Patents by Inventor Tomofusa SHIBATA
Tomofusa SHIBATA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10093043Abstract: A mold structure has a first mold, a second mold relatively connectable to and disconnectable from the first mold, a heater on at least one of the first and second molds, a transfer member on at least one of the first and second molds, that is relatively movable and separable from the at least one of the first and second molds on which the transfer member is disposed, a transfer surface formed on the transfer member that is placed in contact with a resin sheet fed between the first and second molds to perform transfer molding onto the resin sheet, and a moving mechanism that moves the at least one of the first and second molds on which the transfer member is disposed and the transfer member relative to each other.Type: GrantFiled: May 5, 2015Date of Patent: October 9, 2018Assignee: OMRON CorporationInventors: Koichi Takemura, Tomofusa Shibata, Yoshinori Ito, Yoshikaga Taguchi
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Patent number: 10022897Abstract: A die structure has a first die, a second die that comes in contact with and separate from the first die, a heating unit provided in at least one of the first and second dies, and a transfer member provided in at least one of the first and second dies that brings a resin sheet supplied between the first and second dies into contact with a transfer surface and carrying out transfer molding, and a recess site formed on the transfer member near the transfer surface.Type: GrantFiled: February 8, 2013Date of Patent: July 17, 2018Assignee: OMRON CorporationInventors: Isao Makuta, Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Norikazu Kitamura, Masayuki Shinohara, Kazuhide Hirota, Toshikaga Taguchi, Masayuki Kojima, Yukihiro Takahashi
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Patent number: 9643369Abstract: A transfer molding method includes supplying melted resin to a first metallic mold, conveying the first metallic mold onto which the resin was supplied to a position opposing a second metallic mold, performing transfer molding by sandwiching the resin between the two metallic molds, and cooling the resin after performing transfer molding. The performing transfer molding includes discharging residual air that remains in a recess via a groove portion.Type: GrantFiled: June 20, 2014Date of Patent: May 9, 2017Assignee: OMRON CorporationInventors: Koichi Takemura, Tomofusa Shibata, Yoshinori Ito, Yoshikaga Taguchi, Yoshihisa Yamanaka, Kenji Suzuki, Kazutaka Kaneko, Masayuki Kojima, Yuzuru Fujie, Naoki Hashimoto, Taichi Suzuki
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Patent number: 9452572Abstract: A transfer molding method has a transfer molding step of performing transfer molding to a resin sheet between a first die and a second die, which are disposed while facing each other, by heating at least one of the first and second dies, and a cooling step of cooling the resin sheet. The cooling step includes a first cooling step of cooling the resin sheet while an applied pressure is maintained at a first setting value smaller than a value of an applied pressure in the transfer molding step, and a second cooling step of cooling the resin sheet while the applied pressure is reduced to a second setting value smaller than the first setting value.Type: GrantFiled: February 8, 2013Date of Patent: September 27, 2016Assignee: OMRON CorporationInventors: Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Kenji Suzuki, Kazutaka Kaneko, Yoshikaga Taguchi, Masayuki Kojima
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Publication number: 20150343678Abstract: A mold structure has a first mold, a second mold relatively connectable to and disconnectable from the first mold, a heater on at least one of the first and second molds, a transfer member on at least one of the first and second molds, that is relatively movable and separable from the at least one of the first and second molds on which the transfer member is disposed, a transfer surface formed on the transfer member that is placed in contact with a resin sheet fed between the first and second molds to perform transfer molding onto the resin sheet, and a moving mechanism that moves the at least one of the first and second molds on which the transfer member is disposed and the transfer member relative to each other.Type: ApplicationFiled: May 5, 2015Publication date: December 3, 2015Applicant: OMRON CorporationInventors: Koichi Takemura, Tomofusa Shibata, Yoshinori Ito, Yoshikaga Taguchi
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Patent number: 9162405Abstract: A transfer molding method includes an insertion step of inserting a resin sheet between a first die and a second die, which are disposed opposite each other, a sandwiching step of sandwiching the resin sheet between the first and second dies while a transfer surface of a transfer member is brought into contact with at least one of surfaces of the resin sheet, and a transfer molding step of heating at least one of the first and second dies to melt at least a surface portion of the resin sheet with which the transfer surface of the transfer member is brought into contact, and exhausting residual air remaining in a recess through a groove portion connected to the recess when a thick portion is formed by the recess formed in the transfer surface.Type: GrantFiled: February 8, 2013Date of Patent: October 20, 2015Assignee: OMRON CorporationInventors: Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Kazutaka Kaneko, Yuzuru Fujie, Naoki Hashimoto, Taichi Suzuki, Masayuki Kojima
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Publication number: 20150251341Abstract: A die structure has a first die, a second die that comes in contact with and separate from the first die, a heating unit provided in at least one of the first and second dies, and a transfer member provided in at least one of the first and second dies that brings a resin sheet supplied between the first and second dies into contact with a transfer surface and carrying out transfer molding, and a recess site formed on the transfer member near the transfer surface.Type: ApplicationFiled: February 8, 2013Publication date: September 10, 2015Applicant: OMRON CORPORATIONInventors: Isao Makuta, Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Norikazu Kitamura, Masayuki Shinohara, Kazuhide Hirota, Toshikaga Taguchi, Masayuki Kojima, Yukihiro Takahashi
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Patent number: 9116264Abstract: A method for producing a light guide plate includes forming a light introduction part that introduces light incident through an end face, and forming a light guide plate body that has a thickness less than a maximum thickness of the light introduction part, forming the light guide plate body to be continuously joined to the light introduction part, and forming the light guide plate body so as to cause a light controller to output the incident light to an outside. The light guide plate producing method further includes a conveying step of conveying a resin sheet between a first die and a second die, which are disposed while facing each other, wherein a transfer surface is provided in at least one of surfaces facing each other in the first and second dies.Type: GrantFiled: February 8, 2013Date of Patent: August 25, 2015Assignee: OMRON CorporationInventors: Isao Makuta, Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Norikazu Kitamura, Masayuki Shinohara, Kazuhide Hirota, Yoshikaga Taguchi, Masayuki Kojima, Yukihiro Takahashi
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Publication number: 20150021797Abstract: A transfer molding method includes supplying melted resin to a first metallic mold, conveying the first metallic mold onto which the resin was supplied to a position opposing a second metallic mold, performing transfer molding by sandwiching the resin between the two metallic molds, and cooling the resin after performing transfer molding. The performing transfer molding includes discharging residual air that remains in a recess via a groove portion.Type: ApplicationFiled: June 20, 2014Publication date: January 22, 2015Inventors: Koichi Takemura, Tomofusa Shibata, Yoshinori Ito, Yoshikaga Taguchi, Yoshihisa Yamanaka, Kenji Suzuki, Kazutaka Kaneko, Masayuki Kojima, Yuzuru Fujie, Naoki Hashimoto, Taichi Suzuki
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Publication number: 20140124965Abstract: A transfer molding method has a transfer molding step of performing transfer molding to a resin sheet between a first die and a second die, which are disposed while facing each other, by heating at least one of the first and second dies, and a cooling step of cooling the resin sheet. The cooling step includes a first cooling step of cooling the resin sheet while an applied pressure is maintained at a first setting value smaller than a value of an applied pressure in the transfer molding step, and a second cooling step of cooling the resin sheet while the applied pressure is reduced to a second setting value smaller than the first setting value.Type: ApplicationFiled: February 8, 2013Publication date: May 8, 2014Inventors: Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Kenji Suzuki, Kazutaka Kaneko, Yoshikaga Taguchi, Masayuki Kojima
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Publication number: 20140125918Abstract: A transfer molding method includes an insertion step of inserting a resin sheet between a first die and a second die, which are disposed opposite each other, a sandwiching step of sandwiching the resin sheet between the first and second dies while a transfer surface of a transfer member is brought into contact with at least one of surfaces of the resin sheet, and a transfer molding step of heating at least one of the first and second dies to melt at least a surface portion of the resin sheet with which the transfer surface of the transfer member is brought into contact, and exhausting residual air remaining in a recess through a groove portion connected to the recess when a thick portion is formed by the recess formed in the transfer surface.Type: ApplicationFiled: February 8, 2013Publication date: May 8, 2014Applicant: OMRON CorporationInventors: Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Kazutaka Kaneko, Yuzuru Fujie, Naoki Hashimoto, Taichi Suzuki, Masayuki Kojima
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Publication number: 20140125917Abstract: A method for producing a light guide plate includes forming a light introduction part that introduces light incident through an end face, and forming a light guide plate body that has a thickness less than a maximum thickness of the light introduction part, forming the light guide plate body to be continuously joined to the light introduction part, and forming the light guide plate body so as to cause a light controller to output the incident light to an outside. The light guide plate producing method further includes a conveying step of conveying a resin sheet between a first die and a second die, which are disposed while facing each other, wherein a transfer surface is provided in at least one of surfaces facing each other in the first and second dies.Type: ApplicationFiled: February 8, 2013Publication date: May 8, 2014Applicant: OMRON CORPORATIONInventors: Isao Makuta, Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Norikazu Kitamura, Masayuki Shinohara, Kazuhide Hirota, Yoshikaga Taguchi, Masayuki Kojima, Yukihiro Takahashi
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Patent number: 8632238Abstract: A surface light source device has a point light source disposed opposite a light incident surface of a light guide plate. The light guide plate includes a light introduction part, and a light guide plate body having a thickness smaller than a maximum thickness of the light introduction part. The light introduction part includes an inclined surface inclined from a surface in a portion having a thickness larger than the thickness of the light guide plate body toward an end of the surface of the light guide plate body. The light guide plate body has a light exit pattern for reflecting the light in the light guide plate body to output the light from a light exit surface. In a region close to the point light source of the light guide plate body, the thickness of the light guide plate body increases gradually with distance from the point light source.Type: GrantFiled: February 20, 2013Date of Patent: January 21, 2014Assignee: OMRON CorporationInventors: Gouo Kurata, Koichi Takemura, Tomofusa Shibata, Masayuki Shinohara
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Publication number: 20130242614Abstract: A surface light source device has a point light source disposed opposite a light incident surface of a light guide plate. The light guide plate includes a light introduction part, and a light guide plate body having a thickness smaller than a maximum thickness of the light introduction part. The light introduction part includes an inclined surface inclined from a surface in a portion having a thickness larger than the thickness of the light guide plate body toward an end of the surface of the light guide plate body. The light guide plate body has a light exit pattern for reflecting the light in the light guide plate body to output the light from a light exit surface. In a region close to the point light source of the light guide plate body, the thickness of the light guide plate body increases gradually with distance from the point light source.Type: ApplicationFiled: February 20, 2013Publication date: September 19, 2013Applicant: OMRON CORPORATIONInventors: Gouo KURATA, Koichi TAKEMURA, Tomofusa SHIBATA, Masayuki SHINOHARA