Abstract: The present invention provides a surface-treating agent which improves heat resistance, adhesiveness to resin and solder wettability. The surface-treating agent for metal contains a tetrazole derivative represented by the following formula and/or a salt thereof, wherein R1 and R2 each independently represent a hydrogen atom, a halogen atom, or an alkyl group or an aryl group, etc., which each have a carbon number of not more than 10, and a group having a halogen atom, a hydroxyl group, a carboxyl group, an amino group or a mercapto group added thereto, or represent an amino group, a mercapto group, a hydroxyl group or a carboxyl group; and R3 represents a bond or an alkylene group, etc.

Abstract: A problem for the present invention is to provide a surface-treating agent which improves heat resistance, adhesiveness to resin and solder wettability. This problem is solved by a surface-treating agent for metal comprising a tetrazole derivative represented by the following general formula and/or a salt thereof. (wherein R1 and R2 each independently represent a hydrogen atom, a halogen atom, or an alkyl group or an aryl group, etc., which each have a carbon number of not more than 10, and a group having a halogen atom, a hydroxyl group, a carboxyl group, an amino group or a mercapto group added thereto, or represent an amino group, a mercapto group, a hydroxyl group or a carboxyl group; and R3 represents a bond or an alkylene group, etc.