled: December 23, 2014Date of Patent: September 29, 2015Assignee: NITTO DENKO CORPORATIONInventors: Tomoaki Okuno, Hiroyuki Tanabe, Yoshito Fujimura, Naohiro Terada
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Publication number: 20150216039Abstract: A suspension board with circuit assembly sheet includes an assembly provided region provided with a plurality of suspension boards with circuits at spaced intervals to each other along one direction and a margin region provided at least at one side in a crossing direction with respect to the one direction of the assembly provided region. In the assembly provided region, a first opening portion is provided between the suspension boards with circuits that are adjacent to each other and in the margin region, a fragile portion is provided.Type: ApplicationFiled: January 26, 2015Publication date: July 30, 2015Applicant: NITTO DENKO CORPORATIONInventors: Naohiro TERADA, Yoshito FUJIMURA, Tomoaki OKUNO
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Publication number: 20150179196Abstract: A head gimbal assembly includes a suspension board with circuit, a pair of piezoelectric elements mounted on the suspension board with circuit to be expandable/contractible, and a slider on which a magnetic head is mounted and which is mounted on the suspension board with circuit and configured to be able to swing with expansion/contraction of the pair of piezoelectric elements. The pair of piezoelectric elements are placed on the suspension board with circuit such that a first imaginary line extending along an expanding/contracting direction of one of the piezoelectric elements crosses a second imaginary line extending along an expanding/contracting direction of the other piezoelectric element.Type: ApplicationFiled: December 23, 2014Publication date: June 25, 2015Applicant: NITTO DENKO CORPORATIONInventors: Tomoaki OKUNO, Hiroyuki TANABE, Yoshito FUJIMURA, Naohiro TERADA
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Publication number: 20140224127Abstract: Provided are a space-saving filter that has a plurality of types of air purification capabilities with reduced pressure loss, and a compact air purifier that efficiently exerts a plurality of types of air purification capabilities. Since a body part of a deodorizing filter includes two pieces of deodorizing filter bodies each having the same thickness (hereafter referred to as thickness D) juxtaposed in a plane direction, the body part has the thickness of D. When the deodorizing filter bodies are laminated, the thickness of the body part becomes 2D or more. The body part has a reduced pressure loss and space in a thickness direction compared with a filter in which the deodorizing filter bodies are laminated. The first deodorizing filter body mainly removes aldehyde-based odor components and the second deodorizing filter body mainly removes amine-based odor components.Type: ApplicationFiled: September 10, 2012Publication date: August 14, 2014Applicants: SUMINOE TEXTILE CO., LTD., SHARP KABUSHIKI KAISHAInventors: Minoru Nagata, Akihiro Yasukawa, Yoshiharu Nishino, Tomoaki Okuno
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Publication number: 20140144680Abstract: A method of producing a wired circuit board includes a first step of preparing a metal supporting layer, a second step of forming, on one side of the metal supporting layer in a thickness direction thereof, an insulating layer having a first opening, and a plurality of terminal formation portions, a third step of forming, on one side of the insulating layer in the thickness direction, a conductive layer having a plurality of terminal portions each corresponding to the plurality of terminal formation portions, a fourth step of partially removing the metal supporting layer to form a second opening and at least one reinforcing metal supporting portion placed between the plurality of terminal formation portions, and a fifth step of removing the plurality of terminal formation portions exposed from the second opening to expose both side surfaces of the plurality of terminal portions in the thickness direction.Type: ApplicationFiled: November 21, 2013Publication date: May 29, 2014Applicant: NITTO DENKO CORPORATIONInventors: Tomoaki OKUNO, Saori KANEZAKI, Tsuyoshi OGURO, Takeshi KAWAKAMI