Patents by Inventor Tomoharu Ogawa

Tomoharu Ogawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mold casting device
    Patent number: 11203057
    Abstract: The present invention provides a mold casting device including a raising and lowering mechanism that raises and lowers the upper mold; a die plate that is fixed to the upper mold; and a base member that is provided on upper end portions of the raising and lowering mechanism and supports the die plate from below.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: December 21, 2021
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Satoshi Matsumoto, Junji Sugimoto, Yohei Shimokawa, Tomoharu Ogawa, Kazuyuki Tsukamoto, Shinsuke Fujiyama, Toshiya Iwamoto
  • MOLD CASTING DEVICE
    Publication number: 20200254509
    Abstract: The present invention provides a mold casting device including a raising and lowering mechanism that raises and lowers the upper mold; a die plate that is fixed to the upper mold; and a base member that is provided on upper end portions of the raising and lowering mechanism and supports the die plate from below.
    Type: Application
    Filed: October 18, 2018
    Publication date: August 13, 2020
    Inventors: Satoshi MATSUMOTO, Junji SUGIMOTO, Yohei SHIMOKAWA, Tomoharu OGAWA, Kazuyuki TSUKAMOTO, Shinsuke FUJIYAMA, Toshiya IWAMOTO
  • Switch device
    Patent number: 5550340
    Abstract: In a switch device, a bendable mounting piece is extended from the switch body, which is abutted against the mounting surface of a base and secured to the latter with a screw, the switch body includes a positioning portion which is abutted against a positioning surface which is set back from the mounting surface, thus forming a step, and a leaf spring is spread over the outer side surface of the mounting piece and the outer side surface of the switch body which, when tightened together with the mounting piece, urges the switch body so that the positioning portion of the switch body is moved towards the positioning surface of the switch mounting unit.
    Type: Grant
    Filed: December 12, 1994
    Date of Patent: August 27, 1996
    Assignee: Kabushiki Kaisha Tokai Rika Denki Seisakusho
    Inventor: Tomoharu Ogawa