Patents by Inventor Tomohide Yokozawa

Tomohide Yokozawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10225923
    Abstract: Disclosed herein is an electronic circuit module that includes a substrate having a power supply pattern, an electronic component mounted on a front surface of the substrate, a molding resin that covers the front surface of the substrate so as to embed the electronic component therein, a metal shield covering the molding resin, and a through conductor formed so as to penetrate through the molding resin to connect the metal shield to the power supply pattern.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: March 5, 2019
    Assignee: TDK CORPORATION
    Inventors: Yoshihiro Suzuki, Tomohide Yokozawa, Michitaka Okazaki, Takuro Aoki, Masashi Katsumata
  • Publication number: 20170295643
    Abstract: Disclosed herein is an electronic circuit module that includes a substrate having a power supply pattern, an electronic component mounted on a front surface of the substrate, a molding resin that covers the front surface of the substrate so as to embed the electronic component therein, a metal shield covering the molding resin, and a through conductor formed so as to penetrate through the molding resin to connect the metal shield to the power supply pattern.
    Type: Application
    Filed: April 4, 2017
    Publication date: October 12, 2017
    Applicant: TDK Corporation
    Inventors: Yoshihiro SUZUKI, Tomohide Yokozawa, Michitaka Okazaki, Takuro Aoki, Masashi Katsumata
  • Patent number: 7569332
    Abstract: A processing method of a thin-film includes a step of forming a predetermined pattern film or predetermined elements on a substrate or on a film formed in an upstream process, a step of forming a transparent film over the formed predetermined pattern film or predetermined elements, a step of forming a pattern-transferred film having shapes corresponding to shapes of the formed predetermined pattern film or predetermined elements, on the formed transparent film, and a step of forming an opaque film on the pattern-transferred film.
    Type: Grant
    Filed: February 25, 2005
    Date of Patent: August 4, 2009
    Assignees: TDK Corporation, SAE Magnetics (H.K.) Ltd.
    Inventors: Mitsuharu Isobe, Hiromichi Umehara, Hirotaka Gomi, Tomohide Yokozawa
  • Publication number: 20050233260
    Abstract: A processing method of a thin-film includes a step of forming a predetermined pattern film or predetermined elements on a substrate or on a film formed in an upstream process, a step of forming a transparent film over the formed predetermined pattern film or predetermined elements, a step of forming a pattern-transferred film having shapes corresponding to shapes of the formed predetermined pattern film or predetermined elements, on the formed transparent film, and a step of forming an opaque film on the pattern-transferred film.
    Type: Application
    Filed: February 25, 2005
    Publication date: October 20, 2005
    Applicants: TDK Corporation, SAE Magnetics (H.K.) Ltd.
    Inventors: Mitsuharu Isobe, Hiromichi Umehara, Hirotaka Gomi, Tomohide Yokozawa