Patents by Inventor Tomohide Nakagawa
Tomohide Nakagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10294366Abstract: The present invention is a crystalline polyamide resin composition, comprising 100 parts by mass of a crystalline polyamide resin and 1 to 10 part(s) by mass of a modified polyolefin resin. The crystalline polyamide resin composition of the present invention can provide a molded product which has so excellent sliding durability that changes in surface appearance against repeated slidings for tens of thousands times with high load are small and which has excellent mechanical strength and moldability, while keeping excellent characteristics inherent to a crystalline polyamide resin.Type: GrantFiled: May 14, 2015Date of Patent: May 21, 2019Assignee: TOYOBO CO., LTD.Inventor: Tomohide Nakagawa
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Patent number: 10072137Abstract: The present invention provides a polyamide resin composition having high melt point which can produce a molded product having high anti-vibration property or, in other words, having very high resonance frequency and, in particular, being capable of retaining high resonance frequency even upon water absorption. A polyamide resin composition, comprising a polyamide resin (A) having melt point (Tm) of 290° C. to 350° C. and having crystallization temperature upon temperature rise (Tc1) of 80 to 150° C., and glass fibers (B) having cross-sectional area of 1.5 to 5.0×10?6 cm2, characterized in that, ratio by weight of the polyamide resin (A) to the glass fibers (B) [(A):(B)] is from 20:80 to 35:65, and that the polyamide resin (A) is a copolymerized polyamide consisting of 55 to 75 molar % of a constituent unit (a) obtained from an equimolar salt of hexamethylenediamine and terephthalic acid, and 45 to 25 molar % of a constituent unit (b) obtained from 11-aminoundecanoic acid or undecane lactam.Type: GrantFiled: June 23, 2014Date of Patent: September 11, 2018Assignee: TOYOBO CO., LTD.Inventors: Tomohide Nakagawa, Tatsuya Oi
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Publication number: 20170137623Abstract: The present invention is a crystalline polyamide resin composition, comprising 100 parts by mass of a crystalline polyamide resin and 1 to 10 part(s) by mass of a modified polyolefin resin. The crystalline polyamide resin composition of the present invention can provide a molded product which has so excellent sliding durability that changes in surface appearance against repeated slidings for tens of thousands times with high load are small and which has excellent mechanical strength and moldability, while keeping excellent characteristics inherent to a crystalline polyamide resin.Type: ApplicationFiled: May 14, 2015Publication date: May 18, 2017Applicant: TOYOBO CO., LTD.Inventor: Tomohide NAKAGAWA
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Patent number: 9512301Abstract: The present invention provides a polyamide resin composition reinforced with glass fiber which can produce a molded product having high anti-vibration property or, in other words, having very high resonance frequency and having, upon necessity, excellent weather-resisting color fastness. A polyamide resin composition reinforced with glass fiber, comprising a polyamide resin (A) constituted from aliphatic polyamide (a1) and aromatic component-containing polyamide (a2), and glass fibers (B) having a cross-sectional area of 1.5 to 5.0×10?6 cm2, wherein ratio by weight of the polyamide resin (A) to the glass fibers (B) [(A):(B)] is from 20:80 to 35:65 and ratio by weight of the aliphatic polyamide (a1) to the aromatic component-containing polyamide (a2) [(a1):(a2)] is from 5:95 to 95:5. The polyamide resin composition reinforced with glass fibers of the present invention can further comprise carbon black (C) in an amount of at most 5% by weight.Type: GrantFiled: April 8, 2014Date of Patent: December 6, 2016Assignee: TOYOBO CO., LTD.Inventors: Tomohide Nakagawa, Tatsuya Oi, Kazunari Tanaka
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Patent number: 9447575Abstract: Provided is a polyamide resin composition which can provide an expanded molding being superior in heat resistance and sufficiently reduced in weight and having high load resistance by a simple molding process. The polyamide resin composition is characterized by comprising a polyamide resin (A), a glycidyl-group-containing styrene copolymer (B) having two or more glycidyl groups per molecule, a weight average molecular weight of 4000 to 25000 and an epoxy value of 400 to 2500 Eq/1×106 g and an inorganic reinforcing material (C) in a proportion such that the content of the glycidyl-group-containing styrene copolymer (B) is 0.2 to 25 parts by mass and the content of the inorganic reinforcing material (C) is 0 to 350 parts by mass relative to 100 parts by mass of the polyamide resin (A).Type: GrantFiled: November 1, 2011Date of Patent: September 20, 2016Assignee: TOYOBO CO., LTD.Inventors: Tomohide Nakagawa, Tadamine Ohashi, Yasuto Fujii, Akio Tange
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Publication number: 20160130424Abstract: The present invention provides a polyamide resin composition having high melt point which can produce a molded product having high anti-vibration property or, in other words, having very high resonance frequency and, in particular, being capable of retaining high resonance frequency even upon water absorption. A polyamide resin composition, comprising a polyamide resin (A) having melt point (Tm) of 290° C. to 350° C. and having crystallization temperature upon temperature rise (Tc1) of 80 to 150° C., and glass fibers (B) having cross-sectional area of 1.5 to 5.0×10?6 cm2, characterized in that, ratio by weight of the polyamide resin (A) to the glass fibers (B) [(A):(B)] is from 20:80 to 35:65, and that the polyamide resin (A) is a copolymerized polyamide consisting of 55 to 75 molar % of a constituent unit (a) obtained from an equimolar salt of hexamethylenediamine and terephthalic acid, and 45 to 25 molar % of a constituent unit (b) obtained from 11-aminoundecanoic acid or undecane lactam.Type: ApplicationFiled: June 23, 2014Publication date: May 12, 2016Applicant: TOYOBO CO., LTD.Inventors: Tomohide NAKAGAWA, Tatsuya OI
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Publication number: 20160053091Abstract: The present invention provides a polyamide resin composition reinforced with glass fiber which can produce a molded product having high anti-vibration property or, in other words, having very high resonance frequency and having, upon necessity, excellent weather-resisting color fastness. A polyamide resin composition reinforced with glass fiber, comprising a polyamide resin (A) constituted from aliphatic polyamide (a1) and aromatic component-containing polyamide (a2), and glass fibers (B) having a cross-sectional area of 1.5 to 5.0×10?6 cm2, wherein ratio by weight of the polyamide resin (A) to the glass fibers (B) [(A):(B)] is from 20:80 to 35:65 and ratio by weight of the aliphatic polyamide (a1) to the aromatic component-containing polyamide (a2) [(a1):(a2)] is from 5:95 to 95:5. The polyamide resin composition reinforced with glass fibers of the present invention can further comprise carbon black (C) in an amount of at most 5% by weight.Type: ApplicationFiled: April 8, 2014Publication date: February 25, 2016Applicant: TOYOBO CO., LTD.Inventors: Tomohide NAKAGAWA, Tatsuya OI, Kazunari TANAKA
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Publication number: 20160032068Abstract: The present invention relates to a polyamide resin composition for a foam molded body, comprising a crystalline polyamide resin (A), carbon black (B) which does not exhibit crystallization promoting action to said crystalline polyamide resin and an inorganic reinforcing material (C), wherein, when the total amount of (A), (B) and (C) is taken as 100% by mass, the composition comprises (A) and (B) in a rate of 60 to 90% by mass in terms of the sum thereof and comprises (C) in a rate of 10 to 40% by mass, and wherein melting point and crystallization temperature of said polyamide resin composition have a specific relationship. The above-mentioned polyamide resin composition can provide a polyamide foam molded body having light weight, high load bearing property and good molded appearance.Type: ApplicationFiled: May 12, 2014Publication date: February 4, 2016Applicant: TOYOBO CO., LTD.Inventors: Tomohide NAKAGAWA, Kazunari TANAKA
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Patent number: 8669310Abstract: There is provided a polyamide resin composition reinforced with glass fiber produced by the melt kneading of a mixture where 60 to 80 parts by weight of glass fiber bundles (B) comprising a glass fiber having a flat cross section whose flatness degree is 1.5 to 8 and having an ignition loss at 625° C. for 0.5 hour of not more than 0.8% by weight are added to 40 to 20 parts by weight of polyamide (A), characterized in that, during the above melt kneading, a polyamide-reactive silane coupling agent (C) is added to the above mixture in a rate of 0.1 to 1.0% by weight of the above glass fiber bundles (B). The polyamide resin composition of the present invention has high bending strength, bending elastic modulus and Charpy impact strength (at 23° C. and ?40° C.) by a specific fracture mode which have been never achieved before, and it is excellent in productivity.Type: GrantFiled: January 29, 2010Date of Patent: March 11, 2014Assignee: Toyo Boseki Kabushiki KaishaInventor: Tomohide Nakagawa
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Publication number: 20130209784Abstract: Provided is a polyamide resin composition which can provide an expanded molding being superior in heat resistance and sufficiently reduced in weight and having high load resistance by a simple molding process. The polyamide resin composition is characterized by comprising a polyamide resin (A), a glycidyl-group-containing styrene copolymer (B) having two or more glycidyl groups per molecule, a weight average molecular weight of 4000 to 25000 and an epoxy value of 400 to 2500 Eq/1×106 g and an inorganic reinforcing material (C) in a proportion such that the content of the glycidyl-group-containing styrene copolymer (B) is 0.2 to 25 parts by mass and the content of the inorganic reinforcing material (C) is 0 to 350 parts by mass relative to 100 parts by mass of the polyamide resin (A).Type: ApplicationFiled: November 1, 2011Publication date: August 15, 2013Applicant: TOYOBO CO., LTD.Inventors: Tomohide Nakagawa, Tadamine Ohashi, Yasuto Fujii, Akio Tange
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Publication number: 20110263777Abstract: There is provided a polyamide resin composition reinforced with glass fiber produced by the melt kneading of a mixture where 60 to 80 parts by weight of glass fiber bundles (B) comprising a glass fiber having a flat cross section whose flatness degree is 1.5 to 8 and having an ignition loss at 625° C. for 0.5 hour of not more than 0.8% by weight are added to 40 to 20 parts by weight of polyamide (A), characterized in that, during the above melt kneading, a polyamide-reactive silane coupling agent (C) is added to the above mixture in a rate of 0.1 to 1.0% by weight of the above glass fiber bundles (B). The polyamide resin composition of the present invention has high bending strength, bending elastic modulus and Charpy impact strength (at 23° C. and ?40° C.) by a specific fracture mode which have been never achieved before, and it is excellent in productivity.Type: ApplicationFiled: January 29, 2010Publication date: October 27, 2011Inventor: Tomohide Nakagawa
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Patent number: 7479315Abstract: A material for fuel-system parts which is excellent in impact strength, rigidity, elongation, unsusceptibility to swelling with liquid fuels including gasoline, and gasoline-barrier properties and has satisfactory moldability. The material for fuel-system parts comprises a resin composition comprising 100 parts by weight of a given polyamide resin (A) and 11 to 100 parts by weight of a resin (B) having a lower glass transition temperature than the polyamide resin (A) and having a functional group reactive with the polyamide resin (A), and has a structure in which the polyamide resin (A) serves as a matrix ingredient and the resin (B) serves as a domain ingredient.Type: GrantFiled: December 8, 2003Date of Patent: January 20, 2009Assignees: Toyo Boseki Kabushiki Kaisha, Toyoda Gosei Co., LtdInventors: Tsutomu Tamura, Tomohide Nakagawa, Shoji Kouketsu, Gaku Maruyama, Daisuke Tsutsumi, Junji Koizumi, Katsushi Ito, Haruyasu Mizutani
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Publication number: 20070149706Abstract: The present invention provides a material for a fuel system part, which is superior in impact strength, rigidity, elongation, swelling resistance to liquid fuels such as gasoline and the like, and gasoline barrier property, as well as moldability, which contains resin (B) having a glass transition temperature lower than that of a certain polyamide resin (A) and a functional group capable of reacting with the polyamide resin (A), at a ratio of 11-100 parts by weight relative to 100 parts by weight of the polyamide resin (A), wherein the polyamide resin (A) is a matrix component, and the resin (B) is a domain component, and further a fuel system containing this material.Type: ApplicationFiled: December 8, 2003Publication date: June 28, 2007Inventors: Tsutomu Tamura, Tomohide Nakagawa, Shoji Kouketsu, Gaku Maruyama, Daisuke Tsutsumi, Junji Koizumi, Katsushi Ito, Haruyasu Mizutani
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Patent number: 6924034Abstract: It is disclosed that a coated polyamide molding product, characterized in that, a polyamide molding product obtained from a polyamide resin composition containing a polyamide resin (A), a thermoplastic resin composition (B) having functional groups reacting with the polyamide resin and, if necessary, an inorganic filler (C) is coated with a thermoplastic resin elastomer (D) which is compatible with the thermoplastic resin composition which is the above-mentioned component (B).Type: GrantFiled: May 8, 2002Date of Patent: August 2, 2005Assignee: Toyo Boseki Kabushiki KaishaInventors: Tsutomu Tamura, Yoshinobu Hanaoka, Tomohide Nakagawa
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Patent number: 6835787Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances and further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.Type: GrantFiled: January 22, 2003Date of Patent: December 28, 2004Assignee: Toyo Boseki Kabushiki KaishaInventors: Tutomu Tamura, Hideki Eguchi, Tomohide Nakagawa, Toshio Hiramatsu, Manabu Takeuchi
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Patent number: 6835771Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.Type: GrantFiled: January 22, 2003Date of Patent: December 28, 2004Assignee: Toyo Boseki Kabushiki KaishaInventors: Tutomu Tamura, Hideki Eguchi, Tomohide Nakagawa, Toshio Hiramatsu, Manabu Takeuchi
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Publication number: 20030125481Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances and further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.Type: ApplicationFiled: January 22, 2003Publication date: July 3, 2003Inventors: Tutomu Tamura, Hideki Eguchi, Tomohide Nakagawa, Toshio Hiramatsu, Manabu Takeuchi
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Publication number: 20030125440Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.Type: ApplicationFiled: January 22, 2003Publication date: July 3, 2003Inventors: Tutomu Tamura, Hideki Eguchi, Tomohide Nakagawa, Toshio Hiramatsu, Manabu Takeuchi
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Patent number: 6534583Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances and further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.Type: GrantFiled: September 28, 2000Date of Patent: March 18, 2003Assignee: Toyo Boseki Kabushiki KaishaInventors: Tutomu Tamura, Hideki Eguchi, Tomohide Nakagawa, Toshio Hiramatsu, Manabu Takeuchi
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Publication number: 20030008147Abstract: It is disclosed that a coated polyamide molding product, characterized in that, a polyamide molding product obtained from a polyamide resin composition containing a polyamide resin (A), a thermoplastic resin composition (B) having functional groups reacting with the polyamide resin and, if necessary, an inorganic filler (C) is coated with a thermoplastic resin elastomer (D) which is compatible with the thermoplastic resin composition which is the above-mentioned component (B).Type: ApplicationFiled: May 8, 2002Publication date: January 9, 2003Inventors: Tsutomu Tamura, Yoshinobu Hanaoka, Tomohide Nakagawa