Abstract: A vehicle compressor component includes an aluminum alloy material made by hot-extruding. The aluminum alloy material has a chemical composition consisting of Fe: 5.0% to 9.0% by mass, Mg: 0.7% to 3.0% by mass, V: 0.1% to 3.0% by mass, Mo: 0.1% to 3.0% by mass, Zr: 0.1% to 2.0% by mass, Ti: 0.02% to 2.0% by mass, and balance Al and unavoidable impurities. The aluminum alloy material has a density of 2.96 g/cm3 or more. A method for manufacturing the vehicle compressor component includes: compacting aluminum alloy powders having the chemical composition to prepare a compact; hot-extruding the compact to make an aluminum alloy material; and forming the aluminum alloy material into a desired shape.

Abstract: A compressor component for a transport is provided, which is excellent in mechanical characteristics at a high temperature. The compressor component is made of an aluminum-alloy that includes Fe: 5.0-9.0 mass %, V: 0.1-3.0 mass %, Mo: 0.1-3.0 mass %, Zr: 0.1-2.0 mass %, and Ti: 0.02-2.0 mass %, the remainder being Al and unavoidable impurities The compressor component is configured to include therein an Al—Fe-based intermetallic compound, and in the cross-sectional surface structure of the compressor component, an average circle-equivalent diameter of the Al—Fe-based intermetallic compound falls within a range of 0.1-3.0 ?m.

Abstract: An austenitic cast iron including basic elements of C, Si, Cr, Ni, Mn and Cu; and the balance including Fe, inevitable impurities and/or a trace-amount modifier element, which is effective in improving a characteristic of the cast iron, in a trace amount; and structured by a base comprising an Fe alloy in which an austenite phase makes a major phase in ordinary-temperature region; wherein the basic elements fall within compositional ranges that satisfy the following conditions when the entirety of the cast iron is taken as 100% by mass: C: from 2.0 to 3.0%; Si: from 4.0 to 5.4%; Cr: from 0.8 to 2.0%; Mn: from 3.9 to 5.6%; Ni: from 17 to 22%; and Cu: from 0.9 to 1.6%.

Abstract: An austenitic cast iron according to the present invention is characterized in that: it comprises: basic elements comprising C, Si, Cr, Ni, Mn and Cu; and the balance comprising Fe, inevitable impurities and/or a trace-amount modifier element, which is effective in improving characteristic, in a trace amount; and it is an austenitic cast iron being a cast iron that is structured by a base comprising an Fe alloy in which an austenite phase makes a major phase in ordinary-temperature region; wherein said basic elements fall within compositional ranges that satisfy the following conditions when the entirety of said cast iron is taken as 100% by mass (hereinafter being simply expressed as “%”): C: from 2.0 to 3.0%; Si: from 4.0 to 5.4%; Cr: from 0.8 to 2.0%; Mn: from 3.9 to 5.6%; Ni: from 17 to 22%; and Cu: from 0.9 to 1.6%.

Abstract: An austenitic cast iron according to the present invention has Ni: from 7 to 15% by mass, and is characterized in that it comprises a base structure in which an austenite phase makes a major phase even in ordinary-temperature region by adjusting the respective compositions of Cr, Ni and Cu, excepting C and Si, so as to fall within predetermined ranges. In accordance with the present invention, it is possible to obtain an austenitic cast iron, which is excellent in terms of oxidation resistance and the like, inexpensively, while reducing the content of expensive Ni.

Abstract: The present invention is a process for producing a radiator member for electronic appliances, and is characterized in that, in a process for producing a radiator member for electronic appliances, the radiator member comprising a composite material in which SiC particles are dispersed in a matrix metal whose major component is Al, it comprises a filling step of filling an SiC powder into a mold, a pre-heating step of pre-heating the mold after the filling step to a pre-heating temperature which falls in a range of from a melting point or more of said matrix metal to less than a reaction initiation temperature at which a molten metal of the matrix metal and SiC particles in the SiC powder start to react, and a pouring step of pouring the molten matrix metal whose molten-metal temperature falls in a range of from the melting point or more of the matrix metal to less than the reaction initiation temperature, into the mold after the pre-heating step, and impregnating the SiC powder with the molten metal by pressur

Abstract: First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of an Al—Mg-based alloy is joined with the surface of the plate member through hot pressing. As a result, part of the Al foil member enters casting blowholes on the surface of the plate member to fill the casting blowholes. In addition, an Al—Mg-based alloy layer is formed on the surface of the plate member. Thus, a base plate having a nearly flat surface is produced.

Abstract: First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of an Al—Mg-based alloy is joined with the surface of the plate member through hot pressing. As a result, part of the Al foil member enters casting blowholes on the surface of the plate member to fill the casting blowholes. In addition, an Al—Mg-based alloy layer is formed on the surface of the plate member. Thus, a base plate having a nearly flat surface is produced.

Abstract: A mold is filled with unsintered SiC particles and a melt of Al or of an Al alloy containing Si is poured into the mold for high pressure casting. Owing to the SiC particles and Si precipitated upon casting, a low expansion material having a low thermal expansion coefficient is produced. A heat transmission path is formed by Al infiltrating spaces between the SiC particles and therefore high heat conductivity is obtained.

Abstract: A circuit board includes a substrate having a heat exhausting function. A wiring layer of a metal composite material is provided on the substrate with an insulating layer in between. The metal composite material has a coefficient of thermal expansion that is greater than a coefficient of thermal expansion of a silicon semiconductor chip and less than a coefficient of thermal expansion of copper. Accordingly, a circuit board that is suitable for mounting power devices, requires no heat sink or heat spreader is provides. Further, the number of components for assembling a module is reduced.

Abstract: A plate-shaped composite material has a first member and a second member. The first member is an expanded metal formed of a metal plate. The coefficient of linear expansion of the metal plate is less than or equal to 8×10?6/degrees Celsius. The first member suppresses thermal expansion of the composite material. The coefficient of thermal conductivity of the second member is greater than or equal to 200 W/(m×K). The second member maintains the coefficient of thermal conductivity of the composite material. This structure provides a reliable coefficient of thermal conductivity and high strength. The structure is suitable for a cooling substrate on which electronic elements such as semiconductors are mounted.

Abstract: A low-expansion unit includes a plate member and an iron-nickel layer. Upper and lower surface layers of the plate member each have the iron-nickel layer thereon and/or therein. While the plate member has a relatively large thermal expansion coefficient, the iron-nickel layers, which are formed on and/or in the upper and lower surface layers of the plate member, have a relatively small thermal expansion coefficient. Therefore, thermal expansion coefficient of the low-expansion unit is as a whole restrained to a relatively small value. Also, the plate member includes pure iron whose thermal conductivity is relatively high. Meanwhile, the iron-nickel layers, which are formed on the plate member, are relatively thin. Therefore, the low-expansion unit has a relatively large thermal conductivity in a direction of thickness thereof.

Abstract: First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of an Al—Mg-based alloy is joined with the surface of the plate member through hot pressing. As a result, part of the Al foil member enters casting blowholes on the surface of the plate member to fill the casting blowholes. In addition, an Al—Mg-based alloy layer is formed on the surface of the plate member. Thus, a base plate having a nearly flat surface is produced.

Abstract: A plate of an expanded metal and two metal plates are overlaid on one another. The expanded metal plate has a plurality of meshes. The linear expansion coefficient of the expanded metal is equal to or less than 8×10?6/° C., and the thermal conductivity of the metal plates is equal to or more than 200 W/(m·K). Then, the metal plates and the expanded metal plate are subjected to hot rolling to be rolled and joined. The rolling and joining are performed in two stages. In the first stage, the meshes of the expanded metal plate are filled with the material of the metal plates. In the second stage, the rolling and joining are performed such that the composite material has a predetermined thickness. The volumetric ratio of the expanded metal plate to the composite material is in a range between 20% and 70%, inclusive. The composite material, which has an improved thermal conductivity and strength and is suitable for heat dissipating substrate, is manufactured at a reduced cost.

Abstract: A low-expansion unit includes a plate member and an iron-nickel layer. Upper and lower surface layers of the plate member each have the iron-nickel layer thereon and/or therein. While the plate member has a relatively large thermal expansion coefficient, the iron-nickel layers, which are formed on and/or in the upper and lower surface layers of the plate member, have a relatively small thermal expansion coefficient. Therefore, thermal expansion coefficient of the low-expansion unit is as a whole restrained to a relatively small value. Also, the plate member includes pure iron whose thermal conductivity is relatively high. Meanwhile, the iron-nickel layers, which are formed on the plate member, are relatively thin. Therefore, the low-expansion unit has a relatively large thermal conductivity in a direction of thickness thereof.

Abstract: A base plate is made of a material that is lower in thermal expansion coefficient than a wiring layer, to thereby set the thermal expansion coefficient of a surface of the wiring layer lower than the thermal expansion coefficient of the material of the wiring layer. The thermal expansion coefficient of the surface of the wiring layer can be set to be suitable for a semiconductor element and other electronic parts mounted on the surface of the wiring layer, that is, set closer to the thermal expansion coefficient of the electronic parts by choosing a glass transition temperature Tg of an insulating resin layer appropriately.

Abstract: A plate of an expanded metal and two metal plates are overlaid on one another. The expanded metal plate has a plurality of meshes. The linear expansion coefficient of the expanded metal is equal to or less than 8×10−6/° C., and the thermal conductivity of the metal plates is equal to or more than 200 W/(m·K). Then, the metal plates and the expanded metal plate are subjected to hot rolling to be rolled and joined. The rolling and joining are performed in two stages. In the first stage, the meshes of the expanded metal plate are filled with the material of the metal plates. In the second stage, the rolling and joining are performed such that the composite material has a predetermined thickness. The volumetric ratio of the expanded metal plate to the composite material is in a range between 20% and 70%, inclusive. The composite material, which has an improved thermal conductivity and strength and is suitable for heat dissipating substrate, is manufactured at a reduced cost.

Abstract: A mold is filled with unsintered SiC particles and a melt of Al or of an Al alloy containing Si is poured into the mold for high pressure casting. Owing to the SiC particles and Si precipitated upon casting, a low expansion material having a low thermal expansion coefficient is produced. A heat transmission path is formed by Al infiltrating spaces between the SiC particles and therefore high heat conductivity is obtained.

Abstract: A heat spreader includes an electromagnetic soft iron sheet and a plating layer formed on the surface of the sheet. The plate is made of a rustproof metal. An electronic component is mounted on an aluminum base with an HITT substrate and the heat spreader in between. The heat spreader is manufactured at low cost and has a favorable property as a heat dissipating material.

Abstract: A plate-shaped composite material has a first member and a second member. The first member is an expanded metal formed of a metal plate. The coefficient of linear expansion of the metal plate is less than or equal to 8×10−6/degrees Celsius. The first member suppresses thermal expansion of the composite material. The coefficient of thermal conductivity of the second member is greater than or equal to 200 W/(m×K). The second member maintains the coefficient of thermal conductivity of the composite material. This structure provides a reliable coefficient of thermal conductivity and high strength. The structure is suitable for a cooling substrate on which electronic elements such as semiconductors are mounted.