Patents by Inventor Tomohide Wada

Tomohide Wada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6728097
    Abstract: In a fixing portion against which an end surface of a capacitor element abuts is provided on a portion of a cathode lead frame covered with a casing resin, the distance through which external oxygen moves to reach the capacitor element is increased by the distance of the fixing portion, whereby probability of oxidation is remarkably reduced, thus oxidation hardly occurs in the capacitor element. Further, since the capacitor element can be reliably positioned by bringing its end into abutment against the fixing portion, assembly accuracy is largely improved and the capacitor can be made compact with ease.
    Type: Grant
    Filed: March 18, 2003
    Date of Patent: April 27, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tomohide Wada, Katsuyuki Nakamura
  • Publication number: 20030174462
    Abstract: In a fixing portion against which an end surface of a capacitor element abuts is provided on a portion of a cathode lead frame covered with a casing resin, the distance through which external oxygen moves to reach the capacitor element is increased by the distance of the fixing portion, whereby probability of oxidation is remarkably reduced, thus oxidation hardly occurs in the capacitor element. Further, since the capacitor element can be reliably positioned by bringing its end into abutment against the fixing portion, assembly accuracy is largely improved and the capacitor can be made compact with ease.
    Type: Application
    Filed: March 18, 2003
    Publication date: September 18, 2003
    Applicant: MATSUSHITA ELEC. IND. CO. LTD.
    Inventors: Tomohide Wada, Katsuyuki Nakamura
  • Patent number: 6320742
    Abstract: The basic electric performance is same as or better than the prior art, and moreover occurrence of defective insulation due to the conductive high polymer layer reaching the anode lead-out part is prevented and occurrence of insulation breakdown is also prevented. Still more, the conventional productivity is not sacrificed. The solid electrolytic capacitor having such effects and its manufacturing method are obtained. It includes an anode electrode having a capacitor element part, forbidden band, and an anode lead-out part, a dielectric oxide layer disposed on the surface of the capacitor element part, a conductive high polymer layer disposed on the dielectric oxide layer, a conductor layer disposed on the conductive high polymer layer, an anode terminal electrically connected to the anode lead-out part, and a cathode terminal electrically connected to the conductor layer.
    Type: Grant
    Filed: February 16, 2000
    Date of Patent: November 20, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tomohide Wada, Hiroshi Shimada, Yasuhiro Kobatake
  • Patent number: 6229687
    Abstract: A solid electrolytic capacitor of the present invention is produced by connecting a solid electrolytic capacitor element with a lead frame after plating the lead frame with copper and then roughening the surface thereof, and then by molding the solid electrolytic capacitor element and lead frame with an encapsulating resin possessing a thermal expansion coefficient that is near the thermal expansion coefficient of the lead frame. The solid electrolytic capacitor thus produced shows excellent solderability and can withstand a thermal shock encountered at the time of soldering when the solid electrolytic capacitor is mounted on a circuit board. Accordingly, a solid electrolytic capacitor that ensures excellent reliability after being mounted on a circuit board is obtained.
    Type: Grant
    Filed: May 26, 1999
    Date of Patent: May 8, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tomohide Wada, Kenji Kuranuki