Patents by Inventor Tomoaki Sugiyama
Tomoaki Sugiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240424705Abstract: A chip manufacturing method for manufacturing a plurality of chips by dividing a workpiece with a plurality of intersecting streets set thereon includes a cutting step of cutting a front surface of the workpiece by a cutting blade to thereby form cut grooves along the streets, and then a grinding step of grinding a back surface on the side opposite to the front surface of the workpiece to thereby thin the workpiece to a finish thickness of reaching the cut grooves and to divide the workpiece into the plurality of chips. The cut grooves are formed such that the position of the groove bottom in the thickness direction of the workpiece varies in the width direction of the cut groove, and, in the grinding step, grinding is started from that tip of the groove bottom of the cut groove which is remote from the front surface of the workpiece.Type: ApplicationFiled: May 30, 2024Publication date: December 26, 2024Inventors: Tomoaki SUGIYAMA, Naoko YAMAMOTO
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Publication number: 20240393699Abstract: A mask blank substrate has first and second main surfaces of 152 mm×152 mm-square and 6.35 mm-thick, in which in a pseudo TTV map obtained by adding up maps of the first and second main surfaces, a difference between highest and lowest heights of a TTV1 map, is ?35 nm, excluding a primary component when a plane function is derived, and a difference between highest and lowest heights of a TTV2 map, is ?25 nm, excluding primary and secondary components when a curved-surface function is derived, in fitting of the pseudo TTV map within a cross-shaped region formed in a case where a first rectangular region is overlapped with a second rectangular region, the first and second rectangular regions of 132 mm×104 mm being orthogonal to each other, and parallel to four sides of the main surfaces centered at intersections of diagonal lines of the main surfaces.Type: ApplicationFiled: May 23, 2024Publication date: November 28, 2024Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Tomoaki SUGIYAMA, Daijitsu HARADA, Harunobu MATSUI, Masaki TAKEUCHI
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Publication number: 20240166518Abstract: The carbon nanotube structure in which a plurality of carbon nanotubes are assembled includes a joining portion of end portions of carbon nanotubes and a joining portion of an end portion and a side wall portion of the carbon nanotubes.Type: ApplicationFiled: March 11, 2022Publication date: May 23, 2024Applicants: MITSUBISHI HEAVY INDUSTRIES, LTD., SHINSHU UNIVERSITYInventors: Tomoaki SUGIYAMA, Hidekazu NISHINO, Toshiyasu KIYABU, Katsumi KANEKO
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Publication number: 20240006241Abstract: A laminate substrate is divided along a plurality of intersecting scheduled division lines. The laminate substrate has a first substrate and a second substrate formed of the same material, laminated through an intermediate layer containing metal. The laminate substrate is divided by cutting the laminate substrate along the scheduled division lines by use of a substrate cutting blade to form the first substrate with first cut grooves each having a width larger than a cutting edge thickness of a metal cutting blade which is larger in cutting edge thickness than the substrate cutting blade, and thereafter cutting the laminate substrate along the first cut grooves by use of the metal cutting blade to cut the intermediate layer and to form second cut grooves each having a width corresponding to the cutting edge thickness of the metal cutting blade.Type: ApplicationFiled: June 29, 2023Publication date: January 4, 2024Inventors: Naoko YAMAMOTO, Tomoaki SUGIYAMA
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Publication number: 20230418149Abstract: A substrate for mask blanks having first and second main surfaces of 152 mm×152 mm square and a thickness of 6.35 mm, wherein: when a range of 132 mm×132 mm square centered on an intersection of diagonal lines is defined as a calculation region in each of the first and second main surfaces, on a substrate surface of the calculation region of at least one of the first and second main surfaces, flatness of the substrate surface of the calculation region based on a least square plane is 100 nm or less, and a difference (PV) between a highest value and a lowest value of a height of a calculation surface represented by a difference between shapes of the substrate surfaces before and after smoothing processing with a Gaussian filter (10 mm×10 mm) based on the least square plane is 20 nm or less.Type: ApplicationFiled: June 1, 2023Publication date: December 28, 2023Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Tomoaki SUGIYAMA, Daijitsu HARADA, Harunobu MATSUI, Naoki YARITA, Masaki TAKEUCHI
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Publication number: 20230037856Abstract: A mask blanks substrate having a flatness of a calculation surface of 100 nm or less when a calculation region passing through central portions of first and second main surfaces and extending in a horizontal direction is set, a first region surface is cut out, a second region surface is cut out by setting a reference plane and a rotation axis and rotating the substrate by 180°, least square planes are calculated, the first and second region surfaces are converted into height maps to positions on the least square planes, the height map of the to second region surface is set as a reverse height map by symmetrically moving the height map, and a map of a calculated height obtained by adding heights of the height map of the first region surface and the reverse height map of the second region surface is set as the calculation surface.Type: ApplicationFiled: July 1, 2022Publication date: February 9, 2023Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Tomoaki SUGIYAMA, Daijitsu HARADA, Harunobu MATSUI, Naoki YARITA, Masaki TAKEUCHI
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Patent number: 11105752Abstract: An inspecting apparatus for inspecting a test piece. The inspecting apparatus includes a test piece holding mechanism for holding the test piece, the test piece holding mechanism having a mounting portion formed from a transparent member having upper and lower exposed surfaces, the upper exposed surface of the transparent member functioning as a mounting surface for mounting the test piece, whereby the test piece mounted on the mounting surface of the mounting portion is adapted to be held by the test piece holding mechanism. The inspecting apparatus further includes an imaging mechanism for imaging the test piece held by the test piece holding mechanism, the imaging mechanism having a first imaging unit provided above the mounting portion, a second imaging unit provided below the mounting portion, and a connecting portion for connecting the first imaging unit and the second imaging unit.Type: GrantFiled: April 1, 2020Date of Patent: August 31, 2021Assignee: DISCO CORPORATIONInventors: Tomoaki Sugiyama, Hirohiko Kozai, Naoki Morikawa
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Publication number: 20200333261Abstract: An inspecting apparatus for inspecting a test piece. The inspecting apparatus includes a test piece holding mechanism for holding the test piece, the test piece holding mechanism having a mounting portion formed from a transparent member having upper and lower exposed surfaces, the upper exposed surface of the transparent member functioning as a mounting surface for mounting the test piece, whereby the test piece mounted on the mounting surface of the mounting portion is adapted to be held by the test piece holding mechanism. The inspecting apparatus further includes an imaging mechanism for imaging the test piece held by the test piece holding mechanism, the imaging mechanism having a first imaging unit provided above the mounting portion, a second imaging unit provided below the mounting portion, and a connecting portion for connecting the first imaging unit and the second imaging unit.Type: ApplicationFiled: April 1, 2020Publication date: October 22, 2020Inventors: Tomoaki SUGIYAMA, Hirohiko KOZAI, Naoki MORIKAWA
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Patent number: 10800708Abstract: The object of the present invention is to provide an antibacterial material capable of sustaining antibacterial properties for a long time. The object can be solved by a silver-containing calcium phosphate sintered body having silver particles therein, wherein an average particle diameter of the silver particles is 0.01 to 0.5 ?m.Type: GrantFiled: February 28, 2017Date of Patent: October 13, 2020Assignees: TOKYO INSTITUTE OF TECHNOLOGY, KYOCERA CORPORATIONInventors: Toshiyuki Ikoma, Tomoaki Sugiyama, Hiroaki Igashira, Yugo Fukuyama, Michimasa Kamo, Masayuki Kyomoto, Takashi Sasaki
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Patent number: 10688616Abstract: A cutting apparatus having a cutting blade for cutting a workpiece held on a chuck table is disclosed. The cutting apparatus includes an elastic wave detecting sensor for detecting an elastic wave due to the rotation of the cutting blade, a reference data storing section configured to store reference data as a set of reference processing elastic wave data and reference idling elastic wave data, a threshold value storing section, a ratio calculating section, and a determining section.Type: GrantFiled: April 18, 2018Date of Patent: June 23, 2020Assignee: DISCO CORPORATIONInventors: Takahiko Tsuno, Saki Miyakawa, Tomoaki Sugiyama
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Patent number: 10629445Abstract: A wafer processing method for processing a wafer having devices on the front side is provided. The wafer processing method includes a back grinding step of grinding the wafer to form a recess and an annular reinforcing portion surrounding the recess on the back side of the wafer, and a dividing step of cutting the wafer along division lines formed on the front side of the wafer. In the back grinding step, a taper surface is formed between the bottom surface of the recess and the annular reinforcing portion. The taper surface is inclined with respect to a direction perpendicular to the bottom surface of the recess. In the dividing step, a cutting blade is lowered to start cutting at a position radially inside the outer circumference of the wafer and is subsequently raised to stop cutting at another position radially inside the outer circumference of the wafer.Type: GrantFiled: June 27, 2018Date of Patent: April 21, 2020Assignee: DISCO CORPORATIONInventors: Katsuhiko Suzuki, Hisashi Arakida, Tomoaki Sugiyama
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Patent number: 10361102Abstract: A cutting apparatus includes a cutting unit including a cutting blade that has a cutting edge for cutting a dresser board. An elastic wave detection sensor is disposed in the cutting unit, for detecting an elastic wave produced when the dresser board is cut. The elastic wave detection sensor produces an output signal representing the detected elastic wave when the cutting blade cuts the dresser board and is dressed thereby, the output signal being variable as the cutting blade is progressively dressed by the dresser board. A control unit stores in advance, as a threshold value, the value of the output signal when the dressing of the cutting blade is completed. The control unit stops cutting the dresser board with the cutting blade and finishes the dressing of the cutting blade when the output signal produced by the elastic wave detection sensor reaches the threshold value.Type: GrantFiled: January 19, 2018Date of Patent: July 23, 2019Assignee: DISCO CORPORATIONInventors: Takuya Kaminaga, Tomoaki Sugiyama, Saki Miyakawa
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Publication number: 20190177229Abstract: The object of the present invention is to provide an antibacterial material capable of sustaining antibacterial properties for a long time. The object can be solved by a silver-containing calcium phosphate sintered body having silver particles therein, wherein an average particle diameter of the silver particles is 0.01 to 0.5 ?m.Type: ApplicationFiled: February 28, 2017Publication date: June 13, 2019Applicants: Tokyo Institute of Technology, KYOCERA CorporationInventors: Toshiyuki IKOMA, Tomoaki SUGIYAMA, Hiroaki IGASHIRA, Yugo FUKUYAMA, Michimasa KAMO, Masayuki KYOMOTO, Takashi SASAKI
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Publication number: 20190006185Abstract: A wafer processing method for processing a wafer having devices on the front side is provided. The wafer processing method includes a back grinding step of grinding the wafer to form a recess and an annular reinforcing portion surrounding the recess on the back side of the wafer, and a dividing step of cutting the wafer along division lines formed on the front side of the wafer. In the back grinding step, a taper surface is formed between the bottom surface of the recess and the annular reinforcing portion. The taper surface is inclined with respect to a direction perpendicular to the bottom surface of the recess. In the dividing step, a cutting blade is lowered to start cutting at a position radially inside the outer circumference of the wafer and is subsequently raised to stop cutting at another position radially inside the outer circumference of the wafer.Type: ApplicationFiled: June 27, 2018Publication date: January 3, 2019Inventors: Katsuhiko Suzuki, Hisashi Arakida, Tomoaki Sugiyama
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Publication number: 20180304429Abstract: Disclosed herein is a cutting apparatus having a cutting blade for cutting a workpiece held on a chuck table.Type: ApplicationFiled: April 18, 2018Publication date: October 25, 2018Inventors: Takahiko Tsuno, Saki Miyakawa, Tomoaki Sugiyama
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Publication number: 20180211851Abstract: A cutting apparatus includes a cutting unit including a cutting blade that has a cutting edge for cutting a dresser board. An elastic wave detection sensor is disposed in the cutting unit, for detecting an elastic wave produced when the dresser board is cut. The elastic wave detection sensor produces an output signal representing the detected elastic wave when the cutting blade cuts the dresser board and is dressed thereby, the output signal being variable as the cutting blade is progressively dressed by the dresser board. A control unit stores in advance, as a threshold value, the value of the output signal when the dressing of the cutting blade is completed. The control unit stops cutting the dresser board with the cutting blade and finishes the dressing of the cutting blade when the output signal produced by the elastic wave detection sensor reaches the threshold value.Type: ApplicationFiled: January 19, 2018Publication date: July 26, 2018Inventors: Takuya Kaminaga, Tomoaki Sugiyama, Saki Miyakawa
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Patent number: 9458018Abstract: Catalyst support means for producing a fluid catalyst; a reduction basin that pretreats an active metal of the obtained fluid catalyst in a reducing atmosphere; a fluid bed reactor which is supplied with a reduction-treated fluid catalyst having undergone the reduction, for producing a nanocarbon material; and a moisture application basin for supplying a slight amount of moisture to a source gas to be supplied to the aforementioned fluid bed reactor are provided.Type: GrantFiled: February 26, 2013Date of Patent: October 4, 2016Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Tomoaki Sugiyama, Kiyoshi Tatsuhara, Ikumasa Koshiro, Atsushi Tanaka, Yasushi Mori, Takashi Kurisaki
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Patent number: 9138728Abstract: The present invention provides a catalyst for forming carbon nanotubes that improves a yield at the time of manufacturing carbon nanotubes and enables continuous mass production of carbon nanotubes with high purity. The catalyst for forming carbon nanotubes of the present invention includes a carrier that includes MgO and a metal catalyst that is supported by the carrier, and the concentration of the MgO in the carrier is set equal to 99 mass % or higher.Type: GrantFiled: February 22, 2013Date of Patent: September 22, 2015Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Nariyuki Tomonaga, Tomoaki Sugiyama, Yasushi Mori, Takashi Kurisaki, Takanori Suto, Kota Kikuchi
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Patent number: 8995818Abstract: It is provided a recorder apparatus in which a user can use simply and efficiently plural functions which can be performed simultaneously. According to an embodiment of the invention, a recorder apparatus has a display, an input section for a video being inputted, a random access recording medium for recording the video, an output section for outputting the video recorded in the recording medium, a multitask control section, a display control section and a reception section for receiving an specification of the tab and the direction of the video for a processing target for the selected function. The multitask control section performs plural functions in parallel simultaneously which plural functions includes a function for recording the inputted video in the recording medium. The display control section displays tabs assigned to the plural functions respectively and processing situation of the function selected by specifying the tab on the display.Type: GrantFiled: September 9, 2008Date of Patent: March 31, 2015Assignee: Kabushiki Kaisha ToshibaInventors: Yoshiro Osaki, Tomoaki Sugiyama, Toshiki Mori, Naoko Satoh
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Publication number: 20150011380Abstract: The present invention provides a catalyst for carbon nanotube production capable of continuously mass-producing a carbon nanotube having a long fiber length and excellent conductivity. The catalyst for carbon nanotube production of the present invention includes a carrier particle which is configured to include a metal oxide and has voids therein, and a metal catalyst which is carried on the carrier particle. In a pore distribution curve of the carrier particle which is obtained by a mercury penetration method, when an integrated value of volumes of pores having a pore size of equal to or larger than 0.1 ?m is set to be a volume of voids per unit mass of the carrier particle, the volume of the voids is set to be in a range of 0.6 cm3/g to 2.2 cm3/g.Type: ApplicationFiled: February 22, 2013Publication date: January 8, 2015Inventors: Nariyuki Tomonaga, Tomoaki Sugiyama, Yasushi Mori, Takashi Kurisaki, Takanori Suto, Kota Kikuchi