Patents by Inventor Tomohide Tagawa

Tomohide Tagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5438021
    Abstract: A multiple-chip semiconductor device of the present invention comprises a first and a second leadframes. The same package envelops a power semiconductor chip mounted on a power chip mounting area in the first leadframe and a control chip mounted on a control chip mounting area in the second leadframe. In the device, the second leadframe is made of metal material which is processed easier than the first leadframe, and/or is finished thinner than the first leadframe. Thus, the multiple-chip semiconductor device can effectively dissipate the heat producing in the power semiconductor chip.
    Type: Grant
    Filed: March 21, 1994
    Date of Patent: August 1, 1995
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Tomohide Tagawa, Takashi Takahashi, Takayoshi Kawasaki
  • Patent number: 5313095
    Abstract: A multiple-chip semiconductor device of the present invention comprises a first and a second leadframes. The same package envelops a power semiconductor chip mounted on a power chip mounting area in the first leadframe and a control chip mounted on a control chip mounting area in the second leadframe. In the device, the second leadframe is made of metal material which is processed easier than the first leadframe, and/or is finished thinner than the first leadframe. Thus, the multiple-chip semiconductor device can effectively dissipate the heat producing in the power semiconductor chip.
    Type: Grant
    Filed: January 29, 1993
    Date of Patent: May 17, 1994
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Tomohide Tagawa, Takashi Takahashi, Takayoshi Kawakami