Abstract: To provide a curable composition being excellent in curability and being capable of forming a cured product which is excellent in heat resistance, which is excellent in adhesion to an inorganic substrate or an inorganic compound layer, and which is hardly peeled even when exposed to a high temperature/high humidity environment for a long time, a cured product formed by curing the curable composition, and a laminate. A curable composition comprising specific metal oxide fine particles A, a specific (meth)acrylate B, a specific antioxidant, an organopolysiloxane and a radical polymerization initiator, which may further contain a specific epoxy (meth)acrylate C, and which may further contain a specific urethane (meth)acrylate D. A cured product formed by curing the curable composition, and a laminate having the cured product.

Abstract: Provided are a curable composition and an application thereof. The curable composition contains: a compound A having a polymerizable group (a) and an oxyfluoroalkylene group; a polymerization initiator; and a compound B having a polymerizable group different from the polymerizable group (a). The polymerizable group (a) in the compound A is at least one selected from the group consisting of a vinylphenyl group, a vinylphenyloxy group, a vinylbenzyloxy group, a vinyloxy group, a vinyloxycarbonyl group, a vinylamino group, a vinylaminocarbonyl group, a vinylthio group, an allyloxy group, an allyloxycarbonyl group, an allylamino group, an allylaminocarbonyl group, an allylthio group, an epoxy group, and an epoxycycloalkyl group.

Abstract: A metal-organic chalcogenolate (MOC) includes silver phenylselenolate functionalized with at least one functional group. The functional group may be methyl (CH3), dimethylamine (N(CH3)2), thiomethyl (SCH3), fluoro (F) trifluoromethyl (CF3), cyanide (CN), carboxy (COOH), nitrito (NO2), or alkoxy (OCxHy). The MOC can be in the form of a single crystal consisting essentially of a nanocluster (0D), a nanotube (1D), or a single monolayer (2D).

Abstract: To provide a curable composition for imprinting whereby a cured product layer for a replica mold, which is excellent in the adhesion to a mold substrate and the release property from a cured product of a transfer object material when used in an imprinting method is formed; a replica mold for imprinting, using the curable composition for imprinting; its production process and a process for producing an article having a fine pattern on its surface by using the replica mold. A curable composition for imprinting, which comprises a fluorinated polymer comprising structural units (a) based on CH2?C(R1)C(O)OR2Rf (R1: a hydrogen atom, a methyl group or the like, R2: a bivalent linking group having no fluorine atom and Rf: a C2-6 fluoroalkyl group or the like) and structural units (b) having a cationic polymerizable reactive group having an oxygen atom, and a photo-acid generator, wherein the proportion of the fluorinated polymer is from 11 to 89 mass % in 100 mass % of the curable composition for imprinting.

Abstract: The present invention relates to a light guide plate containing a glass plate and a resin layer that is formed on at least one major surface of the glass plate, in which the resin layer is made of a resin containing metal oxide fine particles dispersed, and an absolute value of a refractive index difference between the glass plate and the resin layer is 0.07 or smaller over an entire range of a wavelength of 430 nm to 700 nm.

Abstract: To provide a curable composition capable of obtaining a cured product which has a high Abbe number, is excellent in transparency and crack resistance, and is capable of suppressing a decrease in transparency over a long period of time; and such a cured product. This curable composition comprises solid silica fine particles A, of which an organic component is at most 5 mass % and the median diameter is from 5 to 20 nm, (meth)acrylate B which has an alicyclic condensed ring, and of which the glass transition temperature of the homopolymer is from 90 to 350° C., epoxy(meth)acrylate C which has no aromatic ring, and in which the amount of substance of ethylenically unsaturated groups is from 0.1 to 3.

Abstract: To provide a curable composition being excellent in curability and being capable of forming a cured product which is excellent in heat resistance, which is excellent in adhesion to an inorganic substrate or an inorganic compound layer, and which is hardly peeled even when exposed to a high temperature/high humidity environment for a long time, a cured product formed by curing the curable composition, and a laminate. A curable composition comprising specific metal oxide fine particles A, a specific (meth)acrylate B, a specific antioxidant, an organopolysiloxane and a radical polymerization initiator, which may further contain a specific epoxy (meth)acrylate C, and which may further contain a specific urethane (meth)acrylate D. A cured product formed by curing the curable composition, and a laminate having the cured product.

Abstract: To provide a curable composition capable of obtaining a cured product which has a high Abbe number, is excellent in transparency and crack resistance, and is capable of suppressing a decrease in transparency over a long period of time; and such a cured product. This curable composition comprises solid silica fine particles A, of which an organic component is at most 5 mass % and the median diameter is from 5 to 20 nm, (meth)acrylate B which has an alicyclic condensed ring, and of which the glass transition temperature of the homopolymer is from 90 to 350° C., epoxy(meth)acrylate C which has no aromatic ring, and in which the amount of substance of ethylenically unsaturated groups is from 0.1 to 3.

Abstract: Disclosed herein is a curable composition containing a monomer (A) having at least one crosslinkable group and at least one aromatic ring, a monomer (B) having a fluorene skeleton, a compound (C) having an Abbe number of at most 21, and a polymerization initiator (D), wherein the content of the compound (C) is from 1 to 10 mass % based on 100 mass % of the total content of the monomer (A), the monomer (B) and the compound (C). Curable compositions of this disclosure have low viscosities and produce cured products having a high refractive indices, a low Abbe numbers, high transparencies and high heat resistances.

Abstract: To provide a curable composition for imprinting whereby a cured product layer for a replica mold, which is excellent in the adhesion to a mold substrate and the release property from a cured product of a transfer object material when used in an imprinting method is formed; a replica mold for imprinting, using the curable composition for imprinting; its production process and a process for producing an article having a fine pattern on its surface by using the replica mold. A curable composition for imprinting, which comprises a fluorinated polymer comprising structural units (a) based on CH2?C(R1)C(O)OR2Rf (R1: a hydrogen atom, a methyl group or the like, R2: a bivalent linking group having no fluorine atom and Rf: a C2-6 fluoroalkyl group or the like) and structural units (b) having a cationic polymerizable reactive group having an oxygen atom, and a photo-acid generator, wherein the proportion of the fluorinated polymer is from 11 to 89 mass % in 100 mass % of the curable composition for imprinting.

Abstract: To provide a fluorinated compound capable of obtaining a cured product which is excellent in heat resistance and mold release and has a high Abbe number; a curable composition containing such a compound; and a cured product which is excellent in heat resistance and mold release and has a high Abbe number. The fluorinated compound is represented by the following formula (A): [Z—OCH2CF2CF2CF2OCFHCF2—X—]nQ??(A) where n is an integer of at least 1, Q is a n-valent organic group, X is —O—, —NH— or —S—, and Z is a group having at least one polymerizable functional group.

Abstract: To provide a curable composition having a low viscosity, from which a cured product having a high refractive index, a low Abbe number, high transparency and high heat resistance can be obtained, and its cured product. A curable composition comprising a monomer (A) having at least one crosslinkable group and at least one aromatic ring, which may have one or more sulfur atoms not constituting the ring skeleton of the aromatic ring, in which the total proportion of the mass of atoms constituting the ring skeleton of the aromatic ring, the mass of hydrogen atoms bonded to the atoms constituting the ring skeleton of the aromatic ring and the mass of the sulfur atom not constituting the ring skeleton of the aromatic ring is at least 47 mass % based on 100 mass % of one monomer molecule, and which has a viscosity at 25° C.

Abstract: To provide a photosensitive resin composition containing a crosslinkable fluororesin which hardly damages a substrate of e.g. an organic semiconductor when a resin film is formed, and a resin film using it, an organic semiconductor device and its production process, and a fluororesin suitable for the photosensitive resin composition. A photosensitive resin composition comprising a fluororesin having a polymerizable carbon-carbon double bond and having a fluorine atom content of at least 47 mass %, a crosslinking agent having a polymerizable carbon-carbon double bond (excluding the fluororesin), a photoinitiator and a non-aromatic fluorinated solvent.

Abstract: To provide e.g. a photosensitive resin composition for a biochip, capable of forming a liquid repellent film at a high resolution, with an aqueous alkaline solution, without performing PEB treatment, a method for forming the liquid repellent film, a process for producing a biochip.

Abstract: To provide a biochip whereby noise lights in fluorescence analysis are reduced. A photosensitive composition for forming a liquid repellent film on a liquid contact surface of a biochip for fluorescence analysis, said photosensitive resin composition comprising a polymer having a fluoroalkyl group which may have an etheric oxygen atom, and a polymerizable crosslinkable group, and a photoinitiator having an absorption coefficient at a wavelength of 365 nm of at most 400 [mL·g?1·cm?1]. A method for producing a biochip for fluorescence analysis, which comprises applying the photosensitive composition onto a liquid contact surface of a biochip for fluorescence analysis, followed by exposure and development.

Abstract: To provide a fluorinated compound capable of obtaining a cured product which is excellent in heat resistance and mold release and has a high Abbe number; a curable composition containing such a compound; and a cured product which is excellent in heat resistance and mold release and has a high Abbe number. The fluorinated compound is represented by the following formula (A): [Z—OCH2CF2CF2CF2OCFHCF2—X-]nQ??(A) where n is an integer of at least 1, Q is a n-valent organic group, X is —O—, —NH— or —S—, and Z is a group having at least one polymerizable functional group.

Abstract: To provide a photosensitive resin composition containing a crosslinkable fluororesin which hardly damages a substrate of e.g. an organic semiconductor when a resin film is formed, and a resin film using it, an organic semiconductor device and its production process, and a fluororesin suitable for the photosensitive resin composition. A photosensitive resin composition comprising a fluororesin having a polymerizable carbon-carbon double bond and having a fluorine atom content of at least 47 mass %, a crosslinking agent having a polymerizable carbon-carbon double bond (excluding the fluororesin), a photoinitiator and a non-aromatic fluorinated solvent.