Patents by Inventor Tomohide Nakagawa

Tomohide Nakagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10294366
    Abstract: The present invention is a crystalline polyamide resin composition, comprising 100 parts by mass of a crystalline polyamide resin and 1 to 10 part(s) by mass of a modified polyolefin resin. The crystalline polyamide resin composition of the present invention can provide a molded product which has so excellent sliding durability that changes in surface appearance against repeated slidings for tens of thousands times with high load are small and which has excellent mechanical strength and moldability, while keeping excellent characteristics inherent to a crystalline polyamide resin.
    Type: Grant
    Filed: May 14, 2015
    Date of Patent: May 21, 2019
    Assignee: TOYOBO CO., LTD.
    Inventor: Tomohide Nakagawa
  • Patent number: 10072137
    Abstract: The present invention provides a polyamide resin composition having high melt point which can produce a molded product having high anti-vibration property or, in other words, having very high resonance frequency and, in particular, being capable of retaining high resonance frequency even upon water absorption. A polyamide resin composition, comprising a polyamide resin (A) having melt point (Tm) of 290° C. to 350° C. and having crystallization temperature upon temperature rise (Tc1) of 80 to 150° C., and glass fibers (B) having cross-sectional area of 1.5 to 5.0×10?6 cm2, characterized in that, ratio by weight of the polyamide resin (A) to the glass fibers (B) [(A):(B)] is from 20:80 to 35:65, and that the polyamide resin (A) is a copolymerized polyamide consisting of 55 to 75 molar % of a constituent unit (a) obtained from an equimolar salt of hexamethylenediamine and terephthalic acid, and 45 to 25 molar % of a constituent unit (b) obtained from 11-aminoundecanoic acid or undecane lactam.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: September 11, 2018
    Assignee: TOYOBO CO., LTD.
    Inventors: Tomohide Nakagawa, Tatsuya Oi
  • Publication number: 20170137623
    Abstract: The present invention is a crystalline polyamide resin composition, comprising 100 parts by mass of a crystalline polyamide resin and 1 to 10 part(s) by mass of a modified polyolefin resin. The crystalline polyamide resin composition of the present invention can provide a molded product which has so excellent sliding durability that changes in surface appearance against repeated slidings for tens of thousands times with high load are small and which has excellent mechanical strength and moldability, while keeping excellent characteristics inherent to a crystalline polyamide resin.
    Type: Application
    Filed: May 14, 2015
    Publication date: May 18, 2017
    Applicant: TOYOBO CO., LTD.
    Inventor: Tomohide NAKAGAWA
  • Patent number: 9512301
    Abstract: The present invention provides a polyamide resin composition reinforced with glass fiber which can produce a molded product having high anti-vibration property or, in other words, having very high resonance frequency and having, upon necessity, excellent weather-resisting color fastness. A polyamide resin composition reinforced with glass fiber, comprising a polyamide resin (A) constituted from aliphatic polyamide (a1) and aromatic component-containing polyamide (a2), and glass fibers (B) having a cross-sectional area of 1.5 to 5.0×10?6 cm2, wherein ratio by weight of the polyamide resin (A) to the glass fibers (B) [(A):(B)] is from 20:80 to 35:65 and ratio by weight of the aliphatic polyamide (a1) to the aromatic component-containing polyamide (a2) [(a1):(a2)] is from 5:95 to 95:5. The polyamide resin composition reinforced with glass fibers of the present invention can further comprise carbon black (C) in an amount of at most 5% by weight.
    Type: Grant
    Filed: April 8, 2014
    Date of Patent: December 6, 2016
    Assignee: TOYOBO CO., LTD.
    Inventors: Tomohide Nakagawa, Tatsuya Oi, Kazunari Tanaka
  • Patent number: 9447575
    Abstract: Provided is a polyamide resin composition which can provide an expanded molding being superior in heat resistance and sufficiently reduced in weight and having high load resistance by a simple molding process. The polyamide resin composition is characterized by comprising a polyamide resin (A), a glycidyl-group-containing styrene copolymer (B) having two or more glycidyl groups per molecule, a weight average molecular weight of 4000 to 25000 and an epoxy value of 400 to 2500 Eq/1×106 g and an inorganic reinforcing material (C) in a proportion such that the content of the glycidyl-group-containing styrene copolymer (B) is 0.2 to 25 parts by mass and the content of the inorganic reinforcing material (C) is 0 to 350 parts by mass relative to 100 parts by mass of the polyamide resin (A).
    Type: Grant
    Filed: November 1, 2011
    Date of Patent: September 20, 2016
    Assignee: TOYOBO CO., LTD.
    Inventors: Tomohide Nakagawa, Tadamine Ohashi, Yasuto Fujii, Akio Tange
  • Publication number: 20160130424
    Abstract: The present invention provides a polyamide resin composition having high melt point which can produce a molded product having high anti-vibration property or, in other words, having very high resonance frequency and, in particular, being capable of retaining high resonance frequency even upon water absorption. A polyamide resin composition, comprising a polyamide resin (A) having melt point (Tm) of 290° C. to 350° C. and having crystallization temperature upon temperature rise (Tc1) of 80 to 150° C., and glass fibers (B) having cross-sectional area of 1.5 to 5.0×10?6 cm2, characterized in that, ratio by weight of the polyamide resin (A) to the glass fibers (B) [(A):(B)] is from 20:80 to 35:65, and that the polyamide resin (A) is a copolymerized polyamide consisting of 55 to 75 molar % of a constituent unit (a) obtained from an equimolar salt of hexamethylenediamine and terephthalic acid, and 45 to 25 molar % of a constituent unit (b) obtained from 11-aminoundecanoic acid or undecane lactam.
    Type: Application
    Filed: June 23, 2014
    Publication date: May 12, 2016
    Applicant: TOYOBO CO., LTD.
    Inventors: Tomohide NAKAGAWA, Tatsuya OI
  • Publication number: 20160053091
    Abstract: The present invention provides a polyamide resin composition reinforced with glass fiber which can produce a molded product having high anti-vibration property or, in other words, having very high resonance frequency and having, upon necessity, excellent weather-resisting color fastness. A polyamide resin composition reinforced with glass fiber, comprising a polyamide resin (A) constituted from aliphatic polyamide (a1) and aromatic component-containing polyamide (a2), and glass fibers (B) having a cross-sectional area of 1.5 to 5.0×10?6 cm2, wherein ratio by weight of the polyamide resin (A) to the glass fibers (B) [(A):(B)] is from 20:80 to 35:65 and ratio by weight of the aliphatic polyamide (a1) to the aromatic component-containing polyamide (a2) [(a1):(a2)] is from 5:95 to 95:5. The polyamide resin composition reinforced with glass fibers of the present invention can further comprise carbon black (C) in an amount of at most 5% by weight.
    Type: Application
    Filed: April 8, 2014
    Publication date: February 25, 2016
    Applicant: TOYOBO CO., LTD.
    Inventors: Tomohide NAKAGAWA, Tatsuya OI, Kazunari TANAKA
  • Publication number: 20160032068
    Abstract: The present invention relates to a polyamide resin composition for a foam molded body, comprising a crystalline polyamide resin (A), carbon black (B) which does not exhibit crystallization promoting action to said crystalline polyamide resin and an inorganic reinforcing material (C), wherein, when the total amount of (A), (B) and (C) is taken as 100% by mass, the composition comprises (A) and (B) in a rate of 60 to 90% by mass in terms of the sum thereof and comprises (C) in a rate of 10 to 40% by mass, and wherein melting point and crystallization temperature of said polyamide resin composition have a specific relationship. The above-mentioned polyamide resin composition can provide a polyamide foam molded body having light weight, high load bearing property and good molded appearance.
    Type: Application
    Filed: May 12, 2014
    Publication date: February 4, 2016
    Applicant: TOYOBO CO., LTD.
    Inventors: Tomohide NAKAGAWA, Kazunari TANAKA
  • Patent number: 8669310
    Abstract: There is provided a polyamide resin composition reinforced with glass fiber produced by the melt kneading of a mixture where 60 to 80 parts by weight of glass fiber bundles (B) comprising a glass fiber having a flat cross section whose flatness degree is 1.5 to 8 and having an ignition loss at 625° C. for 0.5 hour of not more than 0.8% by weight are added to 40 to 20 parts by weight of polyamide (A), characterized in that, during the above melt kneading, a polyamide-reactive silane coupling agent (C) is added to the above mixture in a rate of 0.1 to 1.0% by weight of the above glass fiber bundles (B). The polyamide resin composition of the present invention has high bending strength, bending elastic modulus and Charpy impact strength (at 23° C. and ?40° C.) by a specific fracture mode which have been never achieved before, and it is excellent in productivity.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: March 11, 2014
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventor: Tomohide Nakagawa
  • Publication number: 20130209784
    Abstract: Provided is a polyamide resin composition which can provide an expanded molding being superior in heat resistance and sufficiently reduced in weight and having high load resistance by a simple molding process. The polyamide resin composition is characterized by comprising a polyamide resin (A), a glycidyl-group-containing styrene copolymer (B) having two or more glycidyl groups per molecule, a weight average molecular weight of 4000 to 25000 and an epoxy value of 400 to 2500 Eq/1×106 g and an inorganic reinforcing material (C) in a proportion such that the content of the glycidyl-group-containing styrene copolymer (B) is 0.2 to 25 parts by mass and the content of the inorganic reinforcing material (C) is 0 to 350 parts by mass relative to 100 parts by mass of the polyamide resin (A).
    Type: Application
    Filed: November 1, 2011
    Publication date: August 15, 2013
    Applicant: TOYOBO CO., LTD.
    Inventors: Tomohide Nakagawa, Tadamine Ohashi, Yasuto Fujii, Akio Tange
  • Publication number: 20110263777
    Abstract: There is provided a polyamide resin composition reinforced with glass fiber produced by the melt kneading of a mixture where 60 to 80 parts by weight of glass fiber bundles (B) comprising a glass fiber having a flat cross section whose flatness degree is 1.5 to 8 and having an ignition loss at 625° C. for 0.5 hour of not more than 0.8% by weight are added to 40 to 20 parts by weight of polyamide (A), characterized in that, during the above melt kneading, a polyamide-reactive silane coupling agent (C) is added to the above mixture in a rate of 0.1 to 1.0% by weight of the above glass fiber bundles (B). The polyamide resin composition of the present invention has high bending strength, bending elastic modulus and Charpy impact strength (at 23° C. and ?40° C.) by a specific fracture mode which have been never achieved before, and it is excellent in productivity.
    Type: Application
    Filed: January 29, 2010
    Publication date: October 27, 2011
    Inventor: Tomohide Nakagawa
  • Patent number: 7479315
    Abstract: A material for fuel-system parts which is excellent in impact strength, rigidity, elongation, unsusceptibility to swelling with liquid fuels including gasoline, and gasoline-barrier properties and has satisfactory moldability. The material for fuel-system parts comprises a resin composition comprising 100 parts by weight of a given polyamide resin (A) and 11 to 100 parts by weight of a resin (B) having a lower glass transition temperature than the polyamide resin (A) and having a functional group reactive with the polyamide resin (A), and has a structure in which the polyamide resin (A) serves as a matrix ingredient and the resin (B) serves as a domain ingredient.
    Type: Grant
    Filed: December 8, 2003
    Date of Patent: January 20, 2009
    Assignees: Toyo Boseki Kabushiki Kaisha, Toyoda Gosei Co., Ltd
    Inventors: Tsutomu Tamura, Tomohide Nakagawa, Shoji Kouketsu, Gaku Maruyama, Daisuke Tsutsumi, Junji Koizumi, Katsushi Ito, Haruyasu Mizutani
  • Publication number: 20070149706
    Abstract: The present invention provides a material for a fuel system part, which is superior in impact strength, rigidity, elongation, swelling resistance to liquid fuels such as gasoline and the like, and gasoline barrier property, as well as moldability, which contains resin (B) having a glass transition temperature lower than that of a certain polyamide resin (A) and a functional group capable of reacting with the polyamide resin (A), at a ratio of 11-100 parts by weight relative to 100 parts by weight of the polyamide resin (A), wherein the polyamide resin (A) is a matrix component, and the resin (B) is a domain component, and further a fuel system containing this material.
    Type: Application
    Filed: December 8, 2003
    Publication date: June 28, 2007
    Inventors: Tsutomu Tamura, Tomohide Nakagawa, Shoji Kouketsu, Gaku Maruyama, Daisuke Tsutsumi, Junji Koizumi, Katsushi Ito, Haruyasu Mizutani
  • Patent number: 6924034
    Abstract: It is disclosed that a coated polyamide molding product, characterized in that, a polyamide molding product obtained from a polyamide resin composition containing a polyamide resin (A), a thermoplastic resin composition (B) having functional groups reacting with the polyamide resin and, if necessary, an inorganic filler (C) is coated with a thermoplastic resin elastomer (D) which is compatible with the thermoplastic resin composition which is the above-mentioned component (B).
    Type: Grant
    Filed: May 8, 2002
    Date of Patent: August 2, 2005
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Tsutomu Tamura, Yoshinobu Hanaoka, Tomohide Nakagawa
  • Patent number: 6835787
    Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances and further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: December 28, 2004
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Tutomu Tamura, Hideki Eguchi, Tomohide Nakagawa, Toshio Hiramatsu, Manabu Takeuchi
  • Patent number: 6835771
    Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: December 28, 2004
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Tutomu Tamura, Hideki Eguchi, Tomohide Nakagawa, Toshio Hiramatsu, Manabu Takeuchi
  • Publication number: 20030125481
    Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances and further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.
    Type: Application
    Filed: January 22, 2003
    Publication date: July 3, 2003
    Inventors: Tutomu Tamura, Hideki Eguchi, Tomohide Nakagawa, Toshio Hiramatsu, Manabu Takeuchi
  • Publication number: 20030125440
    Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.
    Type: Application
    Filed: January 22, 2003
    Publication date: July 3, 2003
    Inventors: Tutomu Tamura, Hideki Eguchi, Tomohide Nakagawa, Toshio Hiramatsu, Manabu Takeuchi
  • Patent number: 6534583
    Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances and further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.
    Type: Grant
    Filed: September 28, 2000
    Date of Patent: March 18, 2003
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Tutomu Tamura, Hideki Eguchi, Tomohide Nakagawa, Toshio Hiramatsu, Manabu Takeuchi
  • Publication number: 20030008147
    Abstract: It is disclosed that a coated polyamide molding product, characterized in that, a polyamide molding product obtained from a polyamide resin composition containing a polyamide resin (A), a thermoplastic resin composition (B) having functional groups reacting with the polyamide resin and, if necessary, an inorganic filler (C) is coated with a thermoplastic resin elastomer (D) which is compatible with the thermoplastic resin composition which is the above-mentioned component (B).
    Type: Application
    Filed: May 8, 2002
    Publication date: January 9, 2003
    Inventors: Tsutomu Tamura, Yoshinobu Hanaoka, Tomohide Nakagawa