Patents by Inventor Tomoaki Sugiyama

Tomoaki Sugiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088581
    Abstract: A connector for a shielded electric wire includes: a shield terminal connected to a braid on one end side thereof and grounding the braid by contact at a leaf spring on the other end side thereof; a first packing (sealing member) that seals between a housing and an object inserted into a through hole from an inner surface of the housing to an inner surface of the through hole; and a support member that is a resin ring exteriorly mounted on the shield terminal to be adjacent to the leaf spring and disposed inside the through hole in such a manner that an outer circumferential edge thereof is in contact with the inner surface of the through hole, thereby suppressing an offset of a central axis of the shield terminal with respect to a central axis of the through hole.
    Type: Application
    Filed: August 9, 2023
    Publication date: March 14, 2024
    Applicant: Yazaki Corporation
    Inventors: Daisuke SUGIYAMA, Masanobu Higashitani, Tomoaki Hayakawa, Yasukazu Chikamatsu
  • Publication number: 20240088604
    Abstract: An attachment member 12 of a connection direction converting connector 1a includes a frame-shaped second seal member 124 configured to seal between: a frame-shaped housing-side opposing surface 122a-6 of the attachment housing 122 that surrounds the accommodation portion that contains a connection portion between an attachment terminal 121 and a connector terminal 112 and faces the shell 123; and a frame-shaped shell-side opposing surface 123k of the shell 123 that faces the housing-side opposing surface 122a-6.
    Type: Application
    Filed: August 9, 2023
    Publication date: March 14, 2024
    Applicant: Yazaki Corporation
    Inventors: Daisuke SUGIYAMA, Masanobu HIGASHITANI, Tomoaki HAYAKAWA, Yasukazu CHIKAMATSU
  • Publication number: 20240088595
    Abstract: A fastening structure 100 of metal plates includes a first metal plate 2 including a first hole portion 2A, a second metal plate 3 including a second hole portion 3A, and a fastening material B1 fastened to penetrate the first hole portion and the second hole portion, with the first metal plate and the second metal plate overlapping each other, wherein the first metal plate is provided with protrusions 24, 24, the second metal plate is provided with receiving portions 31A, 31B in which the protrusions fit, and with the protrusions fitting in the receiving portions, the first metal plate is restricted from rotating with respect to the second metal plate.
    Type: Application
    Filed: August 10, 2023
    Publication date: March 14, 2024
    Applicant: Yazaki Corporation
    Inventors: Daisuke SUGIYAMA, Masanobu HIGASHITANI, Tomoaki HAYAKAWA, Yasukazu CHIKAMATSU
  • Publication number: 20240006241
    Abstract: A laminate substrate is divided along a plurality of intersecting scheduled division lines. The laminate substrate has a first substrate and a second substrate formed of the same material, laminated through an intermediate layer containing metal. The laminate substrate is divided by cutting the laminate substrate along the scheduled division lines by use of a substrate cutting blade to form the first substrate with first cut grooves each having a width larger than a cutting edge thickness of a metal cutting blade which is larger in cutting edge thickness than the substrate cutting blade, and thereafter cutting the laminate substrate along the first cut grooves by use of the metal cutting blade to cut the intermediate layer and to form second cut grooves each having a width corresponding to the cutting edge thickness of the metal cutting blade.
    Type: Application
    Filed: June 29, 2023
    Publication date: January 4, 2024
    Inventors: Naoko YAMAMOTO, Tomoaki SUGIYAMA
  • Publication number: 20230418149
    Abstract: A substrate for mask blanks having first and second main surfaces of 152 mm×152 mm square and a thickness of 6.35 mm, wherein: when a range of 132 mm×132 mm square centered on an intersection of diagonal lines is defined as a calculation region in each of the first and second main surfaces, on a substrate surface of the calculation region of at least one of the first and second main surfaces, flatness of the substrate surface of the calculation region based on a least square plane is 100 nm or less, and a difference (PV) between a highest value and a lowest value of a height of a calculation surface represented by a difference between shapes of the substrate surfaces before and after smoothing processing with a Gaussian filter (10 mm×10 mm) based on the least square plane is 20 nm or less.
    Type: Application
    Filed: June 1, 2023
    Publication date: December 28, 2023
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tomoaki SUGIYAMA, Daijitsu HARADA, Harunobu MATSUI, Naoki YARITA, Masaki TAKEUCHI
  • Publication number: 20230037856
    Abstract: A mask blanks substrate having a flatness of a calculation surface of 100 nm or less when a calculation region passing through central portions of first and second main surfaces and extending in a horizontal direction is set, a first region surface is cut out, a second region surface is cut out by setting a reference plane and a rotation axis and rotating the substrate by 180°, least square planes are calculated, the first and second region surfaces are converted into height maps to positions on the least square planes, the height map of the to second region surface is set as a reverse height map by symmetrically moving the height map, and a map of a calculated height obtained by adding heights of the height map of the first region surface and the reverse height map of the second region surface is set as the calculation surface.
    Type: Application
    Filed: July 1, 2022
    Publication date: February 9, 2023
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tomoaki SUGIYAMA, Daijitsu HARADA, Harunobu MATSUI, Naoki YARITA, Masaki TAKEUCHI
  • Patent number: 11105752
    Abstract: An inspecting apparatus for inspecting a test piece. The inspecting apparatus includes a test piece holding mechanism for holding the test piece, the test piece holding mechanism having a mounting portion formed from a transparent member having upper and lower exposed surfaces, the upper exposed surface of the transparent member functioning as a mounting surface for mounting the test piece, whereby the test piece mounted on the mounting surface of the mounting portion is adapted to be held by the test piece holding mechanism. The inspecting apparatus further includes an imaging mechanism for imaging the test piece held by the test piece holding mechanism, the imaging mechanism having a first imaging unit provided above the mounting portion, a second imaging unit provided below the mounting portion, and a connecting portion for connecting the first imaging unit and the second imaging unit.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: August 31, 2021
    Assignee: DISCO CORPORATION
    Inventors: Tomoaki Sugiyama, Hirohiko Kozai, Naoki Morikawa
  • Publication number: 20200333261
    Abstract: An inspecting apparatus for inspecting a test piece. The inspecting apparatus includes a test piece holding mechanism for holding the test piece, the test piece holding mechanism having a mounting portion formed from a transparent member having upper and lower exposed surfaces, the upper exposed surface of the transparent member functioning as a mounting surface for mounting the test piece, whereby the test piece mounted on the mounting surface of the mounting portion is adapted to be held by the test piece holding mechanism. The inspecting apparatus further includes an imaging mechanism for imaging the test piece held by the test piece holding mechanism, the imaging mechanism having a first imaging unit provided above the mounting portion, a second imaging unit provided below the mounting portion, and a connecting portion for connecting the first imaging unit and the second imaging unit.
    Type: Application
    Filed: April 1, 2020
    Publication date: October 22, 2020
    Inventors: Tomoaki SUGIYAMA, Hirohiko KOZAI, Naoki MORIKAWA
  • Patent number: 10800708
    Abstract: The object of the present invention is to provide an antibacterial material capable of sustaining antibacterial properties for a long time. The object can be solved by a silver-containing calcium phosphate sintered body having silver particles therein, wherein an average particle diameter of the silver particles is 0.01 to 0.5 ?m.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: October 13, 2020
    Assignees: TOKYO INSTITUTE OF TECHNOLOGY, KYOCERA CORPORATION
    Inventors: Toshiyuki Ikoma, Tomoaki Sugiyama, Hiroaki Igashira, Yugo Fukuyama, Michimasa Kamo, Masayuki Kyomoto, Takashi Sasaki
  • Patent number: 10688616
    Abstract: A cutting apparatus having a cutting blade for cutting a workpiece held on a chuck table is disclosed. The cutting apparatus includes an elastic wave detecting sensor for detecting an elastic wave due to the rotation of the cutting blade, a reference data storing section configured to store reference data as a set of reference processing elastic wave data and reference idling elastic wave data, a threshold value storing section, a ratio calculating section, and a determining section.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: June 23, 2020
    Assignee: DISCO CORPORATION
    Inventors: Takahiko Tsuno, Saki Miyakawa, Tomoaki Sugiyama
  • Patent number: 10629445
    Abstract: A wafer processing method for processing a wafer having devices on the front side is provided. The wafer processing method includes a back grinding step of grinding the wafer to form a recess and an annular reinforcing portion surrounding the recess on the back side of the wafer, and a dividing step of cutting the wafer along division lines formed on the front side of the wafer. In the back grinding step, a taper surface is formed between the bottom surface of the recess and the annular reinforcing portion. The taper surface is inclined with respect to a direction perpendicular to the bottom surface of the recess. In the dividing step, a cutting blade is lowered to start cutting at a position radially inside the outer circumference of the wafer and is subsequently raised to stop cutting at another position radially inside the outer circumference of the wafer.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: April 21, 2020
    Assignee: DISCO CORPORATION
    Inventors: Katsuhiko Suzuki, Hisashi Arakida, Tomoaki Sugiyama
  • Patent number: 10361102
    Abstract: A cutting apparatus includes a cutting unit including a cutting blade that has a cutting edge for cutting a dresser board. An elastic wave detection sensor is disposed in the cutting unit, for detecting an elastic wave produced when the dresser board is cut. The elastic wave detection sensor produces an output signal representing the detected elastic wave when the cutting blade cuts the dresser board and is dressed thereby, the output signal being variable as the cutting blade is progressively dressed by the dresser board. A control unit stores in advance, as a threshold value, the value of the output signal when the dressing of the cutting blade is completed. The control unit stops cutting the dresser board with the cutting blade and finishes the dressing of the cutting blade when the output signal produced by the elastic wave detection sensor reaches the threshold value.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: July 23, 2019
    Assignee: DISCO CORPORATION
    Inventors: Takuya Kaminaga, Tomoaki Sugiyama, Saki Miyakawa
  • Publication number: 20190177229
    Abstract: The object of the present invention is to provide an antibacterial material capable of sustaining antibacterial properties for a long time. The object can be solved by a silver-containing calcium phosphate sintered body having silver particles therein, wherein an average particle diameter of the silver particles is 0.01 to 0.5 ?m.
    Type: Application
    Filed: February 28, 2017
    Publication date: June 13, 2019
    Applicants: Tokyo Institute of Technology, KYOCERA Corporation
    Inventors: Toshiyuki IKOMA, Tomoaki SUGIYAMA, Hiroaki IGASHIRA, Yugo FUKUYAMA, Michimasa KAMO, Masayuki KYOMOTO, Takashi SASAKI
  • Publication number: 20190006185
    Abstract: A wafer processing method for processing a wafer having devices on the front side is provided. The wafer processing method includes a back grinding step of grinding the wafer to form a recess and an annular reinforcing portion surrounding the recess on the back side of the wafer, and a dividing step of cutting the wafer along division lines formed on the front side of the wafer. In the back grinding step, a taper surface is formed between the bottom surface of the recess and the annular reinforcing portion. The taper surface is inclined with respect to a direction perpendicular to the bottom surface of the recess. In the dividing step, a cutting blade is lowered to start cutting at a position radially inside the outer circumference of the wafer and is subsequently raised to stop cutting at another position radially inside the outer circumference of the wafer.
    Type: Application
    Filed: June 27, 2018
    Publication date: January 3, 2019
    Inventors: Katsuhiko Suzuki, Hisashi Arakida, Tomoaki Sugiyama
  • Publication number: 20180304429
    Abstract: Disclosed herein is a cutting apparatus having a cutting blade for cutting a workpiece held on a chuck table.
    Type: Application
    Filed: April 18, 2018
    Publication date: October 25, 2018
    Inventors: Takahiko Tsuno, Saki Miyakawa, Tomoaki Sugiyama
  • Publication number: 20180211851
    Abstract: A cutting apparatus includes a cutting unit including a cutting blade that has a cutting edge for cutting a dresser board. An elastic wave detection sensor is disposed in the cutting unit, for detecting an elastic wave produced when the dresser board is cut. The elastic wave detection sensor produces an output signal representing the detected elastic wave when the cutting blade cuts the dresser board and is dressed thereby, the output signal being variable as the cutting blade is progressively dressed by the dresser board. A control unit stores in advance, as a threshold value, the value of the output signal when the dressing of the cutting blade is completed. The control unit stops cutting the dresser board with the cutting blade and finishes the dressing of the cutting blade when the output signal produced by the elastic wave detection sensor reaches the threshold value.
    Type: Application
    Filed: January 19, 2018
    Publication date: July 26, 2018
    Inventors: Takuya Kaminaga, Tomoaki Sugiyama, Saki Miyakawa
  • Patent number: 9458018
    Abstract: Catalyst support means for producing a fluid catalyst; a reduction basin that pretreats an active metal of the obtained fluid catalyst in a reducing atmosphere; a fluid bed reactor which is supplied with a reduction-treated fluid catalyst having undergone the reduction, for producing a nanocarbon material; and a moisture application basin for supplying a slight amount of moisture to a source gas to be supplied to the aforementioned fluid bed reactor are provided.
    Type: Grant
    Filed: February 26, 2013
    Date of Patent: October 4, 2016
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Tomoaki Sugiyama, Kiyoshi Tatsuhara, Ikumasa Koshiro, Atsushi Tanaka, Yasushi Mori, Takashi Kurisaki
  • Patent number: 9138728
    Abstract: The present invention provides a catalyst for forming carbon nanotubes that improves a yield at the time of manufacturing carbon nanotubes and enables continuous mass production of carbon nanotubes with high purity. The catalyst for forming carbon nanotubes of the present invention includes a carrier that includes MgO and a metal catalyst that is supported by the carrier, and the concentration of the MgO in the carrier is set equal to 99 mass % or higher.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: September 22, 2015
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Nariyuki Tomonaga, Tomoaki Sugiyama, Yasushi Mori, Takashi Kurisaki, Takanori Suto, Kota Kikuchi
  • Patent number: 8995818
    Abstract: It is provided a recorder apparatus in which a user can use simply and efficiently plural functions which can be performed simultaneously. According to an embodiment of the invention, a recorder apparatus has a display, an input section for a video being inputted, a random access recording medium for recording the video, an output section for outputting the video recorded in the recording medium, a multitask control section, a display control section and a reception section for receiving an specification of the tab and the direction of the video for a processing target for the selected function. The multitask control section performs plural functions in parallel simultaneously which plural functions includes a function for recording the inputted video in the recording medium. The display control section displays tabs assigned to the plural functions respectively and processing situation of the function selected by specifying the tab on the display.
    Type: Grant
    Filed: September 9, 2008
    Date of Patent: March 31, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshiro Osaki, Tomoaki Sugiyama, Toshiki Mori, Naoko Satoh
  • Publication number: 20150011380
    Abstract: The present invention provides a catalyst for carbon nanotube production capable of continuously mass-producing a carbon nanotube having a long fiber length and excellent conductivity. The catalyst for carbon nanotube production of the present invention includes a carrier particle which is configured to include a metal oxide and has voids therein, and a metal catalyst which is carried on the carrier particle. In a pore distribution curve of the carrier particle which is obtained by a mercury penetration method, when an integrated value of volumes of pores having a pore size of equal to or larger than 0.1 ?m is set to be a volume of voids per unit mass of the carrier particle, the volume of the voids is set to be in a range of 0.6 cm3/g to 2.2 cm3/g.
    Type: Application
    Filed: February 22, 2013
    Publication date: January 8, 2015
    Inventors: Nariyuki Tomonaga, Tomoaki Sugiyama, Yasushi Mori, Takashi Kurisaki, Takanori Suto, Kota Kikuchi