Abstract: The multi-piece, wiring board according to the embodiment of the present invention includes a supporting board including a frame portion formed on an upper surface of a bottom plate, the frame portion configured to divide the upper surface of the bottom plate into a plurality of product forming regions, and a wiring board formed on the upper surface of the bottom plate in. each of the product forming regions, the: wiring board including an insulating layer formed so as to expose an upper surface of the frame portion, and a wiring conductor formed on the insulating layer.

Abstract: A wiring board of the present invention includes a core substrate in which wiring conductors are formed on both surfaces of an insulating plate, and a build-up layer in which a conductor layer is formed on a surface of an insulating resin layer having a higher coefficient of thermal expansion than that of the insulating plate. At least one build-up layer is stacked on one surface or both surfaces of the core substrate. Both surfaces of the insulating plate have different coefficients of thermal expansion. At least one build-up layer is stacked on a surface having a lower coefficient of thermal expansion. No build-up layer is stacked on the opposite surface, or a smaller number of build-up layers than that of the build-up layer formed on the surface having the lower coefficient of thermal expansion is formed on the opposite surface.

Abstract: A method of manufacturing a printed circuit board includes forming a through hole 2 in an insulating layer 1 having upper and lower faces so as to penetrate between the upper and lower surfaces; allowing a first plated conductor 4 to be deposited at least in the through hole 2 and on the upper and lower surfaces around the through hole; removing the first plated conductor overlying and underlying a periphery of the through hole by etching the first plated conductor 4, while leaving at least the first plated conductor 4 in a mid-portion in a vertical direction within the through hole 2; and forming by semi-additive method a second plated conductor 6 that fills an outer portion than the first plated conductor 4 in the through hole 2, and forms a wiring conductor on the upper and lower surfaces.

Abstract: A method of manufacturing a printed circuit board includes forming a through hole 2 in an insulating layer 1 having upper and lower faces so as to penetrate between the upper and lower surfaces; allowing a first plated conductor 4 to be deposited at least in the through hole 2 and on the upper and lower surfaces around the through hole; removing the first plated conductor overlying and underlying a periphery of the through hole by etching the first plated conductor 4, while leaving at least the first plated conductor 4 in a mid-portion in a vertical direction within the through hole 2; and forming by semi-additive method a second plated conductor 6 that fills an outer portion than the first plated conductor 4 in the through hole 2, and forms a wiring conductor on the upper and lower surfaces.