Abstract: A mask-integrated surface protective tape, which has at least a substrate film and a mask material layer, wherein the mask material layer is provided directly on the substrate film, or is provided on the substrate film through a temporary-adhesive layer, and wherein a parallel ray transmittance of the mask material layer at a wavelength region of 355 nm is 30% or less; and a method of producing a semiconductor chip.

Abstract: A mask-integrated surface protective tape, containing: a substrate film; a temporary-adhesive layer provided on the substrate film; and a mask material layer provided on the temporary-adhesive layer; wherein the mask material layer and the temporary-adhesive layer each contain a (meth)acrylic copolymer; and wherein the mask-integrated surface protective tape is used for a method of producing a semiconductor chip utilizing a plasma-dicing.

Abstract: After grinding is performed on a semiconductor wafer, the semiconductor wafer is fixed on the electrostatic chuck so as to cause the front surface side of the semiconductor wafer to face the electrostatic chuck. Next, a masking material layer is formed on the rear surface of the ground semiconductor wafer in a state where a surface protection tape is bonded thereto. Then, a masking tape is cut by irradiating, from the rear surface side, portions thereof corresponding to a plurality of streets appropriately formed in a grid shape in a pattern surface with a laser beam so as to form openings for the streets in the semiconductor wafer. Then, SF6 plasma irradiation is performed from the rear surface side so as to etch the semiconductor wafer that has been exposed in the street portions. Finally, ashing is performed using O2 plasma.

Abstract: The invention provides a fuel cell module that can inhibit reduction in the load applied to the fuel cell stack and that can facilitate assembly. In the fuel cell module of this disclosure, each end plate has a groove on the side not facing the fuel cell stack, as viewed in the stacking direction of the fuel cell stack. Each fastening member also has a band part, and an anchoring part that is disposed on at least one end of the band part. The anchoring part is connected to the end plate by the connecting member, the tip section of the anchoring part having a shape complementary to the groove of the end plate in at least one direction within the plane of the end plate, and being fitted into the groove of the end plate, whereby the fastening member is fastened to the end plate.

Abstract: A surface side is irradiated with an SF6 gas plasma to etch a semiconductor wafer which has been peeled off in street portions, and divide the semiconductor wafer into a plurality of individual semiconductor chips. A removing agent is subsequently supplied from the surface side. At that time, it is preferable that the semiconductor wafer divided into the plurality of chips is rotated at high speed. Accordingly, a mask material layer remaining on the surface is removed by the removing agent. Moreover, the removing agent is preferably an organic solvent, and more preferably, methyl ethyl ketone, ethanol, and ethyl acetate, or a combination of these.

Abstract: A mask-integrated surface protective film, containing: a substrate film, and a mask material layer provided on the substrate film; wherein the mask material layer is an ethylene-vinyl acetate copolymer resin, an ethylene-methyl acrylate copolymer resin, or an ethylene-butyl acrylate copolymer resin; and wherein the thickness of the mask material layer is 50 ?m or less.

Abstract: A fuel cell unit includes: a fuel cell module including a fuel cell stack including: a stacked body in which unit cells are stacked; a pair of end plates sandwiching the stacked body in a stacking direction; a facing member facing an outer surface of the stacked body extending along the stacking direction; and first and second restriction members arranged between the facing member and the stacked body, and restricting a position of the stacked body in a direction perpendicular to the stacking direction by contacting with the outer surface; and fixing members fixing the fuel cell module to a fixed member.

Abstract: After grinding is performed on a semiconductor wafer, the semiconductor wafer is fixed on the electrostatic chuck so as to cause the front surface side of the semiconductor wafer to face the electrostatic chuck. Next, a masking material layer is formed on the rear surface of the ground semiconductor wafer in a state where a surface protection tape is bonded thereto. Then, a masking tape is cut by irradiating, from the rear surface side, portions thereof corresponding to a plurality of streets appropriately formed in a grid shape in a pattern surface with a laser beam so as to form openings for the streets in the semiconductor wafer. Then, SF6 plasma irradiation is performed from the rear surface side so as to etch the semiconductor wafer that has been exposed in the street portions. Finally, ashing is performed using O2 plasma.

Abstract: A mask-integrated surface protective tape, which has at least a substrate film and a mask material layer, wherein the mask material layer is provided directly on the substrate film, or is provided on the substrate film through a temporary-adhesive layer, and wherein a parallel ray transmittance of the mask material layer at a wavelength region of 355 nm is 30% or less; and a method of producing a semiconductor chip.

Abstract: A surface side is irradiated with an SF6 gas plasma to etch a semiconductor wafer which has been peeled off in street portions, and divide the semiconductor wafer into a plurality of individual semiconductor chips. A removing agent is subsequently supplied from the surface side. At that time, it is preferable that the semiconductor wafer divided into the plurality of chips is rotated at high speed. Accordingly, a mask material layer remaining on the surface is removed by the removing agent. Moreover, the removing agent is preferably an organic solvent, and more preferably, methyl ethyl ketone, ethanol, and ethyl acetate, or a combination of these.

Abstract: A fuel cell unit includes; a fuel cell module including a fuel cell stack including: a stacked body in which unit cells are stacked; a pair of end plates sandwiching the stacked body in a stacking direction; a facing member facing an outer surface of the stacked body extending along the stacking direction; and first and second restriction members arranged between the facing member and the stacked body, and restricting a position of the stacked body in a direction perpendicular to the stacking direction by contacting with the outer surface; and fixing members fixing the fuel cell module to a fixed member.

Abstract: A method of producing a semiconductor chip, including the following steps (a) to (d): (a) a step of, in the state of having laminated a mask-integrated surface protective tape on the side of a patterned surface of a semiconductor wafer, grinding the backing-face of the semiconductor wafer; laminating a wafer fixing tape on the backing-face side of the ground semiconductor wafer; and supporting and fixing the wafer to a ring flame; (b) a step of, after peeling the surface protective tape thereby to expose the mask material layer on top, forming an opening of a street of the semiconductor wafer; (c) a plasma dicing step of segmentalizing the semiconductor wafer by a plasma irradiation to singulate it into semiconductor chips; and (d) an ashing step of removing the mask material layer by the plasma irradiation.

Abstract: A mask-integrated surface protective tape, containing: a substrate film; a temporary-adhesive layer provided on the substrate film; and a mask material layer provided on the temporary-adhesive layer; wherein the mask material layer and the temporary-adhesive layer each contain a (meth)acrylic copolymer; and wherein the mask-integrated surface protective tape is used for a method of producing a semiconductor chip utilizing a plasma-dicing.

Abstract: A method of producing a semiconductor chip, including the following steps (a) to (d): (a) a step of, in the state of having laminated a mask-integrated surface protective tape on the side of a patterned surface of a semiconductor wafer, grinding the backing-face of the semiconductor wafer; laminating a wafer fixing tape on the backing-face side of the ground semiconductor wafer; and supporting and fixing the wafer to a ring flame; (b) a step of, after peeling the surface protective tape thereby to expose the mask material layer on top, forming an opening of a street of the semiconductor wafer; (c) a plasma dicing step of segmentalizing the semiconductor wafer by a plasma irradiation to singulate it into semiconductor chips; and (d) an ashing step of removing the mask material layer by the plasma irradiation.

Abstract: A mask-integrated surface protective film, containing: a substrate film, and a mask material layer provided on the substrate film; wherein the mask material layer is an ethylene-vinyl acetate copolymer resin, an ethylene-methyl acrylate copolymer resin, or an ethylene-butyl acrylate copolymer resin; and wherein the thickness of the mask material layer is 50 ?m or less.

Abstract: A fuel cell has an electrolyte membrane of 5 to 10 ?m in thickness. A control device for this fuel cell comprises: a controller configured to control an amount of power generation by the fuel cell according to a required amount of electric power; and a power generation reducer configured to reduce the amount of power generation by the fuel cell at a humidity of an electrolyte membrane of 95 to 98% RH to be lower than the amount of power generation at the humidity of the electrolyte membrane of lower than 95% RH.

Abstract: The object is to suppress degradation of the durability of an electrolyte membrane caused by deformation by expansion and contraction of the electrolyte membrane. A controller 150 calculates a humidity P of an electrolyte membrane 112 based on a cell resistance value (step S11) and determines whether the humidity P of the electrolyte membrane 112 is less than a humidity threshold A (step S12). When the humidity P is less than the humidity threshold A, the controller 150 determines that a dimensional change rate of the electrolyte membrane is not greater than a predetermined value and performs a process of increasing the humidity of the electrolyte membrane 112 (step S13). The predetermined value is a dimensional change rate that is unlikely to have damage by drying stress.

Abstract: A fuel cell has an electrolyte membrane of 5 to 10 ?m in thickness. A control device for this fuel cell comprises: a controller configured to control an amount of power generation by the fuel cell according to a required amount of electric power; and a power generation reducer configured to reduce the amount of power generation by the fuel cell at a humidity of an electrolyte membrane of 95 to 98% RH to be lower than the amount of power generation at the humidity of the electrolyte membrane of lower than 95% RH.

Abstract: The object is to suppress degradation of the durability of an electrolyte membrane caused by deformation by expansion and contraction of the electrolyte membrane. A controller 150 calculates a humidity P of an electrolyte membrane 112 based on a cell resistance value (step S11) and determines whether the humidity P of the electrolyte membrane 112 is less than a humidity threshold A (step S12). When the humidity P is less than the humidity threshold A, the controller 150 determines that a dimensional change rate of the electrolyte membrane is not greater than a predetermined value and performs a process of increasing the humidity of the electrolyte membrane 112 (step S13). The predetermined value is a dimensional change rate that is unlikely to have damage by drying stress.

Abstract: The present invention relates to a solid type rubber-based pressure-sensitive adhesive composition, which is prepared by adding a tackifier, a softener, and an isocyanate-based crosslinking agent reactable with active hydrogen into an acrylic rubber containing a monomer having an active hydrogen-containing functional group as a copolymerization component to thereby obtain a solventless and nonaqueous pressure-sensitive adhesive composition, and particularly it relates to a solid type rubber-based pressure-sensitive adhesive composition having the above-mentioned constitution, in which the above-mentioned acrylic rubber includes a copolymer containing butyl acrylate as a main component, and as the copolymerization component a monomer having a hydroxyl group or a carboxyl group as the active hydrogen-containing functional group.