Patents by Inventor Tomoharu Oba

Tomoharu Oba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shield structure for pressure sensor, and pressure sensor provided with same
    Patent number: 11624671
    Abstract: In a pressure sensor, a cap-shaped shielding member (17) to block an electric field undesirable for a signal processing electronic circuit unit of a sensor chip (16) is supported by an end surface of a disk conductive plate (19) between one end surface of the sensor chip (16) in a liquid sealing chamber (13) and a diaphragm (32). The conductive plate (19) is electrically connected via a group of input-output terminals (40ai) and bonding wires (Wi), for example, and the sensor chip (16) is supported by one end portion of a chip mounting member (18) which is electrically connected via the group of input and output terminals (40ai) and the bonding wires (Wi).
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: April 11, 2023
    Assignee: SAGINOMIYA SEISAKUSHO, INC.
    Inventors: Kazuya Takimoto, Tatsuya Tanaka, Tomoharu Oba
  • SHIELD STRUCTURE FOR PRESSURE SENSOR, AND PRESSURE SENSOR PROVIDED WITH SAME
    Publication number: 20220113210
    Abstract: In a pressure sensor, a cap-shaped shielding member (17) to block an electric field undesirable for a signal processing electronic circuit unit of a sensor chip (16) is supported by an end surface of a disk conductive plate (19) between one end surface of the sensor chip (16) in a liquid sealing chamber (13) and a diaphragm (32). The conductive plate (19) is electrically connected via a group of input-output terminals (40ai) and bonding wires (Wi), for example, and the sensor chip (16) is supported by one end portion of a chip mounting member (18) which is electrically connected via the group of input and output terminals (40ai) and the bonding wires (Wi).
    Type: Application
    Filed: December 20, 2021
    Publication date: April 14, 2022
    Inventors: Kazuya TAKIMOTO, Tatsuya TANAKA, Tomoharu OBA
  • Shield structure for pressure sensor, and pressure sensor provided with same
    Patent number: 11268873
    Abstract: In a pressure sensor, an electric field acting on one end surface of a sensor chip (16) is blocked by a shielding member (17), and an electric field acting on another end surface of the sensor chip (16) is removed through one end portion of a chip mounting member (18), a group of input and output terminals (40ai), and a bonding wire (Wi).
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: March 8, 2022
    Assignee: SAGINOMIYA SEISAKUSHO, INC.
    Inventors: Kazuya Takimoto, Tatsuya Tanaka, Tomoharu Oba
  • Shield structure for pressure sensor, and pressure sensor provided with same
    Patent number: 11237071
    Abstract: In a pressure sensor, a cap-shaped shielding member (17) to block an electric field undesirable for a signal processing electronic circuit unit of a sensor chip (16) is supported by an end surface of a disk conductive plate (19) between one end surface of the sensor chip (16) in a liquid sealing chamber (13) and a diaphragm (32). The conductive plate (19) is electrically connected via a group of input-output terminals (40ai) and bonding wires (Wi), for example, and the sensor chip 16 is supported by one end portion of a chip mounting member (18) which is electrically connected via the group of input and output terminals (40ai) and the bonding wires (Wi).
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: February 1, 2022
    Assignee: SAGINOMIYA SEISAKUSHO, INC.
    Inventors: Kazuya Takimoto, Tatsuya Tanaka, Tomoharu Oba
  • Shield Structure for Pressure Sensor, and Pressure Sensor Provided with Same
    Publication number: 20210003469
    Abstract: In a pressure sensor, an electric field acting on one end surface of a sensor chip (16) is blocked by a shielding member (17), and an electric field acting on another end surface of the sensor chip (16) is removed through one end portion of a chip mounting member (18), a group of input and output terminals (40ai), and a bonding wire (Wi).
    Type: Application
    Filed: November 13, 2018
    Publication date: January 7, 2021
    Inventors: Kazuya Takimoto, Tatsuya Tanaka, Tomoharu Oba
  • Shield Structure for Pressure Sensor, and Pressure Sensor Provided with Same
    Publication number: 20200400523
    Abstract: In a pressure sensor, a cap-shaped shielding member (17) to block an electric field undesirable for a signal processing electronic circuit unit of a sensor chip (16) is supported by an end surface of a disk conductive plate (19) between one end surface of the sensor chip (16) in a liquid sealing chamber (13) and a diaphragm (32). The conductive plate (19) is electrically connected via a group of input-output terminals (40ai) and bonding wires (Wi), for example, and the sensor chip 16 is supported by one end portion of a chip mounting member (18) which is electrically connected via the group of input and output terminals (40ai) and the bonding wires (Wi).
    Type: Application
    Filed: October 26, 2018
    Publication date: December 24, 2020
    Inventors: Kazuya Takimoto, Tatsuya Tanaka, Tomoharu Oba