Patents by Inventor Tomoharu Nakayama

Tomoharu Nakayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210262096
    Abstract: An electroless copper plating bath is an electroless copper plating bath with a pH of 5 to 10 containing a hydrazine compound as a reducing agent and not containing formaldehyde. The electroless copper plating bath comprises at least: an amine-based complexing agent or an amine compound; and an aminocarboxylic acid-based complexing agent.
    Type: Application
    Filed: February 13, 2020
    Publication date: August 26, 2021
    Inventors: Hideaki TAKADA, Tomoharu NAKAYAMA, Hisamitsu YAMAMOTO, Yukinori ODA
  • Publication number: 20200002830
    Abstract: A copper plating solution includes: water-soluble copper salt; ethylenediamine; at least one of EDTA, a substituted derivative of EDTA, an ethylenediamine derivative, or glycine; and at least one of hydantoin or a substituted derivative thereof. The copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with copper.
    Type: Application
    Filed: September 11, 2019
    Publication date: January 2, 2020
    Inventors: YUKO YOSHIOKA, TOMOHARU NAKAYAMA, HISAMITSU YAMAMOTO
  • Patent number: 10450666
    Abstract: A copper plating solution includes: water-soluble copper salt; ethylenediamine; at least one of EDTA, a substituted derivative of EDTA, an ethylenediamine derivative, or glycine; and at least one of hydantoin or a substituted derivative thereof. The copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with copper.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: October 22, 2019
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Yuko Yoshioka, Tomoharu Nakayama, Hisamitsu Yamamoto
  • Publication number: 20170268119
    Abstract: A copper plating solution includes: water-soluble copper salt; ethylenediamine; at least one of EDTA, a substituted derivative of EDTA, an ethylenediamine derivative, or glycine; and at least one of hydantoin or a substituted derivative thereof. The copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with copper.
    Type: Application
    Filed: March 20, 2017
    Publication date: September 21, 2017
    Inventors: YUKO YOSHIOKA, TOMOHARU NAKAYAMA, HISAMITSU YAMAMOTO
  • Publication number: 20130295294
    Abstract: Provided are an electroless copper plating bath and an electroless copper plating method using the electroless copper plating bath, the electroless copper plating bath not containing formaldehyde; being usable under approximately neutral pH conditions; improving plating bath stability; and capable of forming a plating film with a good thickness while controlling deposition outside a pattern. The electroless copper plating bath according to the present invention contains a water-soluble copper salt, and amine borane or a substituted derivative thereof as a reducing agent; does not contain formaldehyde; and has a pH of 4 to 9, wherein polyaminopolyphosphonic acid as a complexing agent, an anionic surface-active agent, an antimony compound, and a nitrogen-containing aromatic compound are contained.
    Type: Application
    Filed: December 28, 2012
    Publication date: November 7, 2013
    Applicant: C. UYEMURA & CO., LTD.
    Inventors: Takahiro ISHIZAKI, Tomoharu NAKAYAMA, Teruyuki HOTTA
  • Patent number: 5656911
    Abstract: A driving device controls a permanent-magnet synchronous motor having a permanent magnet in its rotor using a voltage-type inverter supplying drive power for the synchronous motor, makes the torque of the synchronous motor and the d-axis current flowing in the synchronous motor in the direction of the magnetic flux generated by the permanent magnet approach their own command values, and performs weakening field control by decreasing the d-axis current. To perform the above described control without complicated d-axis current command value operations or temperature amendments to motor constants, the driving device includes a proportional controller for outputting a d-axis signal proportional to the deviation between a d-axis current detection value and a d-axis current command value for the motor.
    Type: Grant
    Filed: December 20, 1995
    Date of Patent: August 12, 1997
    Assignees: Fuji Electric Company, Nissan Motor Company
    Inventors: Tomoharu Nakayama, Koetsu Fujita, Shigenori Kinoshita, Takao Yanase, Masahiko Hanazawa, Shinichiro Kitada, Toshio Kikuchi, Takeshi Aso