Abstract: Provided is a fluorescence detection device with high light use efficiency. The fluorescence detection device according to the present technology detects fluorescence of the test object, the fluorescence being generated by irradiation with excitation light. The fluorescence detection device includes: a micro-well array layer having, on an upper surface, micro-wells in a two-dimensional array shape capable of accommodating the test object; a first detection mechanism provided, below the micro-well array layer, corresponding to each of the micro-wells; and a solid-state imaging element provided, below the first detection mechanism, corresponding to each of the first detection mechanisms, in which the first detection mechanism includes a first microlens group having positive power.

Abstract: There is provided a solid-state imaging apparatus that allows to suitably dispose a translucent member on a substrate including a photoelectric conversion portion. The solid-state imaging apparatus of the present disclosure has: a substrate that includes a photoelectric conversion portion; a lens that is disposed on the substrate; and a translucent member that is disposed on the lens. The translucent member includes a plurality of protruded portions that are disposed in a two-dimensional array form on an upper surface of the translucent member.

Abstract: A dam region that blocks an outflow of a resin from a chip mounting region suppresses an influence of incident light. A solid-state imaging element is provided with a pixel region in which a plurality of pixels is arranged, and a chip mounting region in which a chip is mounted. Furthermore, a dam region that blocks an outflow of a resin from the chip mounting region is arranged around the chip mounting region. Furthermore, the dam region has a saw-tooth shape toward an outer side at least partially. Furthermore, incident light is repeatedly reflected by the saw-tooth shape of the dam region to be absorbed and attenuated.

Abstract: A light receiving device and an electronic device capable of achieving a preferable structure in a case where a pinhole is arranged between a photodetector and a microlens are provided. A light receiving device of the present disclosure includes a substrate including a photodetector, an optical system provided above the photodetector, and a first light shielding layer provided between the photodetector and the optical system and having a first opening, in which the optical system includes a microlens having a shape concave toward a side of a subject.

Abstract: In a lens based on one-group configuration, performance is improved, and a wide angle and a low height are achieved. An imaging lens includes first to third lenses. These first to third lenses are sequentially arranged from an object side to an image surface side without sandwiching air. Each surface of the first to third lenses has an aspherical shape. An imaging element is arranged on the image surface side of the imaging lens. A cover glass is attached on an imaging surface of the imaging element without an air gap. Another lens may be arranged between the imaging lens and the imaging element.

Abstract: A solid-state imaging device includes a substrate on which a plurality of photoelectric conversion units has been formed, a groove portion provided on a side of a light-receiving surface of the substrate, and recessed and projecting portions provided on a side wall surface of the groove portion facing a side of the plurality of photoelectric conversion units.

Abstract: Provided is an electronic device that includes a plurality of pixels, each of at least two pixels of the plurality of pixels includes a first lens that collects incident light, a first light shielding film portion having a first hole through which a part of the incident light that has been collected passes, and a photoelectric conversion unit that converts the incident light having passed through the first hole. A shape of the first hole with respect to the first light shielding film portion is different between a first pixel among the at least two pixels and a second pixel different from the first pixel among the at least two pixels.

Abstract: Miniaturization is facilitated in a semiconductor package provided with pixels. A semiconductor package includes a transparent member, a semiconductor chip, a photosensitive rib, and an interposer. In this semiconductor package, pixels are arranged on a part of a chip plane of the semiconductor chip. The photosensitive rib is a photosensitive resin disposed between a region not corresponding to the pixel in the chip plane of the semiconductor chip and the transparent member. Furthermore, the interposer is electrically connected to the semiconductor chip.

Abstract: Provided are an imaging device capable of obtaining a high-quality image with high light utilization efficiency, and an electronic apparatus using the imaging device. An imaging device according to the present disclosure includes at least one pixel, in which the pixel includes a lens unit that condenses incident light, a phase modulation unit that modulates a phase of some light passed through the lens unit, a light-shielding unit including a pinhole that lets light of which phase is modulated in the phase modulation unit and light of which phase is not modulated pass through, and an imaging element that images light passed through the pinhole.

Abstract: The present disclosure relates to a light receiving apparatus and an electronic appliance that enable achievement of more preferable image quality. A light receiving apparatus includes: a semiconductor substrate including a first photodetector and a second photodetector arranged within at least substantially a same light receiving plane; and an optical member including at least a first optical system that allows light to enter the first photodetector and a second optical system that allows light to enter the second photodetector. In addition, a first pixel of an image formed at the first photodetector with the light entering the first photodetector through the first optical system is different in orientation of a principal ray on an object side from a second pixel of an image formed at the second photodetector with the light entering the second photodetector through the second optical system. The present technology is applicable to, for example, various authentication devices.

Abstract: Usability in authentication or the like using a light receiving sensor is improved. An electronic device includes a first sensor and a second sensor. The first sensor includes a constantly driven optical sensor. When the first sensor detects a predetermined environmental change, the second sensor is driven as an authentication mode and shifts to a mode for acquiring information of the authentication target.

Abstract: There is provided a solid-state imaging apparatus that allows to suitably dispose a translucent member on a substrate including a photoelectric conversion portion. The solid-state imaging apparatus of the present disclosure has: a substrate that includes a photoelectric conversion portion; a lens that is disposed on the substrate; and a translucent member that is disposed on the lens. The translucent member includes a plurality of protruded portions that are disposed in a two-dimensional array form on an upper surface of the translucent member.

Abstract: A plurality of subpixels is included in one pixel. An imaging device includes a subpixel, a pixel, and a pixel array. The subpixel includes a photoelectric conversion element that receives light incident at a predetermined angle and outputs an analog signal on the basis of intensity of the received light. The pixel includes a plurality of the subpixels, a lens that condenses light incident from an outside on the subpixel, and a photoelectric conversion element isolation portion that does not propagate information regarding intensity of the light acquired in the photoelectric conversion element to the adjacent photoelectric conversion element, and further includes a light-shielding wall that shields light incident on the lens of another pixel. The pixel array includes a plurality of the pixels.

Abstract: To provide an electronic device capable of suppressing a decrease in resolution when the distance between an object to be imaged and an imaging unit is decreased. This electronic device includes a plurality of pixels, each of at least two pixels of the plurality of pixels including: a first lens that collects incident light; a first light shielding film portion having a first hole through which a part of the incident light that has been collected passes; and a photoelectric conversion unit configured to photoelectrically convert the incident light having passed through the first hole. The shape of the first hole with respect to the first light shielding film portion is different between a first pixel among the at least two pixels and a second pixel different from the first pixel among the at least two pixels.

Abstract: A valve includes: a valve case; and an annular valve body, one of the inner circumference end and the outer circumference end of the valve body being formed as the free end capable of moving towards both sides in the axial direction with respect to the valve case. The valve case has the annular opposing surface capable of opposing to the free end so as to form the gap therebetween, and the guide surface that is positioned on one side of the opposing surface in the axial direction, the guide surface being continuous with the part of the opposing surface in the circumferential direction. The guide surface is inclined in the direction away from the valve body as the distance from the opposing surface is increased.

Abstract: A dam region that blocks an outflow of a resin from a chip mounting region suppresses an influence of incident light. A solid-state imaging element is provided with a pixel region in which a plurality of pixels is arranged, and a chip mounting region in which a chip is mounted. Furthermore, a dam region that blocks an outflow of a resin from the chip mounting region is arranged around the chip mounting region. Furthermore, the dam region has a saw-tooth shape toward an outer side at least partially. Furthermore, incident light is repeatedly reflected by the saw-tooth shape of the dam region to be absorbed and attenuated.

Abstract: In a lens based on one-group configuration, performance is improved, and a wide angle and a low height are achieved. An imaging lens includes first to third lenses. These first to third lenses are sequentially arranged from an object side to an image surface side without sandwiching air. Each surface of the first to third lenses has an aspherical shape. An imaging element is arranged on the image surface side of the imaging lens. A cover glass is attached on an imaging surface of the imaging element without an air gap. Another lens may be arranged between the imaging lens and the imaging element.

Abstract: A solid-state imaging apparatus and an electronic device that are capable of improving a use efficiency of incident light while avoiding overlap of incident light among adjacent solid-state imaging devices are provided. A solid-state imaging apparatus that includes plural pixels arranged in a matrix shape on an imaging device surface, and each of the pixels includes at least one solid-state imaging device; and at least one light guiding unit that is arranged on a subject side of the solid-state imaging device, and the light guiding unit includes a first transparent body; a first lens group having a positive optical power; a light shielding unit having an opening portion; and a second lens group having a positive optical power, sequentially toward a solid-state imaging device side from the subject side along a light guiding direction of the light guiding unit is provided.

Abstract: It includes: a substrate on which a plurality of photoelectric conversion units has been formed; a groove portion provided on a side of a light-receiving surface of the substrate; and recessed and projecting portions provided on a side wall surface of the groove portion facing a side of the plurality of photoelectric conversion units.

Abstract: The maximum principal ray incident angle to an image surface is reduced in an image pickup device provided with an image pickup element. The image pickup device includes an image pickup lens, the image pickup element, and a cover glass. In the image pickup device, the cover glass is stuck on the image pickup element without containing air between them. In addition, in the image pickup device, the maximum incident angle of principal rays from the image pickup lens, to the cover glass is larger than 35 degrees. Furthermore, in the image pickup device, the refractive angle of the cover glass is at least 5 degrees smaller than the maximum incident angle.