Patents by Inventor Tomohide Koguchi

Tomohide Koguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Rigid-printed wiring board and production method of the rigid-printed wiring board
    Patent number: 6599562
    Abstract: The present invention is for providing a rigid-printed wiring board capable of preventing the burst or void phenomenon of a copper paste, and a production method of the rigid-printed wiring board. A rigid-printed wiring board comprising copper clad laminates with a paper phenol or a paper epoxy used as a base, wherein a through hole is provided in the vicinity of a via hole for filling the copper paste, is provided.
    Type: Grant
    Filed: May 28, 2002
    Date of Patent: July 29, 2003
    Assignees: Sony Corporation, Shirato Printed Circuit Board Co. Ltd.
    Inventors: Yoshinari Matsuda, Tomohide Koguchi
  • Rigid-printed wiring board and production method of the rigid-printed wiring board
    Publication number: 20020182398
    Abstract: The present invention is for providing a rigid-printed wiring board capable of preventing the burst or void phenomenon of a copper paste, and a production method of the rigid-printed wiring board. A rigid-printed wiring board comprising copper clad laminates with a paper phenol or a paper epoxy used as a base, wherein a through hole is provided in the vicinity of a via hole for filling the copper paste, is provided.
    Type: Application
    Filed: May 28, 2002
    Publication date: December 5, 2002
    Applicant: SONY CORPORATION
    Inventors: Yoshinari Matsuda, Tomohide Koguchi
  • Rigid-printed wiring board and production method of the rigid-printed wiring board
    Patent number: 6420017
    Abstract: The present invention is for providing a rigid-printed wiring board capable of preventing the burst or void phenomenon of a copper paste, and a production method of the rigid-printed wiring board. A rigid-printed wiring board comprising copper clad laminates with a paper phenol or a paper epoxy used as a base, wherein a through hole is provided in the vicinity of a via hole for finning the copper paste, is provided.
    Type: Grant
    Filed: June 22, 2000
    Date of Patent: July 16, 2002
    Assignees: Sony Corporation, Shirato Printed Circuit Board Co. Ltd.
    Inventors: Yoshinari Matsuda, Tomohide Koguchi