Patents by Inventor Tomoharu ONDA

Tomoharu ONDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic-element mounting package and electronic device
    Patent number: 11652306
    Abstract: An electronic-element mounting package includes a wiring substrate having a first surface and a wiring pattern thereon; a base having a second surface and a through hole whose opening is on the second surface; a signal line penetrating the through hole and having a first end exposed from an opening of the through hole; and an insulating member between an inner surface of the through hole and the signal line and has an end portion and a main portion. The end portion has an end surface on a side of the opening of the through hole, and the main portion is farther from the opening of the through hole than the end portion. The electronic-element mounting package also has a conductive joining material with which the wiring pattern and the first end are joined. Permittivity of the end portion is larger than permittivity of the main portion.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: May 16, 2023
    Assignee: Kyocera Corporation
    Inventors: Hikaru Kitahara, Tomoharu Onda
  • ELECTRONIC-ELEMENT MOUNTING PACKAGE AND ELECTRONIC DEVICE
    Publication number: 20220140507
    Abstract: An electronic-element mounting package includes a wiring substrate having a first surface and a wiring pattern thereon; a base having a second surface and a through hole whose opening is on the second surface; a signal line penetrating the through hole and having a first end exposed from an opening of the through hole; and an insulating member between an inner surface of the through hole and the signal line and has an end portion and a main portion. The end portion has an end surface on a side of the opening of the through hole, and the main portion is farther from the opening of the through hole than the end portion. The electronic-element mounting package also has a conductive joining material with which the wiring pattern and the first end are joined. Permittivity of the end portion is larger than permittivity of the main portion.
    Type: Application
    Filed: February 27, 2020
    Publication date: May 5, 2022
    Applicant: KYOCERA Corporation
    Inventors: Hikaru KITAHARA, Tomoharu ONDA