Patents by Inventor Tomohiko Hara

Tomohiko Hara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
    Publication number: 20240170512
    Abstract: Miniaturization is facilitated in a semiconductor package provided with pixels. A semiconductor package includes a transparent member, a semiconductor chip, a photosensitive rib, and an interposer. In this semiconductor package, pixels are arranged on a part of a chip plane of the semiconductor chip. The photosensitive rib is a photosensitive resin disposed between a region not corresponding to the pixel in the chip plane of the semiconductor chip and the transparent member. Furthermore, the interposer is electrically connected to the semiconductor chip.
    Type: Application
    Filed: December 28, 2021
    Publication date: May 23, 2024
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Shunsaku HANAOKA, Takuya NAKAMURA, Shumpei AOKI, Yukihide KEIGO, Eiichirou KISHIDA, Ayaka SEKI, Yuji HARA, Seigi ONO, Junki KOMORI, Takayuki TANAKA, Tomohiko BABA
  • Refractories for use in firing ceramics
    Patent number: 5244727
    Abstract: A refractory for use in firing ceramics has a ceramic coating applied by plasma spraying onto the surface of a heat-resistant lightweight shaped article containing heat-resistant lightweight shaped article containing heat-resistant inorganic fibers. The shaped article is composed of highly aluminous short fibers not longer than 2,000 .mu.m or a mixture thereof with an aluminous refractory powder as bound to each other by means of aluminous binder, the shaped article not containing free silica.
    Type: Grant
    Filed: April 29, 1992
    Date of Patent: September 14, 1993
    Assignee: Nichias Corporation
    Inventors: Kenichi Shibata, Kohichi Kimura, Tomohiko Hara, Tatsuo Takagi, Yoshihiro Goto
  • Lightweight refractory and process for producing the same
    Patent number: 4849382
    Abstract: A lightweight refractory is disclosed which is a shaped porous body having refractory particles and aluminous short fibers bound to each other with mullite. The crtystalline structure of the refractory is chiefly composed of mullite and corundum. The mullite content is at least 12 mol % of the sum of mullite and corundum. The refractory is substantially free of free silica.
    Type: Grant
    Filed: February 18, 1988
    Date of Patent: July 18, 1989
    Assignee: Nichias Corporation
    Inventors: Kenichi Shibata, Kouichi Kimura, Tomohiko Hara, Tatsuo Takagi