Abstract: Provided is a Bi-based piezoelectric material having good piezoelectric properties. The piezoelectric material includes a perovskite-type metal oxide represented by the following general formula (1): Ax(ZnjTi(1-j))l(MgkTi(1-k))mMnO3??General formula (1) where: A represents a Bi element, or one or more kinds of elements selected from the group consisting of trivalent metal elements and containing at least a Bi element; M represents at least one kind of an element selected from the group consisting of Fe, Al, Sc, Mn, Y, Ga, and Yb; and 0.9?x?1.25, 0.4?j?0.6, 0.4?k?0.6, 0.09?l?0.49, 0.19?m?0.64, 0.13?n?0.48, and l+m+n=1 are satisfied.

Abstract: An image forming apparatus can change an operating state between a normal mode and a power saving mode having power consumption lower than that of the normal mode. The image forming apparatus sets a detection range based on at least one of an angle of a manipulation panel, existence or non-existence of an output to the sheet discharge unit, and existence or non-existence of placement of the authentication device. The image forming apparatus detects an approach of a human body when the operating state is in the power saving mode. When a sensor detects that the human body approaches the detection range, the image forming apparatus returns the operating state from the power saving mode to the normal mode.

Abstract: Provided is a Bi-based piezoelectric material having good piezoelectric properties. The piezoelectric material includes a perovskite-type metal oxide represented by the following general formula (1): Ax(ZnjTi(1-j))l(MgkTi(1-k))mMnO3??General formula (1) where: A represents a Bi element, or one or more kinds of elements selected from the group consisting of trivalent metal elements and containing at least a Bi element; M represents at least one kind of an element selected from the group consisting of Fe, Al, Sc, Mn, Y, Ga, and Yb; and 0.9?x?1.25, 0.4?j?0.6, 0.4?k?0.6, 0.09?l?0.49, 0.19?m?0.64, 0.13?n?0.48, and l+m+n=1 are satisfied.

Abstract: There is provided a profile measuring apparatus which measures a profile of an object, including an imaging element; an image formation optical system including an objective lens; a measuring direction changing unit which is configured to change inclination of a surface of the object with respect to the objective lens based on information of the inclination of the surface of the object so that a light flux enters the objective lens with an aperture angle not less than a predetermined degree; and a measuring unit which is configured to measure the profile of the object based on the image, of the object on which the pattern is projected, obtained by the imaging element.

Abstract: The present invention relates to a shape measuring device that can improve measurement accuracy. A liquid crystal element 35 projects striped projection patterns whose intensities are changed according to the position in three sinusoidal states with initial phases of 0, 120, and 240 degrees onto an object 2 to be measured, each of a CCD sensor 44 and a CCD sensor 50 picks up an image obtained by forming reflection light from the object 2 to be measured by the projected projection pattern, and a controller 23 evaluates reliability of a measurement result at a position where a position conjugated with an image pickup surface of image pickup means is different along an optical path direction on the basis of each received light amount of each pixel of a plurality of images picked up when at least two projection patterns are projected. As a result, measurement accuracy can be improved. The present invention can be applied to a shape measuring device that measures the shape of an object to be measured.

Abstract: A profile measuring apparatus includes: an irradiating unit which is configured to irradiate the measuring object with light from the light source to form a spotted pattern; a scanner which is configured to relatively scan the surface of the measuring object with the spotted pattern; a light receiver which includes a plurality of light-receiving pixels aligned to detect an image of the spotted pattern generated by the light irradiating the measuring object from a different direction different from an irradiation direction of the light irradiating the measuring object; a changing unit which is configured to change positions, at which signals utilized to detect a position of the image of the spotted pattern are obtained, according to the irradiation direction of the light; and a controller which is configured to calculate positional information of the measuring object based on the signals from the light-receiving pixels.

Abstract: A shape measuring device includes: a slit pattern projection unit (1) for projecting a slit light onto a test object (20); an imaging lens (3) and a plane parallel plate (4) for forming a plurality of slit images, which is generated when the slit light is reflected by the object (20), separated in a direction perpendicular to a slit base line direction; an imaging unit (5) for picking up the plurality of slit images and generating a plurality of slit picture images; an XYZ stage drive unit (12) for relatively moving the slit light and the test object (20) in a direction different from the slit base line direction of the slit light; a slit picture image selection unit (8) for comparing the brightness of each pixel of slit picture image on the slit base line direction, and selecting a slit picture image having an optimum brightness to determine the shape of the test object (20) on the slit base line direction, and acquiring image data to determine the shape of the test object (20); and a shape computing unit (9

Abstract: There is provided a profile measuring apparatus which measures a profile of an object, including an imaging element; an image formation optical system including an objective lens; a measuring direction changing unit which is configured to change inclination of a surface of the object with respect to the objective lens based on information of the inclination of the surface of the object so that a light flux enters the objective lens with an aperture angle not less than a predetermined degree; and a measuring unit which is configured to measure the profile of the object based on the image, of the object on which the pattern is projected, obtained by the imaging element.

Abstract: The present invention relates to a shape measuring device that can improve measurement accuracy. A liquid crystal element 35 projects striped projection patterns whose intensities are changed according to the position in three sinusoidal states with initial phases of 0, 120, and 240 degrees onto an object 2 to be measured, each of a CCD sensor 44 and a CCD sensor 50 picks up an image obtained by forming reflection light from the object 2 to be measured by the projected projection pattern, and a controller 23 evaluates reliability of a measurement result at a position where a position conjugated with an image pickup surface of image pickup means is different along an optical path direction on the basis of each received light amount of each pixel of a plurality of images picked up when at least two projection patterns are projected. As a result, measurement accuracy can be improved. The present invention can be applied to a shape measuring device that measures the shape of an object to be measured.

Abstract: The invention relates to a shape measuring device and method, and a program therefor, that allow measuring the shape of a test object, more simply and reliably, using a single-chip color sensor. An optical low-pass filter (24) expands a slit beam reflected on a test object (12), in a direction perpendicular to a baseline direction. A CCD sensor (25) has R, G and B pixels arranged in a Bayer array, and the CCD sensor (25) outputs image signals that are obtained by the pixels receiving the slit beam. On the basis of image signals of the G pixels, an image processing unit (26) detects the timing at which the slit beam passes over a site of the test object (12) that is pre-set for the G pixels and, on the basis of image signals of the R pixels and the B pixels, controls a projection unit (22) to adjust the intensity of the slit beam. A dot group computing unit (27) computes the position of the test object (12) on the basis of the timing detected for the G pixels.

Abstract: A shape measuring device includes: a slit pattern projection unit (1) for projecting a slit light onto a test object (20); an imaging lens (3) and a plane parallel plate (4) for forming a plurality of slit images, which is generated when the slit light is reflected by the object (20), separated in a direction perpendicular to a slit base line direction; an imaging unit (5) for picking up the plurality of slit images and generating a plurality of slit picture images; an XYZ stage drive unit (12) for relatively moving the slit light and the test object (20) in a direction different from the slit base line direction of the slit light; a slit picture image selection unit (8) for comparing the brightness of each pixel of slit picture image on the slit base line direction, and selecting a slit picture image having an optimum brightness to determine the shape of the test object (20) on the slit base line direction, and acquiring image data to determine the shape of the test object (20); and a shape computing unit (9

Abstract: A seat reclining apparatus includes: a disk-shaped base-side case; a disk-shaped arm-side case; a center shaft rotatably disposed in center part of the base-side case and center part of the arm-side case; a cam member fitted on the center shaft to rotate integrally with the center shaft; a lock tooth unit which cooperates with the cam member and engaged with a inner circumferential tooth portion formed on an inner periphery portion of the arm-side case; a lock spring; a protrusion protruding from an outer surface of the base-side case; and a recess at a position corresponding to the protrusion on an inner surface of the base-side case, wherein the lock spring is arranged in a space formed by the recess and a component accommodation space formed between the base-side case and arm-side case.

Abstract: A mark position detection apparatus includes: an illumination unit that illuminates a substrate having a mark formed thereupon; an image-capturing unit that captures an image of the substrate by using reflected light from the substrate and outputs image signals; a storage unit at which information related to fixed pattern noise contained in the image signals output by the image-capturing unit is stored in memory; and a control unit that calculates a position of the mark on the substrate based upon the information related to the fixed pattern noise stored in memory at the storage unit and the image signals output from the image-capturing unit.

Abstract: A security system design supporting tool and method are disclosed, in which security requirements (PP) and security specifications (ST) used for designing a product or a system (TOE) based on CC requirements can be prepared efficiently and uniformly even by ordinary designers other than specialists. In a security system design supporting method, registered PPs and past PP/ST generation cases are so structured as to reuse and/or reference as templates, a draft is automatically generated, and the draft thus generated is additionally modified or corrected by partial automatic generation utilizing a database of past generation cases and partial case accumulated in the generation process thereof.

Abstract: A security support and evaluation system in accordance with the present invention accepts from an operator via an input unit 16, a first specification of a system to be evaluated and a second specification of each of the components constituting the system, and then retrieves data from a security countermeasure database 131 stored in an external storage unit 13 and reads out security countermeasures to be executed to each of the components of the specified system to be evaluated, and then displays on a display unit 17, the security countermeasures read out in correspondence with each of the components of the specified system to be evaluated, and then accepts from the operator via the input unit 16, information whether or not each of the security countermeasures is executed, and thereafter evaluates the state of security based on the information and displays evaluation results on the display unit 17.

Abstract: A mark position detection apparatus includes: an illumination unit that illuminates a substrate having a mark formed thereupon; an image-capturing unit that captures an image of the substrate by using reflected light from the substrate and outputs image signals; a storage unit at which information related to fixed pattern noise contained in the image signals output by the image-capturing unit is stored in memory; and a control unit that calculates a position of the mark on the substrate based upon the information related to the fixed pattern noise stored in memory at the storage unit and the image signals output from the image-capturing unit.

Abstract: A process for preparing a copper oxide superconductor of (Ba,Sr)-Cu-C-O containing carbonate radicals is disclosed, which comprises the steps of: mixing alkaline earth metal compounds and a copper compound with a molar ratio of 1.1 to 2.25 to obtain a mixture; pressing said mixture to form a pellet; and sintering said pellet in an oxygen atmosphere, wherein the alkaline earth metal compounds including a barium compound selected from the group consisting of barium carbonate and barium oxalate, and a strontium compound selected from the group consisting of strontium carbonate and strontium oxalate and the copper compound selected from the group consisting of copper carbonate, copper nitrate, copper oxalate and copper oxide.

Abstract: An oxide superconductor contains carbonate radicals and compositions represented by the general formula (Ba.sub.1-x Sr.sub.x).sub.2 Cu.sub.1+y C.sub.w O.sub.3+Z, wherein x, y, w and z satisfy the following relations: 0.25.ltoreq.x.ltoreq.0.64, -0.11.ltoreq.y.ltoreq.0.77, 0.89.ltoreq.w.ltoreq.1.77 and 1.67.ltoreq.z.ltoreq.4.33. The superconductor has a transition temperature of 20 K. or higher and a coherence length of 30 .ANG..