Patents by Inventor Tomoaki Sawada

Tomoaki Sawada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12207397
    Abstract: Provided is a stretchable circuit board including a stretchable insulating layer, and a wiring, in which the wiring is formed of a combination of a metal wiring portion that forms a main portion of the wiring, and a conductive stretchable portion disposed ancillary to the metal wiring portion.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: January 21, 2025
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro Fukao, Tomoaki Sawada, Takatoshi Abe, Kyosuke Michigami, Makoto Takashiro, Susumu Fukushima, Daisuke Honda
  • Publication number: 20240425642
    Abstract: An aspect of the present invention relates to a stretchable resin composition containing an epoxy resin and a curing agent, in which the epoxy resin has a weight average molecular weight of 50,000 or more and 3,000,000 or less and a polydispersity of average molecular weights (Mw/Mn) that satisfies the following Formula (1): 1.1?Mw/Mn?3.0(1) (wherein, Mn represents a number average molecular weight and Mw represents a weight average molecular weight), the curing agent is a crystalline compound, and a glass transition temperature of a cured product of the stretchable resin composition is 60° C. or less.
    Type: Application
    Filed: August 29, 2024
    Publication date: December 26, 2024
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro FUKAO, Tomoaki SAWADA, Takatoshi ABE
  • Patent number: 12094622
    Abstract: An aspect of the present invention relates to a conductive resin composition containing an epoxy resin, a curing agent, and a conductive powder, in which a loss modulus of a dried product or semi-cured product of the conductive resin composition at 170° C. is 0.1 MPa or more and 15 MPa or less.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: September 17, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro Fukao, Tomoaki Sawada, Takatoshi Abe, Kyosuke Michigami
  • Patent number: 12031708
    Abstract: An elastic resin sheet that is a resin sheet formed using a resin composition containing a thermosetting resin and a curing agent, in which when a maximum height of a surface roughness on a first surface of the resin sheet is Rz1 (?m), a maximum height of a surface roughness on a second surface facing the first surface is Rz2 (?m), and a thickness is t (?m), the Rz1, the Rz2, and the thickness t (?m) satisfy relation of the following Formula (1): (Rz1+Rz2)/t?0.5 (1), the elastic resin sheet includes a light-diffusing portion having irregularities with an arithmetic mean roughness Ra of 0.3 ?m or more and 5.0 ?m or less on at least one of the first surface and the second surface, and the elastic resin sheet has an initial tensile modulus of 0.5 MPa or more and 500 MPa or less.
    Type: Grant
    Filed: October 4, 2023
    Date of Patent: July 9, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro Fukao, Tomoaki Sawada, Kyosuke Michigami, Keiko Kashihara, Chihiro Horii
  • Patent number: 12006983
    Abstract: To obtain a second assembly, first, an outer ring and first roller cassette of a first assembly are supported by a first support tool and a hub wheel of the first assembly is supported by a second support tool, and then the second support tool is moved upward, so that a roller support surface of the second support tool is introduced to the inside of the first roller cassette in the radial direction. Then, after a first seal member is attached to the outer ring, the second support tool is moved downward in accordance with the re-insertion of a cylindrical portion of the hub wheel into the inner periphery of the outer ring, so that a first inner raceway surface is inside of the first roller cassette in the radial direction while the roller support surface is ejected to the lower side of the first roller cassette.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: June 11, 2024
    Assignee: NTN CORPORATION
    Inventors: Tatsuto Yamashita, Tomoaki Sawada
  • Publication number: 20240147627
    Abstract: One aspect of the present invention relates to a method for manufacturing a substrate with a conductive pattern, the method including: a base forming step of forming a plating base in a desired pattern on at least a portion of one surface of a stretchable substrate, wherein the stretchable substrate has a tensile modulus at 20° C. of 0.1 MPa or more and 500 MPa or less, an elongation at break of 100% or more and 1000% or less, and a storage modulus at 250° C. of 0.1 MPa or more; a bending step of bending the stretchable substrate; and a conductive pattern forming step of plating the plating base after performing the bending step to form a conductive pattern on the stretchable substrate.
    Type: Application
    Filed: December 7, 2023
    Publication date: May 2, 2024
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro FUKAO, Tomoaki SAWADA, Kyosuke MICHIGAMI
  • Publication number: 20240147609
    Abstract: A method for manufacturing a stretchable circuit board includes preparing a laminate in which a metal layer and a first stretchable insulating layer are in contact with each other and a peel strength between the metal layer and the first stretchable insulating layer is 0.5 N/mm or more and 3.0 N/mm or less, a second stretchable insulating layer, and a fluid; forming a via leading from a first surface, in contact with the metal layer, of the first stretchable insulating layer to a second surface opposite to the first surface; filling the fluid in the via; laminating the second stretchable insulating layer on the second surface to seal the via; and patterning the metal layer.
    Type: Application
    Filed: January 11, 2024
    Publication date: May 2, 2024
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro FUKAO, Tomoaki SAWADA, Kyosuke MICHIGAMI, Qianying LI
  • Patent number: 11963558
    Abstract: A circuit mounted article to be fixed to a fabric is provided and includes a circuit board having flexibility, an electronic component mounted on a fabric facing face side, which faces the fabric, of the circuit board, and further a reinforcing portion to be used for fixing of the circuit mounted article to the fabric on the fabric facing face side of the circuit board.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: April 23, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takatoshi Abe, Tomohiro Fukao, Tomoaki Sawada, Susumu Fukushima
  • Publication number: 20240027053
    Abstract: An elastic resin sheet that is a resin sheet formed using a resin composition containing a thermosetting resin and a curing agent, in which when a maximum height of a surface roughness on a first surface of the resin sheet is Rz1 (?m), a maximum height of a surface roughness on a second surface facing the first surface is Rz2 (?m), and a thickness is t (?m), the Rz1, the Rz2, and the thickness t (?m) satisfy relation of the following Formula (1): (Rz1+Rz2)/t?0.5 (1), the elastic resin sheet includes a light-diffusing portion having irregularities with an arithmetic mean roughness Ra of 0.3 ?m or more and 5.0 ?m or less on at least one of the first surface and the second surface, and the elastic resin sheet has an initial tensile modulus of 0.5 MPa or more and 500 MPa or less.
    Type: Application
    Filed: October 4, 2023
    Publication date: January 25, 2024
    Inventors: Tomohiro FUKAO, Tomoaki Sawada, Kyosuke Michigami, Keiko Kashihara, Chihiro Horii
  • Patent number: 11864310
    Abstract: A stretchable laminate to be fixed to a fabric includes a stretchable circuit board including a stretchable insulating layer having an elongation rate of 10% or more, a fabric base material, and an adhesive layer that bonds the stretchable circuit board and the fabric base material together.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: January 2, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takatoshi Abe, Tomohiro Fukao, Tomoaki Sawada, Kyosuke Michigami
  • Publication number: 20230332649
    Abstract: To obtain a second assembly, first, an outer ring and first roller cassette of a first assembly are supported by a first support tool and a hub wheel of the first assembly is supported by a second support tool, and then the second support tool is moved upward, so that a roller support surface of the second support tool is introduced to the inside of the first roller cassette in the radial direction. Then, after a first seal member is attached to the outer ring, the second support tool is moved downward in accordance with the re-insertion of a cylindrical portion of the hub wheel into the inner periphery of the outer ring, so that a first inner raceway surface is inside of the first roller cassette in the radial direction while the roller support surface is ejected to the lower side of the first roller cassette.
    Type: Application
    Filed: August 27, 2021
    Publication date: October 19, 2023
    Inventors: Tatsuto YAMASHITA, Tomoaki SAWADA
  • Publication number: 20230167215
    Abstract: An aspect of the present invention relates to a resin composition containing an acrylic resin and a curing agent, in which the acrylic resin contains a polymerization unit (A) of a (meth)acrylate having an epoxy group, a polymerization unit (B) of a (meth)acrylate having a cyano group, and a polymerization unit (C) of a (meth)acrylate having an isobornyl group, a weight average molecular weight of the acrylic resin is 50,000 or more and 3,000,000 or less, and a storage modulus of a cured product of the resin composition at 200° C. is 0.1 MPa or more and 3.5 MPa or less.
    Type: Application
    Filed: January 24, 2023
    Publication date: June 1, 2023
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro FUKAO, Tomoaki SAWADA, Kyosuke MICHIGAMI
  • Patent number: 11603469
    Abstract: The present invention relates, in one aspect, to a thermosetting resin composition including an epoxy resin, an isocyanate resin, a polyrotaxane resin, and a curing agent, wherein the isocyanate resin includes a hexamethylene skeleton and at least one selected from a biuret skeleton, an isocyanurate skeleton, an allophanate skeleton, a neopentyl skeleton, a butylene skeleton, and a dicarboxyl skeleton in a structure thereof.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: March 14, 2023
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takatoshi Abe, Tomoaki Sawada
  • Patent number: 11503706
    Abstract: A stretchable circuit board includes a stretchable base material, a stretchable wiring, and a land part that is in contact with the stretchable base material. The land part is formed of a patterned metal foil, or a printed product of an electroconductive ink containing metal particles. The stretchable base material has a tensile modulus at 25° C. room temperature of 0.5 MPa to 0.5 GPa.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: November 15, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takatoshi Abe, Tomoaki Sawada, Tomohiro Fukao
  • Publication number: 20220208411
    Abstract: An aspect of the present invention relates to a conductive resin composition containing an epoxy resin, a curing agent, and a conductive powder, in which a loss modulus of a dried product or semi-cured product of the conductive resin composition at 170° C. is 0.1 MPa or more and 15 MPa or less.
    Type: Application
    Filed: December 20, 2021
    Publication date: June 30, 2022
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Tomohiro FUKAO, Tomoaki SAWADA, Takatoshi ABE, Kyosuke MICHIGAMI
  • Publication number: 20220201850
    Abstract: A stretchable laminate to be fixed to a fabric includes a stretchable circuit board including a stretchable insulating layer having an elongation rate of 10% or more, a fabric base material, and an adhesive layer that bonds the stretchable circuit board and the fabric base material together.
    Type: Application
    Filed: April 16, 2020
    Publication date: June 23, 2022
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takatoshi ABE, Tomohiro FUKAO, Tomoaki SAWADA, Kyosuke MICHIGAMI
  • Publication number: 20220183154
    Abstract: A fiber sheet includes: a resin layer containing a thermosetting resin; and a fiber layer, wherein the fiber sheet is stretchable by 1% or more, and an initial tensile elastic modulus of the fiber sheet is 1 MPa or more and 1 GPa or less.
    Type: Application
    Filed: March 26, 2020
    Publication date: June 9, 2022
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro FUKAO, Tomoaki SAWADA, Takatoshi ABE, Kyosuke MICHIGAMI
  • Publication number: 20220175057
    Abstract: A circuit mounted article to be fixed to a fabric is provided and includes a circuit board having flexibility, an electronic component mounted on a fabric facing face side, which faces the fabric, of the circuit board, and further a reinforcing portion to be used for fixing of the circuit mounted article to the fabric on the fabric facing face side of the circuit board.
    Type: Application
    Filed: April 16, 2020
    Publication date: June 9, 2022
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takatoshi ABE, Tomohiro FUKAO, Tomoaki SAWADA, Susumu FUKUSHIMA
  • Patent number: 11345784
    Abstract: One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: May 31, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kyosuke Michigami, Tomoaki Sawada, Tomohiro Fukao, Takatoshi Abe, Andy Behr
  • Publication number: 20220167497
    Abstract: Provided is a stretchable circuit board including a stretchable insulating layer, and a wiring, in which the wiring is formed of a combination of a metal wiring portion that forms a main portion of the wiring, and a conductive stretchable portion disposed ancillary to the metal wiring portion.
    Type: Application
    Filed: March 26, 2020
    Publication date: May 26, 2022
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro FUKAO, Tomoaki SAWADA, Takatoshi ABE, Kyosuke MICHIGAMI, Makoto TAKASHIRO, Susumu FUKUSHIMA, Daisuke HONDA